Patents by Inventor Mitch A. Aigner

Mitch A. Aigner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular test chip for multi chip module
    Patent number: 6064219
    Abstract: A multi chip module with a substrate having a network of a plurality of electrical interconnects and a number of electronic components mounted to the substrate and connected to the network. A monolithic test chip having a number of identical functional regions is mounted to the substrate and electrically connected to the network. Each functional region on the test chip is independently connected to the substrate and is electrically isolated from the others. The chip may be produced by preparing wafers with a grid of identical functional elements, and cutting up the wafers into chips of different sizes, depending on the application.
    Type: Grant
    Filed: February 5, 1997
    Date of Patent: May 16, 2000
    Assignee: Tektronix, Inc.
    Inventor: Mitch A. Aigner