Abstract: A method for packaging integrated circuits for surface mount which provides advantages over prior art techniques by providing increased strength to integrated circuit package leads for increased lead dimensional stability to accommodate the finer pitches needed for high density integrated circuits, i.e., with leadcounts of 200 or more leads. The method is for producing a plastic integrated circuit package that allows for transfer molding using a non-conductive, permanent dambar. The invention includes the resulting leadframe. The method produces a package having embedded leads (on both sides and in between) in a double sided film/adhesive combination which increases lead dimensional stability and which does not require removal before device mounting. The double sided film/adhesive combination is non-conductive, is able to withstand all the package assembly process steps and is applied before a die is dedicated to a leadframe.