Abstract: An electronic assembly including: a circuit substrate comprising an integrated circuit and having a first surface; and a heat removal substrate comprising a fluid path arranged for circulating a flow of cooling fluid between a fluid input and a fluid output, the heat removal substrate having a second surface attached to the first surface, wherein the fluid path includes a cavity having cavity walls, wherein a first portion of the cavity walls comprises a first portion of the first surface and a second portion of the cavity walls comprises a first portion of the second surface; and wherein the second surface is attached to the first surface by a cold weld compression seal that sealingly attaches the first portion of the first surface to the first portion of the second surface along a closed boundary; said compression seal along that closed boundary forming a third portion of the cavity walls.

Abstract: A micro-vacuum cell comprising at least one vacuum enclosure, the vacuum enclosure comprising at least a lid of a first material, the first material having a first coefficient of thermal expansion; a base of a second material, the second material having a second coefficient of thermal expansion, where the vacuum enclosure is formed above a portion of the base; and a cold weld compression seal attaching the lid to the base along a periphery of said portion of the base; wherein one of the first and second coefficients of thermal expansion is at least five times larger than the other of the first and second coefficients of thermal expansion; and wherein the pressure in the vacuum enclosure is smaller than an atmosphere.