Patents by Inventor Mitchell Edward Lee

Mitchell Edward Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9634480
    Abstract: A circuit for protecting a semiconductor element is provided in a system for supplying power from an input node to an output node. The circuit has an analog multiplier responsive to a voltage across the semiconductor element and a current flowing through the semiconductor element to produce an output voltage. A transconductance amplifier is coupled to an output of the analog multiplier for receiving the output voltage of the analog multiplier to produce an output current. An analog RC circuit coupled to the output of the transconductance amplifier is configurable to include a selected number of resistive elements having selected resistance values and a selected number of capacitive elements having selected capacitance values. The configuration of the RC circuit is carried out to provide an RC thermal model that reproduces a desired thermal behavior of the semiconductor element.
    Type: Grant
    Filed: September 15, 2014
    Date of Patent: April 25, 2017
    Assignee: LINEAR TECHNOLOGY CORPORATION
    Inventors: Daniel James Eddleman, Mitchell Edward Lee, Zhizhong Hou
  • Patent number: 9634481
    Abstract: A circuit for protecting a semiconductor element is provided in a system for supplying power from an input node to an output node. The circuit has an analog multiplier responsive to a voltage across the semiconductor element and a current flowing through the semiconductor element to produce an output voltage. A transconductance amplifier is coupled to an output of the analog multiplier for receiving the output voltage of the analog multiplier to produce an output current. An analog RC circuit coupled to the output of the transconductance amplifier is configurable to include a selected number of resistive elements having selected resistance values and a selected number of capacitive elements having selected capacitance values. The configuration of the RC circuit is carried out to provide an RC thermal model that reproduces a desired thermal behavior of the semiconductor element.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: April 25, 2017
    Assignee: LINEAR TECHNOLOGY CORPORATION
    Inventors: Daniel James Eddleman, Mitchell Edward Lee, Zhizhong Hou
  • Publication number: 20160218501
    Abstract: A circuit for protecting a semiconductor element is provided in a system for supplying power from an input node to an output node. The circuit has an analog multiplier responsive to a voltage across the semiconductor element and a current flowing through the semiconductor element to produce an output voltage. A transconductance amplifier is coupled to an output of the analog multiplier for receiving the output voltage of the analog multiplier to produce an output current. An analog RC circuit coupled to the output of the transconductance amplifier is configurable to include a selected number of resistive elements having selected resistance values and a selected number of capacitive elements having selected capacitance values. The configuration of the RC circuit is carried out to provide an RC thermal model that reproduces a desired thermal behavior of the semiconductor element.
    Type: Application
    Filed: April 1, 2016
    Publication date: July 28, 2016
    Inventors: Daniel James EDDLEMAN, Mitchell Edward LEE, Zhizhong HOU
  • Patent number: 8853885
    Abstract: An apparatus and method for load sharing among N current supplies, where N>1. N current supply paths are coupled to corresponding N independent power sources, respectively. A system load is coupled to the outputs of the N current supply paths to receive N current supplies. There is a common current share bus configured to connect to the N current supply paths to provide a common current share signal, used to indicate the current contribution needed from each of the N current supply paths. In this configuration, each of the N current supply paths adjusts an adjustable voltage drop between its power source and the current supply it provides to the system load in accordance with the common current share signal so that the current supplied from each current supply path is consistent with the common current share signal.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: October 7, 2014
    Assignee: Linear Technology Corporation
    Inventors: Christopher Bruce Umminger, David Henry Soo, Mitchell Edward Lee, Pinkesh Sachdev, Zhipeng Li
  • Publication number: 20100164289
    Abstract: An apparatus and method for load sharing among N current supplies, where N>1. N current supply paths are coupled to corresponding N independent power sources, respectively. A system load is coupled to the outputs of the N current supply paths to receive N current supplies. There is a common current share bus configured to connect to the N current supply paths to provide a common current share signal, used to indicate the current contribution needed from each of the N current supply paths. In this configuration, each of the N current supply paths adjusts an adjustable voltage drop between its power source and the current supply it provides to the system load in accordance with the common current share signal so that the current supplied from each current supply path is consistent with the common current share signal.
    Type: Application
    Filed: December 22, 2009
    Publication date: July 1, 2010
    Inventors: Christopher Bruce UMMINGER, David Henry Soo, Mitchell Edward Lee, Pinkesh Sachdev, Zhipeng Li