Abstract: For a printed circuit board assembly (“PCBA”) selected electronic components are highlighted on a graphic representation of the PCBA on a display of a computer system. The components are selected responsive to temperature and time limits of the selected components. Ones of the highlighted components are associated to respective temperature sensors on the PCBA. Responsive to where the one or more additional ones of the highlighted components are located on the PCBA relative to the at least one of the respective temperature sensors, one or more additional ones of the highlighted components are associated with at least one of the respective temperature sensors. The computer system receives data for respective signals indicating temperatures encountered by the respective temperature sensors when the PCBA is heated in a manufacturing process. The computer system shows whether any of the time and temperature limits were exceeded during the manufacturing process.

Abstract: For a printed circuit board assembly (“PCBA”) selected electronic components are highlighted on a graphic representation of the PCBA on a display of a computer system. The components are selected responsive to temperature and time limits of the selected components. Ones of the highlighted components are associated to respective temperature sensors on the PCBA. Responsive to where the one or more additional ones of the highlighted components are located on the PCBA relative to the at least one of the respective temperature sensors, one or more additional ones of the highlighted components are associated with at least one of the respective temperature sensors. The computer system receives data for respective signals indicating temperatures encountered by the respective temperature sensors when the PCBA is heated in a manufacturing process. The computer system shows whether any of the time and temperature limits were exceeded during the manufacturing process.

Abstract: A method for printed circuit board design of temperature sensitive components includes a scrub tool receiving a list of part numbers for electronic components of a printed circuit board assembly (“PCBA”). The scrub tool sends one or more queries for finding temperature and time limits of the electronic components to a database. A mapping tool receives a selection of one or more part numbers responsive to the one or more queries, wherein the selection is responsive to the temperature and time limits. The mapping tool sends a data structure to a physical design tool which is configured with physical design data for generating a graphic representation of the PCBA. The data structure from the mapping tool provides the received selection of one or more part numbers and configures the physical design tool to highlight components having part numbers of the selection on the PCBA graphic representation.

Abstract: A method for printed circuit board design of temperature sensitive components includes a scrub tool receiving a list of part numbers for electronic components of a printed circuit board assembly (“PCBA”). The scrub tool sends one or more queries for finding temperature and time limits of the electronic components to a database. A mapping tool receives a selection of one or more part numbers responsive to the one or more queries, wherein the selection is responsive to the temperature and time limits. The mapping tool sends a data structure to a physical design tool which is configured with physical design data for generating a graphic representation of the PCBA. The data structure from the mapping tool provides the received selection of one or more part numbers and configures the physical design tool to highlight components having part numbers of the selection on the PCBA graphic representation.

Abstract: A printed circuit board is fabricated so contacts for tight-pitch components are at an angle with respect to the bundles of glass fibers in the epoxy-glass printed circuit board such that adjacent component contacts do not contact the same bundle of glass fibers. This angle may be accomplished by manufacturing a printed circuit board panel with the glass fibers at an angle with respect to its edges. This angle may also be accomplished by placing parts on a printed circuit board panel that has a traditional X-Y orthogonal weave of glass fiber bundles at an angle with respect to the edges of the panel. This angle may also be accomplished by starting with a traditional panel that has an X-Y orthogonal weave, laying out parts on the panel along the X-Y weave, then placing components on the parts at an angle with respect to the edges of the parts.

Abstract: An apparatus is provided and includes a substrate, a connector, including discrete elements, each discrete element having a first end tied to a compliant spine and an opposite second end including a lead and a fastener, which is disposable to extend through the substrate and into the connector, the fastener and the connector being configured such that mechanical interference therebetween caused by fastener operation urges the connector toward the substrate to advance each of the leads toward respective solder positions in a common plane.

Abstract: An LGA structure is provided having at least one semiconductor device over a substrate and a mechanical load apparatus over the semiconductor device. The structure includes a load-distributing material between the mechanical load apparatus and the substrate. Specifically, the load-distributing material is proximate a first side of the semiconductor device and a second side of the semiconductor device opposite the first side of the semiconductor device. Furthermore, the load-distributing material completely surrounds the semiconductor device and contacts the mechanical load apparatus, the substrate, and the semiconductor device. The load-distributing material can be thermally conductive and comprises an elastomer and/or a liquid. The load-distributing material comprises a LGA interposer adapted to connect the substrate to a PCB below the substrate and/or a second substrate. Moreover, the load-distributing material comprises compressible material layers and rigid material layers.

Abstract: A printed circuit board is fabricated so contacts for tight-pitch components are at an angle with respect to the bundles of glass fibers in the epoxy-glass printed circuit board such that adjacent component contacts do not contact the same bundle of glass fibers. This angle may be accomplished by manufacturing a printed circuit board panel with the glass fibers at an angle with respect to its edges. This angle may also be accomplished by placing parts on a printed circuit board panel that has a traditional X-Y orthogonal weave of glass fiber bundles at an angle with respect to the edges of the panel. This angle may also be accomplished by starting with a traditional panel that has an X-Y orthogonal weave, laying out parts on the panel along the X-Y weave, then placing components on the parts at an angle with respect to the edges of the parts.

Abstract: An LGA structure is provided having at least one semiconductor device over a substrate and a mechanical load apparatus over the semiconductor device. The structure includes a load-distributing material between the mechanical load apparatus and the substrate. Specifically, the load-distributing material is proximate a first side of the semiconductor device and a second side of the semiconductor device opposite the first side of the semiconductor device. Furthermore, the load-distributing material completely surrounds the semiconductor device and contacts the mechanical load apparatus, the substrate, and the semiconductor device. The load-distributing material can be thermally conductive and comprises an elastomer and/or a liquid. The load-distributing material comprises a LGA interposer adapted to connect the substrate to a PCB below the substrate and/or a second substrate. Moreover, the load-distributing material comprises compressible material layers and rigid material layers.

Abstract: A printed circuit board is fabricated so contacts for tight-pitch components are at an angle with respect to the bundles of glass fibers in the epoxy-glass printed circuit board such that adjacent component contacts do not contact the same bundle of glass fibers. This angle may be accomplished by manufacturing a printed circuit board panel with the glass fibers at an angle with respect to its edges. This angle may also be accomplished by placing parts on a printed circuit board panel that has a traditional X-Y orthogonal weave of glass fiber bundles at an angle with respect to the edges of the panel. This angle may also be accomplished by starting with a traditional panel that has an X-Y orthogonal weave, laying out parts on the panel along the X-Y weave, then placing components on the parts at an angle with respect to the edges of the parts.

Abstract: A printed circuit board is fabricated so contacts for tight-pitch components are at an angle with respect to the bundles of glass fibers in the epoxy-glass printed circuit board such that adjacent component contacts do not contact the same bundle of glass fibers. This angle may be accomplished by manufacturing a printed circuit board panel with the glass fibers at an angle with respect to its edges. This angle may also be accomplished by placing parts on a printed circuit board panel that has a traditional X-Y orthogonal weave of glass fiber bundles at an angle with respect to the edges of the panel. This angle may also be accomplished by starting with a traditional panel that has an X-Y orthogonal weave, laying out parts on the panel along the X-Y weave, then placing components on the parts at an angle with respect to the edges of the parts.

Abstract: A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.

Abstract: A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.

Abstract: Disclosed is a semiconductor package structure that incorporates the use of conductive pins to electrically and mechanically connect a semiconductor module and a substrate (e.g., printed wiring board). Specifically, one or both ends of the pins are hooked and are adapted to allow a press-fit connection with the walls of the plated through holes of either one or both of the semiconductor module and the substrate. The hook-shaped ends of the pins may have one or more hooks to establish the connection. Additionally, the pins may be formed of a temperature induced shape change material that bends to allow engaging and/or disengaging of the hook-shaped ends from the walls of the plated through holes.

Abstract: A multi-layer printed circuit board including at least one layer of an electrically conducting material and at least one layer of an electrically insulating material. At least one through hole formed at least through the at least one layer of electrically conducting material. The at least one through hole includes a material plated on an interior surface thereof. At least one thermal break is provided in the at least one layer of electrically conducting material, such that heat passing between the through hole and the at least one layer of electrically conducting material passes through the at least one thermal break. At least one electrical connection provided in the at least one layer of electrically conducting material between the material plated on the interior surface of the through hole and the at least one layer of electrically conducting material. At least a portion of the at least one electrical connection is between the through hole and the at least one thermal break.