Patents by Inventor Mitchell Hamamoto

Mitchell Hamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bond and redistribution layer process
    Publication number: 20070187765
    Abstract: A manufacturing method of a semiconductor device with a copper redistribution line, a copper inductor and aluminum wire bond pads and the integration of the resulting device with an integrated circuit on a single chip, resulting in the decreased size of the chip.
    Type: Application
    Filed: February 10, 2006
    Publication date: August 16, 2007
    Inventors: Mitchell Hamamoto, Yioao Chen, Kim Tan