Abstract: Described is a multi-chip module that may include a Redistribution Layer (RDL) substrate having Integrated Circuit (IC) dies mounted to a first surface of the RDL substrate. A second plurality of IC dies may be mounted to an opposite second surface. A plurality of sockets can be mounted upon the second plurality of IC dies and a cold plate then mounted to the first plurality of IC dies. The mounting structure may include socket frames coupled to the plurality of sockets.

Abstract: A system on a wafer (SoW) assembly is disclosed. The SoW assembly can include a first SoW assembly structure with a first coefficient of thermal expansion (CTE). The first SoW assembly structure includes first to third slots at different locations. The SoW assembly can include a second SoW assembly structure stacked on the first SoW assembly structure. The second SoW assembly structure has a second CTE different from the first CTE. The second SoW assembly structure has first to third pins extending therefrom and disposed in the first to third slots. The first and second slots shaped to allow the first and second pins to move along a first axis, and the third slot shaped to allow the third pin to move along a second axis. The first SoW assembly structure can be a SoW and the second SoW assembly structure can be a heat dissipation structure in certain applications.

Abstract: An electronic device may have a flexible display that overlaps an axis. The display may be supported by a housing. The housing may have first and second portions that rotate relative to each other about the axis. The housing may be placed in an unfolded configuration to support the display in a planar state. The housing may also be placed in a folded configuration by rotating the first and second portions relative to each other. A hinge mechanism may be used to ensure adequate separation between the first and second portions when the housing is bent. Movable flaps may be retracted when the housing is bent to create room for a bent portion of the display.

Abstract: An electronic device may have a flexible display that overlaps an axis. The display may be supported by a housing. The housing may have first and second portions that rotate relative to each other about the axis. The housing may be placed in an unfolded configuration to support the display in a planar state. The housing may also be placed in a folded configuration by rotating the first and second portions relative to each other. A hinge mechanism may be used to ensure adequate separation between the first and second portions when the housing is bent. Movable flaps may be retracted when the housing is bent to create room for a bent portion of the display.

Abstract: Described is a multi-chip module that may include a Redistribution Layer (RDL) substrate having Integrated Circuit (IC) dies mounted to a first surface of the RDL substrate. A second plurality of IC dies may be mounted to an opposite second surface. A plurality of sockets can be mounted upon the second plurality of IC dies and a cold plate then mounted to the first plurality of IC dies. The mounting structure may include socket frames coupled to the plurality of sockets.

Abstract: An electronic device may have a flexible display that overlaps an axis. The display may be supported by a housing. The housing may have first and second portions that rotate relative to each other about the axis. The housing may be placed in an unfolded configuration to support the display in a planar state. The housing may also be placed in a folded configuration by rotating the first and second portions relative to each other. A hinge mechanism may be used to ensure adequate separation between the first and second portions when the housing is bent. Movable flaps may be retracted when the housing is bent to create room for a bent portion of the display.

Abstract: An electronic device may have a flexible display that overlaps an axis. The display may be supported by a housing. The housing may have first and second portions that rotate relative to each other about the axis. The housing may be placed in an unfolded configuration to support the display in a planar state. The housing may also be placed in a folded configuration by rotating the first and second portions relative to each other. A hinge mechanism may be used to ensure adequate separation between the first and second portions when the housing is bent. Movable flaps may be retracted when the housing is bent to create room for a bent portion of the display.

Abstract: An electronic device includes an internal microphone that is located remotely from a microphone aperture formed in the enclosure of the electronic device. An acoustic chamber is formed within the electronic device to couple the microphone to the microphone aperture. The acoustic chamber is designed with a particular length to volume ratio that amplifies a particular range of frequencies such that the microphone maintains equal sensitivity to a desired frequency band.