Patents by Inventor Mitchell Holtzer

Mitchell Holtzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FLUX FORMULATIONS
    Publication number: 20100139952
    Abstract: Flux formulations that remain pliable after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers and the like.
    Type: Application
    Filed: July 2, 2009
    Publication date: June 10, 2010
    Inventors: Sanyogita Arora, Martinus N. Finke, Bawa Singh, Brian Lewis, Michael T. Marczi, Mitchell Holtzer
  • Solder preforms for use in electronic assembly
    Publication number: 20050184129
    Abstract: A solder preform for use to attach an electronic component to a substrate. The preform is for placement by a pick-and-place machine using a vacuum nozzle which picks the preform from a preform holder. Each of the sides of the preform configured to function as a vacuum side pick up surface has an enlarged planar surface area. Methods for forming such solder preforms are also disclosed.
    Type: Application
    Filed: December 15, 2004
    Publication date: August 25, 2005
    Applicant: Fry's Metals, Inc.
    Inventors: Paul Godijn, Wim Veldhuizen, Patrick Lusse, Mitchell Holtzer, Rob Ekeren, Martin Haan