Abstract: Retrofit systems and methods are disclosed for lighting installations, and in particular, to retrofit systems and methods used to retrofit troffer-style lighting installations with LED light sources. Retrofit systems can be used with different light fixtures, but those described are particularly adapted for use with troffer-style fixtures. These retrofit systems can provide the same amount of light as traditional light fixtures already do, for example 1600-4000 lumens or more. The retrofit systems can be used with many different light sources but are particularly well-suited for use with solid state light sources or light engines, such as those utilizing LEDs. Some embodiments of the present invention comprise a mechanical mounting system for installing an LED light engine within an existing lighting system housing or pan, such as a troffer pan, without penetrating the ceiling plenum.

Abstract: A carrier tape includes a longitudinal strip having a plurality of component receiving pockets positioned therein. The pocket depth is greater than a thickness of the longitudinal strip. Adjacent pockets are spaced apart by a distance less than approximately five times the thickness of the longitudinal strip. Sidewalls separating adjacent pockets have a height greater than the pocket depth minus a height of a component which the pockets are configured to receive. The carrier tape is produced by providing a rotatable tool and a nip roll having a conformable outer circumferential surface opposed to the tool. The outer circumferential surface of the tool includes projections for forming the pockets. A polymer web is introduced into a nip between the tool and the nip roll, and embossed with the projections on the circumferential surface of the tool.

Abstract: Photocurable compositions and process for providing form-in-place gaskets using automated placement followed by photocuring of a pattern of a non-silicone composition comprising a liquid polyolefin oligomer, a reactive diluent, and a curative. The form-in-place gasket, after curing, has a level of total outgassing components of about 10 &mgr;g/g to about 45 &mgr;g/g. The curative responds to actinic radiation and heat, and may contain a photoinitiator. Optionally a photocurable, form-in-place gasket according to the present invention further comprises a thixotropic filler in an amount from about 8.0 wt. % to about 12.0 wt. %, and preferably comprises a fumed silica.

Abstract: Photocurable compositions and process for providing form-in-place gaskets using automated placement followed by photocuring of a pattern of a non-silicone composition comprising a liquid polyolefin oligomer, a reactive diluent, and a curative. The form-in-place gasket, after curing, has a level of total outgassing components of about 10 &mgr;g/g to about 45 &mgr;g/g. The curative responds to actinic radiation and heat, and may contain a photoinitiator. Optionally a photocurable, form-in-place gasket according to the present invention further comprises a thixotropic filler in an amount from about 8.0 wt. % to about 12.0 wt. %, and preferably comprises a fumed silica.

Abstract: A non-silicone, form-in-place gasket produced using automated placement followed by curing of a pattern of an extrudable thixotropic material comprising a liquid polyolefin oligomer a reactive diluent a thixotropic filler and a curative. The form-in-place gasket, after curing, has a compression set of about 7% to about 20%, a level of outgassing components of about 10 &mgr;g/g to about 45 &mgr;g/g and a Shore A hardness from about 45 to about 65.