Patents by Inventor Mitchell M. Hamamoto

Mitchell M. Hamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device having wire bond and redistribution layer
    Patent number: 8058712
    Abstract: A semiconductor device comprises a copper redistribution line, a copper inductor and aluminum wire bond pads and the integration of the resulting device with an integrated circuit on a single chip, resulting in the decreased size of the chip.
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: November 15, 2011
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Mitchell M. Hamamoto, Yi Gao Chen, Kim Hwee Tan
  • DEVICE HAVING WIRE BOND AND REDISTRIBUTION LAYER
    Publication number: 20110204495
    Abstract: A semiconductor device comprises a copper redistribution line, a copper inductor and aluminum wire bond pads and the integration of the resulting device with an integrated circuit on a single chip, resulting in the decreased size of the chip.
    Type: Application
    Filed: August 23, 2010
    Publication date: August 25, 2011
    Inventors: Mitchell M. Hamamoto, Yigao Chen, Kim Hwee Tan
  • Wire bond and redistribution layer process
    Patent number: 7781870
    Abstract: A semiconductor device comprises a copper redistribution line, a copper inductor and aluminum wire bond pads and the integration of the resulting device with an integrated circuit on a single chip, resulting in the decreased size of the chip.
    Type: Grant
    Filed: June 2, 2009
    Date of Patent: August 24, 2010
    Assignee: California Micro Devices
    Inventors: Mitchell M. Hamamoto, Chen Yi Gao, Tan Kim Hwee
  • WIRE BOND AND REDISTRIBUTION LAYER PROCESS
    Publication number: 20090236690
    Abstract: A semiconductor device comprises a copper redistribution line, a copper inductor and aluminum wire bond pads and the integration of the resulting device with an integrated circuit on a single chip, resulting in the decreased size of the chip.
    Type: Application
    Filed: June 2, 2009
    Publication date: September 24, 2009
    Applicant: California Micro Devices
    Inventors: Mitchell M. Hamamoto, Chen Yi Gao, Tan Kim Hwee
  • Wire bond and redistribution layer process
    Patent number: 7541251
    Abstract: A manufacturing method of a semiconductor device with a copper redistribution line, a copper inductor and aluminum wire bond pads and the integration of the resulting device with an integrated circuit on a single chip, resulting in the decreased size of the chip.
    Type: Grant
    Filed: February 10, 2006
    Date of Patent: June 2, 2009
    Assignee: California Micro Devices
    Inventors: Mitchell M. Hamamoto, Yioao Chen, Kim Hwee Tan