Abstract: An integrated retractable guidance assembly for guiding insertion of a pluggable optical module into a pluggable optical module cage through an opening in a faceplate of a module, the guidance assembly including: a bullnose structure coupled to the faceplate; and one or more retractable arms extending from the bullnose structure and biased into the opening; where the one or more retractable arms are adapted to allow a rear portion of the pluggable optical module to pass into the pluggable optical module cage without being deflected towards the bullnose structure, but to be deflected towards the bullnose structure as a nose portion of the pluggable optical module passes into the pluggable optical module cage. The retractable arms are adapted to provide a user with tactile alignment feedback when the pluggable optical module is inserted into the pluggable optical module cage through the opening in the faceplate under limited visibility circumstances.

Abstract: A host module configured for insertion into a chassis of a network element includes a Printed Circuit Board (PCB); a plurality of rails disposed on the PCB, for housing one or more universal sub slot modules on the host module, wherein the plurality of rails are for guiding a universal sub slot module during insertion and for stabilization thereof; and a faceplate disposed to the PCB and including one or more openings each for the one or more universal sub slot modules, wherein the PCB communicates to each of the one or more universal sub slot modules via a plurality of high-speed links that are at least 28 Gbps each. At least one of the one or more universal sub slot modules can be a coherent modem or a router.

Abstract: A sprung frame assembly that can accommodate varying tolerance device heights while still exerting sufficient pressure/force required to a heatsink to contact and cool a bare die device, or other device of the like. Adapted for space constrained modules where placement of mounting holes is limited, and module density is high. Sprung frames are secured to mounting points at available locations on support structures as to eliminate any mounting holes in the PCB. The required force/pressure can be evenly achieved by methodically tightening a plurality of screws with springs at the corners of the sprung frames in sequence, pressure is applied evenly without damaging the device, while also taking up any tolerances in the device height.

Abstract: An optical system including: a faceplate including a receptacle adapted to receive a pluggable optical module; and one or more of: a thermal pad disposed adjacent to at least one interior side of the receptacle, wherein the thermal pad is adapted to be in thermal communication with the pluggable optical module when the pluggable optical module is received within the receptacle and conduct heat from a nose of the pluggable optical module to the faceplate; and a heat sink disposed at an interior side of the receptacle, wherein the heatsink is adapted to be in physical contact and thermal communication with the pluggable optical module when the pluggable optical module is received within the receptacle and conduct heat from the nose of the pluggable optical module to an air flow present behind the faceplate.

Abstract: Systems and methods for controlling airflow through a casing or shelf assembly are provided. An apparatus, according to one implementation, includes a mount plate configured to be attached to a side panel of a casing for housing network equipment. For example, the mount plate may include a window. The apparatus also includes one or more hinges arranged at an edge of the window of the mount plate and a baffle pivotably attached to the one or more hinges. The baffle can be arranged within a range of positions with respect to the mount plate to control an amount of airflow through the window. Within these range of positions, the baffle is configured to redirect the airflow in a front-to-back direction through the casing.

Abstract: A module for use in a hardware platform for networking, computing, or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side has greater vertical clearance than the secondary side; at least one component mounted on the secondary side, the at least one component being placed on the secondary side due to an increased complexity and component density on the printed circuit board assembly preventing its placement on the primary side; and a floating heatsink assembly disposed on the secondary side to dissipate heat from the at least one component, the floating heatsink assembly being biased against the at least one component by at least one resilient member arranged within a limited vertical space on the secondary side.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly; components disposed on a primary side of the printed circuit board assembly; a primary side heatsink for a pluggable module, wherein the primary side heatsink is disposed to one or more pivot points on the pluggable module, for applying a uniform and controlled external force against the pluggable module. The module further includes a cage attached to the printed circuit board assembly for supporting the pluggable module, wherein the one or more pivot points are external to the cage.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly; components disposed on a primary side of the printed circuit board assembly; a primary side heatsink for a pluggable module, wherein the primary side heatsink is disposed to one or more pivot points on the pluggable module, for applying a uniform and controlled external force against the pluggable module. The module further includes a cage attached to the printed circuit board assembly for supporting the pluggable module, wherein the one or more pivot points are external to the cage.

Abstract: A sprung frame assembly that can accommodate varying tolerance device heights while still exerting sufficient pressure/force required to a heatsink to contact and cool a bare die device, or other device of the like. Adapted for space constrained modules where placement of mounting holes is limited, and module density is high. Sprung frames are secured to mounting points at available locations on support structures as to eliminate any mounting holes in the PCB. The required force/pressure can be evenly achieved by methodically tightening a plurality of screws with springs at the corners of the sprung frames in sequence, pressure is applied evenly without damaging the device, while also taking up any tolerances in the device height.

Abstract: A universal sub slot module includes a Printed Circuit Board (PCB) including circuitry for power, a data plane, and a control plane; a faceplate connected to one end of the PCB and connectors connected to another end of the PCB, wherein the connectors are configured to connect to corresponding connectors in a host module; and a form factor containing the PCB and configured to interface a sub slot in the host module configured to operate in a chassis-based or rack mounted unit network element. The host module can include a plurality of sub slots, each being a port having one of the universal sub slot module and a filler module. The data plane can be configured to implement one of Optical Transport Network (OTN), Beyond 100G, Flexible Optical (FlexO), Ethernet, and Flexible Ethernet (FlexE).

Abstract: A sprung frame assembly that can accommodate varying tolerance device heights while still exerting sufficient pressure/force required to a heatsink to contact and cool a bare die device, or other device of the like. Adapted for space constrained modules where placement of mounting holes is limited, and module density is high. Sprung frames are secured to mounting points at available locations on support structures as to eliminate any mounting holes in the PCB. The required force/pressure can be evenly achieved by methodically tightening a plurality of screws with springs at the corners of the sprung frames in sequence, pressure is applied evenly without damaging the device, while also taking up any tolerances in the device height.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

Abstract: An optical fiber connector of a networking module faceplate assembly includes a shuttle body, a connection assembly, and a retention clip. The shuttle body including a fiber slot extending across the shuttle body and adapted for an optical fiber to extend therethrough. The connection assembly is adapted to connect the optical fiber of the networking module to an external optical fiber connector. The connection assembly includes a ferrule flange fiber termination, a split sleeve, and a ferrule. The ferrule flange fiber termination positioned within the shuttle body and adapted to splice to an end of the optical fiber. A length of the optical fiber connector can be less than half a length of the external optical fiber connector.

Abstract: An optical fiber connector of a networking module faceplate assembly includes a shuttle body, a connection assembly, and a retention clip. The shuttle body including a fiber slot extending across the shuttle body and adapted for an optical fiber to extend therethrough. The connection assembly is adapted to connect the optical fiber of the networking module to an external optical fiber connector. The connection assembly includes a ferrule flange fiber termination, a split sleeve, and a ferrule. The ferrule flange fiber termination positioned within the shuttle body and adapted to splice to an end of the optical fiber. A length of the optical fiber connector can be less than half a length of the external optical fiber connector.

Abstract: A universal sub slot module includes a Printed Circuit Board (PCB) including circuitry for power, a data plane, and a control plane; a faceplate connected to one end of the PCB and connectors connected to another end of the PCB, wherein the connectors are configured to connect to corresponding connectors in a host module; and a form factor containing the PCB and configured to interface a sub slot in the host module configured to operate in a chassis-based or rack mounted unit network element. The host module can include a plurality of sub slots, each being a port having one of the universal sub slot module and a filler module. The data plane can be configured to implement one of Optical Transport Network (OTN), Beyond 100G, Flexible Optical (FlexO), Ethernet, and Flexible Ethernet (FlexE).

Abstract: A universal sub slot module is configured to be inserted in a slot in a hardware module that is configured to be inserted in one of a chassis and rack mounted unit. The universal sub slot module includes a printed circuit board; an optics component on the printed circuit board; a data plane and a control plane on the printed circuit board and communicatively coupled to the optics components; and connectors on the printed circuit board and communicatively coupled to the data plane and the control plane, wherein the connectors are configured to connect to corresponding connectors in the one or more hardware modules.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

Abstract: A thermal control system for pluggable optics in an optical platform. The thermal control system includes a heatsink and an actuator. The heatsink is configured to dissipate heat from a pluggable optical module in the optical platform. The heatsink includes a mating surface configured to make thermal contact with a module surface of the pluggable optical module inserted into the optical platform. The actuator is configured to manipulate the mating surface to change a contact area between the mating surface and the module surface such that the contact area between the mating surface and the module surface is larger for a temperature above a predetermined temperature than for a temperature below a predetermined temperature.