Patents by Inventor Mitchell Ong

Mitchell Ong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and methods for forming wire bonds
    Patent number: 8444044
    Abstract: A wire bonding apparatus includes a processing block, a bond head assembly and an infrared radiation source for selectively heating the bond pad areas of one or more semiconductor dies and/or bonding sites on a substrate. Methods for forming wire bonds using selective heating of the bond pad areas of one or more semiconductor dies and/or bonding sites on the substrate are also disclosed.
    Type: Grant
    Filed: April 4, 2008
    Date of Patent: May 21, 2013
    Assignee: Micron Technology, Inc.
    Inventors: Low Peng Wang, Mitchell Ong, Lee Choon Kuan
  • APPARATUS AND METHODS FOR FORMING WIRE BONDS
    Publication number: 20090223937
    Abstract: A wire bonding apparatus includes a processing block, a bond head assembly and an infrared radiation source for selectively heating the bond pad areas of one or more semiconductor dies and/or bonding sites on a substrate. Methods for forming wire bonds using selective heating of the bond pad areas of one or more semiconductor dies and/or bonding sites on the substrate are also disclosed.
    Type: Application
    Filed: April 4, 2008
    Publication date: September 10, 2009
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Low Peng Wang, Mitchell Ong, Lee Choon Kuan