Abstract: Packaged microelectronic elements are provided. In an exemplary embodiment, a microelectronic element having a front face and a plurality of peripheral edges bounding the front face has a device region at the front face and a contact region with a plurality of exposed contacts adjacent to at least one of the peripheral edges. The packaged element may include a plurality of support walls overlying the front face of the microelectronic element such that a lid can be mounted to the support walls above the microelectronic element. For example, the lid may have an inner surface confronting the front face. In a particular embodiment, some of the contacts can be exposed beyond edges of the lid.

Abstract: The present invention is generally directed to methods and systems for distributing image capture devices, images, and prints. One embodiment of the present invention advantageously provides cameras, such as digital cameras or film cameras, to consumers for free or at a discounted cost. In exchange, the consumer makes a commitment that a certain number of image reproduction or prints will be purchased by the consumer and/or by others. In another embodiment, a user receives prints with associated advertisements attached at a reduced price.