Abstract: The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its movement, and a force applicator to apply a force to press the packaging caps and a substrate firmly together. Also disclosed is a process comprising inserting a plurality of packaging caps in a plurality of depressions on an alignment plate, each depression being sized to receive a packaging cap and prevent its movement, aligning the plurality of packaging caps with individual devices on a substrate, placing the substrate in contact with the packaging caps, and applying a force to press the caps against the substrate. Other embodiments are disclosed and claimed.

Abstract: A system and method is provided in which a radio frequency transmitter and/or a microwave frequency transmitter applies radio and/or microwave frequency energy, respectively, to an imprinted material to cure the imprinted material. In some embodiments, an oven may be used to apply thermal energy to the imprinted material in conjunction with the radio and/or microwave frequency energy to cure the imprinted material. In other embodiments, an oven is not used. The imprinted material may also include a susceptor that absorbs radio and/or microwave frequency energy and responsive thereto emits thermal energy to aid in curing the imprinted material. Further, at least one susceptor may be located externally and adjacent to the imprinted material. The external susceptor may absorb radio and/or microwave frequency energy, respectively, and responsive thereto emits thermal energy towards the imprinted material to aid in curing the imprinted material.

Abstract: The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its movement, and a force applicator to apply a force to press the packaging caps and a substrate firmly together. Also disclosed is a process comprising inserting a plurality of packaging caps in a plurality of depressions on an alignment plate, each depression being sized to receive a packaging cap and prevent its movement, aligning the plurality of packaging caps with individual devices on a substrate, placing the substrate in contact with the packaging caps, and applying a force to press the caps against the substrate. Other embodiments are disclosed and claimed.

Abstract: Numerous embodiments of an apparatus and method to stress and warpage of semiconductor packages are described. In one embodiment, a semiconductor die is disposed above a substrate. An encapsulating material is disposed above the substrate and semiconductor die, in which the encapsulating material has a combination of a low coefficient of thermal expansion material and a high coefficient of thermal expansion material.

Abstract: Numerous embodiments of an apparatus and method to stress and warpage of semiconductor packages are described. In one embodiment, a semiconductor die is disposed above a substrate. An encapsulating material is disposed above the substrate and semiconductor die, in which the encapsulating material has a combination of a low coefficient of thermal expansion material and a high coefficient of thermal expansion material.

Abstract: A system and method is provided in which a radio frequency transmitter and/or a microwave frequency transmitter applies radio and/or microwave frequency energy, respectively, to an imprinted material to cure the imprinted material. In some embodiments, an oven may be used to apply thermal energy to the imprinted material in conjunction with the radio and/or microwave frequency energy to cure the imprinted material. In other embodiments, an oven is not used. The imprinted material may also include a susceptor that absorbs radio and/or microwave frequency energy and responsive thereto emits thermal energy to aid in curing the imprinted material. Further, at least one susceptor may be located externally and adjacent to the imprinted material. The external susceptor may absorb radio and/or microwave frequency energy, respectively, and responsive thereto emits thermal energy towards the imprinted material to aid in curing the imprinted material.

Abstract: The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its movement, and a force applicator to apply a force to press the packaging caps and a substrate firmly together. Also disclosed is a process comprising inserting a plurality of packaging caps in a plurality of depressions on an alignment plate, each depression being sized to receive a packaging cap and prevent its movement, aligning the plurality of packaging caps with individual devices on a substrate, placing the substrate in contact with the packaging caps, and applying a force to press the caps against the substrate. Other embodiments are disclosed and claimed.