Abstract: Embodiments may include connectors with discharge elements integrated into the connectors to interconnect conductors of a cable to attenuate or discharge an electrostatic charge built up on the conductors. In some embodiments, the conductors are momentarily connected to ground as the connector couples with another connector to interconnect a cable with, e.g., a computer. The discharge elements interconnect the conductors of a cable to redistribute an electrostatic charge and thereby minimize the impact of a discharge when the cable couples with an electronic system such as a computer. Another embodiment comprises a male connector with discharge elements, which ground conductors of the cable as the cable is being inserted into the connector. The discharge elements are pushed out of the way of the conductors as the conductors couple with the connector.

Abstract: Embodiments may include connectors with discharge elements integrated into the connectors to interconnect conductors of a cable to attenuate or discharge an electrostatic charge built up on the conductors. In some embodiments, the conductors are momentarily connected to ground as the connector couples with another connector to interconnect a cable with, e.g., a computer. In further embodiments, the discharge elements interconnect the conductors of a cable to redistribute an electrostatic charge and thereby minimize the impact of a discharge when the cable couples with an electronic system such as a computer. Another embodiment comprises a male connector with discharge elements, which ground conductors of the cable as the cable is being inserted into the connector. The discharge elements are pushed out of the way of the conductors as the conductors couple with the connector.

Abstract: Methods and arrangements to methods and arrangements to attenuate electrostatic discharges of a cable are disclosed. Embodiments may include connectors with discharge elements integrated into the connectors to interconnect conductors of a cable to attenuate or discharge an electrostatic charge built up on the conductors. In some embodiments, the conductors are momentarily connected to ground as the connector couples with another connector to interconnect a cable with, e.g., a computer. In further embodiments, the discharge elements interconnect the conductors of a cable to redistribute an electrostatic charge and thereby minimize the impact of a discharge when the cable couples with an electronic system such as a computer. Another embodiment comprises a male connector with discharge elements, which ground conductors of the cable as the cable is being inserted into the connector. The discharge elements are pushed out of the way of the conductors as the conductors couple with the connector.

Abstract: Methods and arrangements to methods and arrangements to attenuate electrostatic discharges of a cable are disclosed. Embodiments may include connectors with discharge elements integrated into the connectors to interconnect conductors of a cable to attenuate or discharge an electrostatic charge built up on the conductors. In some embodiments, the conductors are momentarily connected to ground as the connector couples with another connector to interconnect a cable with, e.g., a computer. In further embodiments, the discharge elements interconnect the conductors of a cable to redistribute an electrostatic charge and thereby minimize the impact of a discharge when the cable couples with an electronic system such as a computer. Another embodiment comprises a male connector with discharge elements, which ground conductors of the cable as the cable is being inserted into the connector. The discharge elements are pushed out of the way of the conductors as the conductors couple with the connector.

Abstract: Methods and arrangements to adapt an electronic system to attenuate electrostatic discharges of a cable as the cable is connected with a connector on the electronic system are disclosed. Embodiments may include an adapter to couple with a connector of an electronic system. The adapter may momentarily interconnect conductors of a cable with a selected conductor of the connecter to discharge to attenuate or discharge an electrostatic charge built up on the conductors of the cable. In some embodiments, the adapter includes a selector switch so the selected conductor can be selected based upon the electronic system. In other embodiments, the selected conductor is fixed.

Abstract: A method and apparatus are disclosed for sending and receiving logic signals. A driver is connected to a first end of a transmission line with a predetermined impedance and first and second transmission line ends for communicating the logic signals. The driver has a source for sending the logic signals, and a reference generator connected to the source for setting the magnitude of the signals sent by the source. A receiver is connected to the second transmission line end, and has a transmission line terminator for sinking the signals, and a reference generator connected to the terminator for setting a bias of the terminator to establish a certain family of terminator impedances for sinking the signals. The driver reference generator and the receiver reference generator interactively match the terminator impedance to the transmission line for the set magnitude of the signals.

Abstract: A method and apparatus are disclosed for sending and receiving logic signals responsive to external digital data input and control signals. A reference circuit providing a first and second reference signal is common to the signal generating and receiving circuitry. The signal generating circuitry includes a signal source connected to the transmission line for generating a variable level digital signal, and a reference level adjusting and switching circuit ("RLA/S circuit") which is responsive to the digital data input and the first reference signal. The RLA/S circuit is connected to the signal source for selecting the level of the variable level digital signal and providing a switching signal. The signal source output is thus adjusted and switched so that the signal source generates a digital signal to the transmission line which follows the digital data input at the selected output signal level.

Abstract: A process, compatible with bipolar and CMOS silicon device manufacturing for fabricating complementary buried doped regions in a silicon substrate. An N+ doped region (12) is formed in the silicon substrate by known methods of arsenic doping and drive in. This is followed by depositing a first thin epitaxial silicon cap layer (14), under conditions of minimum N+ autodoping. Part thickness of this first epilayer is converted to oxide (18), and the oxide is patterned to provide apertures in an area where it is desired to form a P+ region. A P source material (20) is deposited and a drive in anneal is used to dope the silicon with P in the areas of the oxide aperture opening. Subsequent to drive in, the dopant source layer and the oxide mask is removed by wet etching. An oxide is regrown on the surface, including the P+ region (22), and subsequently the oxide layer is stripped in dilute hydrofluoric acid.