Patents by Inventor Mitja REBEC

Mitja REBEC has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power semiconductor device with integrated current measurement
    Patent number: 11346880
    Abstract: A package-integrated power semiconductor device is provided, which includes at least one power transistor coupled to a current path, a current measurement device and a package. The current measurement device is electrically insulated from and magnetically coupled to the current path. The current path and the current measurement device are arranged so as to enable the current measurement device to sense the magnetic field of a current flowing through the current path. The at least one power transistor, the current measurement device, and the current path are arranged inside the package. Further, a power module assembly including the package-integrated power semiconductor device as well as a method of operating the package-integrated power semiconductor device are provided.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: May 31, 2022
    Inventors: Anton Mauder, Thomas Kimmer, Wolfgang Raberg, Mitja Rebec
  • POWER SEMICONDUCTOR DEVICE WITH INTEGRATED CURRENT MEASUREMENT
    Publication number: 20200363463
    Abstract: A package-integrated power semiconductor device is provided, which includes at least one power transistor coupled to a current path, a current measurement device and a package. The current measurement device is electrically insulated from and magnetically coupled to the current path. The current path and the current measurement device are arranged so as to enable the current measurement device to sense the magnetic field of a current flowing through the current path. The at least one power transistor, the current measurement device, and the current path are arranged inside the package. Further, a power module assembly including the package-integrated power semiconductor device as well as a method of operating the package-integrated power semiconductor device are provided.
    Type: Application
    Filed: May 11, 2020
    Publication date: November 19, 2020
    Applicant: Infineon Technologies Austria AG
    Inventors: Anton MAUDER, Thomas KIMMER, Wolfgang RABERG, Mitja REBEC