Abstract: A storage battery which can be replaced by simple operations within a very short time. The storage battery includes: a plate-shaped plug-in terminal provided to protrude at one side surface of a storage battery having a substantially rectangular parallelepiped shape; and a clamping terminal made of a plurality of parallel plate-shaped members that can clamp the plate-shaped plug-in terminal, and that is provided to protrude at the other side surface of the storage battery, thereby facilitating the storage battery replacement operation. The plug-in terminals or clamping terminals are preferably provided side-by-side in pairs on the respective side. The storage battery preferably has a display device 7 to display data of a charged power amount, a consumed power amount, a remaining power amount, or a storage battery temperature; and a data output unit for outputting the data to a control device of the automobile.

Abstract: A storage battery that can be used in an electric automobile or the like and can be replaced by simple operations within a very short time, and a storage battery accommodation device are provided. The storage battery 1 in accordance with the present invention includes: a plate-shaped plug-in terminal that is provided to protrude at one side surface of a storage battery having a substantially rectangular parallelepiped shape; and a clamping terminal that is made of a plurality of parallel plate-shaped members that can clamp the plate-shaped plug-in terminal, and that is provided to protrude at the other side surface of the storage battery, thereby facilitating the storage battery replacement operation. The plug-in terminals or clamping terminals are preferably provided side-by-side in pairs on the respective side.

Abstract: The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted. The first cutting device 23 cuts the wiring boards 3 into separate parts along one direction, so that the cut wiring boards 3 constitute strip-form cut wiring boards 3a. The cut wiring boards 3a are conveyed to the second cutting device 33, and are fed by the second conveying device 43 along the direction of length and are then cut by the second cutting device 33 with the orientation altered by 90 degrees relative to the first cutting direction. The wiring boards 3b resulting from the cutting performed by the second cutting device 33 constitute the original forms of the IC packages. The wiring boards 3b that have been cut and conveyed from the second cutting device 33 enter a cleaning step.

Abstract: The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted.

Abstract: The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted. The first cutting device 23 cuts the wiring boards 3 into separate parts along one direction, so that the cut wiring boards 3 constitute strip-form cut wiring boards 3a. The cut wiring boards 3a are conveyed to the second cutting device 33, and are fed [into the second cutting device 33] by the second conveying device 43 along the direction of length. [The cut wiring boards 3a] are then cut by the second cutting device 33 with the orientation altered by 90 degrees relative to the first cutting direction. The wiring boards 3b resulting from the cutting performed by the second cutting device 33 constitute the original forms of the IC packages. The wiring boards 3b that have been cut and conveyed from the second cutting device 33 enter a cleaning step.

Abstract: The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted.

Abstract: An IC leadframe processing system for use in an IC manufacturing system, whereby IC leadframes of different types can be subjected to various lead machining processes by a single processing system without a need of various types of cutting and bending dies. The topmost leadframe is separated by a separating device one by one from a stack of leadframes stored, each having a plurality of IC chips connected thereto. The leadframe is cut into each individual packaged IC by a leadframe cutting device. Lead wires of each packaged IC are subjected to pinch cutting, dam cutting and end cutting by a cutting die and then bent into a Z shape by a bending machine.

Abstract: A general-purpose lead bending machine for electronic components that is capable of bending leads of various types of electronic components without a need of a great variety of benders. The machine includes a lead holding device for holding the distal end of a lead of an electronic component. A first driving mechanism causes the lead holding device to move along a first axis of travel. A second driving mechanism causes the lead holding device to move along a second axis of travel perpendicularly intersecting the first axis of travel. A control device controls the first driving mechanism and the second driving mechanism such that the lead holding device holding the lead of the electronic component moves along an approximately circular arc-shaped locus, thereby bending the lead of the electronic component.

Abstract: An IC lead frame centering method and apparatus whereby centering plates are automatically positioned to center various types of IC. With a screw driver (2) held with a hand, projections (48) of a rotating shaft (45) are inserted into driving bores (29) of a socket wrench (25), and pushed therein toward the socket wrench (25). The pressure causes the socket wrench (25) to slide on a screw rod (7) while compressing a coil spring (30). At the same time, the pressure causes the rotating shaft (45) to compress a coil spring (51), and also causes a cylindrical portion (47) of the rotating shaft (45) to move. The movement of the cylindrical portion (47) is detected by a start switch (52). Consequently, a servomotor (41) is started to drive the screw rod (7) to rotate, causing centering plates (16 and 17) to move away from each other until the centering plate 17 is detected by a mechanical origin sensor (24).

Abstract: ICs with leadframes can be efficiently transferred, stocked and positioned without the need for preparing jigs for each kind of IC.A cassette 4 accommodating a stack of ICs is inserted into a cassette space 35 and held in the center thereof. A moving table 9 is driven to move by a servomotor 21. A lifting member 67 of an IC lifting mechanism 60 raises the ICs in the cassette 4 from the bottom by an amount corresponding to the thickness of one IC at a time. A pulling-over device 70, which is disposed above the cassette space 35, centers the IC in both the lateral and longitudinal directions to thereby effect positioning.

Abstract: A method of efficiently bending a lead of an electric part by use of a bender including an upper die and a lower die without denting or scratching the lead and hence causing no peeling of the plating therefrom. The method comprises the steps of: clamping the root portion of the leads between a moving stripper of the upper die and a fixed die member of the lower die; effecting a first motion in which the distal end portion of the lead that is clamped between a moving punch of the upper die and a moving die member of the lower die is pressed downwardly; and effecting a second motion simultaneously with the first motion, in which the moving punch and the moving die member, which clamp the distal end portion of the lead, are moved in a direction perpendicular to the direction of the first motion, thereby bending the lead along an approximately circular locus about the root portion of the lead by a resultant motion from the first and second motions of the moving punch and the moving die member.

Abstract: In a method of operating a press machine having a servomotor (20) and a servo controller therefor, the tool stays substantially still immediately after the completion of working a workpiece for a period of from 0.05 to 2 seconds and also the speed of the tool applying an impact to the workpiece for working is decelerated immediately before the tool strikes against the workpiece in order to reduce the noise generated when the impact is applied. The speed and positional locus of the ram (36) are set for each step using respective setting switches provided on a panel. The servomotor (20) is program-controlled according to the data input through the respective setting switches.

Abstract: In a method of operating a press machine having a servomotor (20) and a servo controller therefor, the tool stay substantially still immediately after the completion of working a workpiece for a period of from 0.05 to 2 seconds and also the speed of the tool applying an impact to the workpiece for working is decelerated immediately before the tool strikes against the workpiece in order to reduce the noise generated when the impact is applied. The speed and positional locus of the ram (36) are set for each step using respective setting switches provided on a panel. The servomotor (20) is program-controlled according to the data input through the respective setting switches.