Abstract: According to one embodiment, a package stocker is configured to store a plurality of semiconductor packages each including one or more nonvolatile memory dies. A drive includes at least one socket on which a semiconductor package is able to be detachably mounted. A host apparatus, which is communicatively connected to the drive, reads/writes data from/to the one or more nonvolatile memory dies of the semiconductor package mounted on the socket. When a first semiconductor package is not mounted on the socket, the host apparatus causes a package transport device to transport the first semiconductor package to the drive and to mount the first semiconductor package on the socket.

Abstract: According to one embodiment, a wafer includes a substrate including a first region and a second region that do not overlap each other; a first chip unit and a second chip unit each arranged on the substrate; a first electrode and a second electrode each electrically connected to the first chip unit; and a third electrode and a fourth electrode each electrically connected to the second chip unit. The first electrode and the third electrode are arranged in the first region. The second electrode and the fourth electrode are arranged in the second region. The first region is independent of a region in which the first chip unit and the second chip unit are provided.