Patents by Inventor Mitra E. Geeban

Mitra E. Geeban has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Discrete component pad array carrier
    Patent number: 5729438
    Abstract: A pad array carrier module for packaging discrete electronic components is provided. A circuit substrate (8) contains component mounting pad pairs (20), each consisting of a power pad (22) and a ground pad (21), on a first side (10). Component mounting pads are electrically connected by circuit traces (23), through conductive vias (14), to terminal solder pads (16) on the second side (12) of the circuit substrate. Some of the ground pads are connected to a common ground solder pad (17). Likewise, some of the power pads are connected to a common supply voltage solder pad (19). Solder spheres (18) are attached to the solder pads. Discrete electronic components (24) are conductively coupled (26) to the component-mounting pad pairs.
    Type: Grant
    Filed: June 7, 1996
    Date of Patent: March 17, 1998
    Assignee: Motorola, Inc.
    Inventors: Kevin J. Pieper, Mitra E. Geeban, Richard J. Kolcz