Abstract: A semiconductor memory device includes: a core unit including first and second memory cell groups; and a control circuit. The control circuit is configured to, in response to a read command including designation of a first address and designation of a second address, read first data from the first memory cell group, read second data from the second memory cell group, and output third data and fourth data in parallel. The first and second addresses correspond to the first and second memory cell groups, respectively. The designation of the second address is made after the designation of the first address. The third data corresponds to the read first data. The fourth data corresponds to the read second data.

Abstract: In a power steering device equipped with a rack shaft constructed by joining a first member having rack teeth and a second member serving as a ball screw shaft on which a ball screw groove is formed, a grinding process of the ball screw groove is performed on the second member by causing a grindstone to rotate and move along a rotation axis of the second member, while causing the second member to rotate about an axis of the second member as the rotation axis. The grinding process is performed so as to satisfy a specified machining condition “g/(5×p)<w<g/p”, where w is a rotational speed of the second member during grinding of the ball screw groove, g is a rotational speed of the grindstone during grinding of the ball screw groove, and p is a circumferential length of one circumference of the ball screw groove around the rotation axis.

Abstract: In a power steering device equipped with a rack shaft constructed by joining a first member having rack teeth and a second member serving as a ball screw shaft on which a ball screw groove is formed, a grinding process of the ball screw groove is performed on the second member by causing a grindstone to rotate and move along a rotation axis of the second member, while causing the second member to rotate about an axis of the second member as the rotation axis. The grinding process is performed so as to satisfy a specified machining condition “g/(5×p)<w<g/p”, where w is a rotational speed of the second member during grinding of the ball screw groove, g is a rotational speed of the grindstone during grinding of the ball screw groove, and p is a circumferential length of one circumference of the ball screw groove around the rotation axis.

Abstract: A process for producing an inorganic compound-containing urea resin, which comprises adding an acidic gelling agent to an aqueous urea-formaldehyde precondensate solution to prepare a urea resin-containing product, and either(1) mixing the product with a reactant which reacts with the gelling agent to form inorganic particles substantially insoluble in water, or(2) separating the urea resin from the product, mixing the resin-freed mother liquor with such a reactant as stated above, and mixing the resulting inorganic particles with the separated urea resin.