Abstract: In a preferred embodiment, an aligner includes a grip mechanism provided with a plurality of damp arms for holding an external periphery of a wafer; a rotary mechanism for rotating the grip mechanism to rotate the wafer in a prescribed rotational direction, and a lifter mechanism provided with a plurality of lift arms for lifting up the wafer above the grip mechanism. The aligner is configured to align the wafer by the grip operation of the grip mechanism and the rotary operation of the rotary mechanism, and one or more of the plurality of the lift arms which interfere with one or more of the plurality of clamp arms at the time of lifting up the plurality of lift arms are engaged with restriction members provided on the grip mechanism to prevent an upward movement thereof.

Abstract: It is an object to provide an aligner for centering a wafer and adjusting an angle of a notch or the like of the wafer while gripping edges of the wafer capable of attaining a shortened takt time and miniaturization of the apparatus by employing a mechanism capable of infinite rotation without being restricted by a rotational range, by eliminating cables and/or tubes at the rotating portion. The link mechanism for causing opening and closing movements of the gripping mechanism for gripping a wafer 1 is supported via a bearing 14 with respect to the link mechanism driving portion for driving the link mechanism so that only the gripping portion and the link mechanism can be rotated.

Abstract: It is an object to provide an aligner for centering a wafer and adjusting an angle of a notch or the like of the wafer while gripping edges of the wafer capable of attaining a shortened takt time and miniaturization of the apparatus by employing a mechanism capable of infinite rotation without being restricted by a rotational range, by eliminating cables and/or tubes at the rotating portion. The link mechanism for causing opening and closing movements of the gripping mechanism for gripping a wafer 1 is supported via a bearing 14 with respect to the link mechanism driving portion for driving the link mechanism so that only the gripping portion and the link mechanism can be rotated.

Abstract: A load port which has no limitation in a placing direction of a substrate storing container, is flexibly applicable in accordance with a mode of a device to which the load port is connected, and is compact, is provided. Furthermore, the load port having high operation efficiency is provided. The load port is provided with a stage (12) for placing the substrate storing container, and a transferring mechanism for transferring the stage. The load port for opening and closing a cover of the placed substance storing container is provided with a rotating mechanism for rotating the stage (12), and a lifting and lowering mechanism for lifting and lowering the stage.

Abstract: In a preferred embodiment, an aligner includes a grip mechanism provided with a plurality of damp arms for holding an external periphery of a wafer; a rotary mechanism for rotating the grip mechanism to rotate the wafer in a prescribed rotational direction, and a lifter mechanism provided with a plurality of lift arms for lifting up the wafer above the grip mechanism. The aligner is configured to align the wafer by the grip operation of the grip mechanism and the rotary operation of the rotary mechanism, and one or more of the plurality of the lift arms which interfere with one or more of the plurality of clamp arms at the time of lifting up the plurality of lift arms are engaged with restriction members provided on the grip mechanism to prevent an upward movement thereof.