Abstract: The present invention has an object to reduce residual stress in a tensile direction of a weld on the inner side in contact with reactor water of austenitic stainless steel piping, and to change the residual stress into compressive stress, to reduce stress corrosive cracking. The present invention provides a welding process for stainless steel piping of laminating two types of welding wire made of different materials in a groove of austenitic stainless steel piping, including at least one of a first layer penetration welding step of performing a predetermined back bead width on the back side of the groove bottom and a tack welding step, a first lamination welding step of lamination welding of austenitic stainless steel wire from the bottom to the top of the groove, and a second lamination welding step of lamination welding of nickel-base alloy wire to a final layer at the top of the groove.

Abstract: Disclosed is a bearing unit which can be used in a drainage pump operated without supply of clean water or a hydraulic pump, which exhibits excellent wear resistance against water containing earth and sand and satisfactory assembling facility, and a method of manufacturing the bearing unit.The contact surface of a bearing made of stainless steel and/or that of a sleeve is applied with a sprayed coating, the main component of which is WC, and which contains one or more elements selected from a group consisting of nickel, chromium and cobalt as a binder material thereof, or a sprayed coating, the main component of which is Cr.sub.3 C.sub.2, and which contains NiCr as a binder material, after the sprayed coating has been formed, heating at from 300.degree. C. to 550.degree. C. is performed for one hour or longer so that hardness and wear resistance equivalent to those of a WC-12% sintered article is attained.

Abstract: A method of producing a leadframe for use in semiconductor devices, comprises the steps of forming a space between leads 1a and 1b which are to be overlapped and welded each other, and welding the leads at a region including the space and melting and cutting off one of the leads. In one of the leads which is melted, cohesion and separation of molten metal occur in the region around the space. As a result, unnecessary portions such as an outer frame used for positioning can be cut off at the same time when the leads are connected by welding. Thus, high precision positioning of a plurality of element leadframes as well as high assembling productivity are achieved.

Abstract: Disclosed is a bearing unit which can be used in a drainage pump operated without supply of clean water or a hydraulic pump, which exhibits excellent wear resistance against water containing earth and sand and satisfactory assembling facility, and a method of manufacturing the bearing unit.The contact surface of a bearing made of stainless steel and/or that of a sleeve is applied with a sprayed coating, the main component of which is WC, and which contains one or more elements selected from a group consisting of nickel, chromium and cobalt as a binder material thereof, or a sprayed coating, the main component of which is Cr.sub.3 C.sub.2, and which contains NiCr as a binder material, after the sprayed coating has been formed, heating at from 300.degree. C. to 550.degree. C. is performed for one hour or longer so that hardness and wear resistance equivalent to those of a WC-12% sintered article is attained.

Abstract: A method of producing a leadframe for use in semiconductor devices, comprises the steps of forming a space between leads 1a and 1b which are to be overlapped and welded each other, and welding the leads at a region including the space and melting and cutting off one of the leads. In one of the leads which is melted, cohesion and separation of molten metal occur in the region around the space. As a result, unnecessary portions such as an outer frame used for positioning can be cut off at the same time when the leads are connected by welding. Thus, high precision positioning of a plurality of element leadframes as well as high assembling productivity are achieved.

Abstract: Disclosed is a bearing unit which can be used in a drainage pump operated without supply of clean water or a hydraulic pump, which exhibits excellent wear resistance against water containing earth and sand and satisfactory assembling facility, and a method of manufacturing the bearing unit.The contact surface of a bearing made of stainless steel and/or that of a sleeve is applied with a sprayed coating, the main component of which is WC, and which contains one or more elements selected from a group consisting of nickel, chromium and cobalt as a binder material thereof, or a sprayed coating, the main component of which is Cr.sub.3 C.sub.2, and which contains NiCr as a binder material, after the sprayed coating has been formed, heating at from 300.degree. C. to 550.degree. C. is performed for one hour or longer so that hardness and wear resistance equivalent to those of a WC - 12% sintered article is attained.

Abstract: A closed type motor-driven compressor includes a motor accommodated in a closed container and a compression mechanism connected through a crank shaft to the motor. A shielding member having a cylindrical portion substantially concentric with the axis of the compression mechanism is disposed between the motor and the compression mechanism. This shielding member defines a shielding air space between the motor and the compression mechanism for preventing a permeation of a lubricating oil. An inlet of a discharge pipe of the closed type motor-driven compressor is positioned inwardly of this shielding air space.

Abstract: A plastic-molded-type semiconductor device having a high degree of integration encases a plurality of semiconductor chips in a package unit with each chip situated perpendicular to the substrate for mounting. On a surface of each chip containing circuits or on a reverse surface of the same, a lead frame is attached with an insulating material interposed therebetween. The chip and lead frame are connected with each other by using wire. The lead frame is arranged perpendicularly to another lead frame provided in parallel and connected therewith by welding. A printed circuit board may be used in place of said latter lead frame. By arranging the chips in projections made of resin, the thermal resistance of the semiconductor device is decreased. The present invention is particularly effective for a memory IC.

Abstract: The process for forming an ultrafine-particle film according to this invention is characterized by irradiating the surface of a target of a raw material with laser energy in a predetermined atmosphere under conditions where a plume is generated, exposing a substrate (a base material) directly to the plume generated, and thereby forming a film. The substrate is positioned in the plume at a distance, from the surface of the target of the raw material, of at least the mean free path of atoms and/or molecules of the raw material (or components thereof). By so positioning the substrate, ultrafine particles of the raw material are deposited on the substrate. The plume containing a large amount of ultrafine particles moves at a high speed; and exposure of the substrate, at the specified position relative to the target, to the plume causes strong adhesion of ultrafine particles contained in the plume to the substrate, resulting in formation of a film.

Abstract: A sintering method and fusion welding method of the present invention are characterized in that energy is radiated to the black component of starting materials so as to convert it from the state of an energy absorber to the state of an energy reflector (the state where metallic luster is exhibited). The methods can be utilized effectively for forming the electrode of a sensor or the bump of an electronic component. When applied to the production of the sensor and the electrode, the methods can produce these products by a simple production process and with extremely high producibility.

Abstract: In a method wherein arcs are struck across a material to vaporize into ultra-fine particles and an electrode, thereby to manufacture the ultra-fine particles; the material to turn into the ultra-fine particles is arranged for at least either of the electrodes, and plasma currents are generated from the material and the electrode, whereby the formation rate of the ultra-fine particles per unit input is increased, and the material is formed in the shape of a rod or a wire, and a feeder capable of continuously supplying the material is disposed, whereby the ultra-fine particles can be continuously manufactured.

Abstract: Aluminum or its alloy is subjected to surface treatment wherein the surface is heated and melted by the heat of an electric arc in an atmosphere of a mixture of inert gas and nitrogen gas. By this treatment, a dense layer of aluminum nitride is formed on the surface of aluminum or its alloy so that material of increased wear resistance is obtained.