Patents by Inventor Mitsuaki Kato

Mitsuaki Kato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11167544
    Abstract: A screen printer comprising: a board positioning device configured to convey and hold a board to a work position in the screen printer; a mask holding device configured to hold a mask above the work position; a squeegee device configured to spread a cream solder on a mask on the board; a correction device configured to correct a relative position between the board of the board positioning device and the mask of the mask holding device; a control device configured to acquire inspection data of a print state from a print inspection device provided inside or outside the screen printer and perform correction control on the correction device by a correction value corrected according to a deviation amount of printing based on the inspection data; and an input device configured to include an instruction input section that senses an inspection instruction operation of an operator and transmit, to the control device, an inspection data acquisition signal for acquiring the inspection data of the print state from the pr
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: November 9, 2021
    Assignee: FUJI CORPORATION
    Inventor: Mitsuaki Kato
  • Patent number: 11156654
    Abstract: A semiconductor device inspection apparatus according to embodiments comprises: an action unit that generates an internal stress in a predetermined direction in a semiconductor device; a stress controller that controls a magnitude of the internal stress generated in the semiconductor device by the action unit; a probe electrically connected to the semiconductor device; a probe controller that supplies a current to the semiconductor device via the probe; and a controller that screens the semiconductor device based on a first current flowing through the semiconductor device via the probe while the internal stress is not generated in the semiconductor device and a second current flowing through the semiconductor device via the probe while the action unit generates the internal stress in the semiconductor device.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: October 26, 2021
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Akihiro Goryu, Mitsuaki Kato, Akira Kano, Kenji Hirohata
  • Patent number: 11159314
    Abstract: An IC card system includes an IC card management server and an IC card. The IC card management server requests a SIM management server to make an inquiry regarding a user based on card identification information and user information relating to a contract of SIM card, and, in a case that validity of the user is verified, transmits a generation request for generating a registration application registering biometric authentication information, including the card identification information and the secret key, to the SIM management server. The IC card includes a data storage storing the card identification information and the secret key and storing the biometric authentication information and, in a case that authentication based on the card identification information and the secret key through communication with the SIM card based on the registration application is succeed, stores the biometric authentication information based on the biometric information in the data storage.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: October 26, 2021
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Infrastructure Systems & Solutions Corporation
    Inventors: Masakazu Kato, Mitsuaki Satsukawa
  • Publication number: 20210293638
    Abstract: An analysis apparatus of an embodiment includes one or more processors. The processors receive structural information indicating a structure of a pipe to be analyzed and fluid information indicating a state of a fluid flowing in the pipe. The one or more processors obtain a plurality of loss factors of the pipe based on the structural information and the fluid information and calculate a wall shear stress of the pipe from the loss factors.
    Type: Application
    Filed: August 27, 2020
    Publication date: September 23, 2021
    Applicants: KABUSHIKI KAISHA TOSHIBA, CANON MEDICAL SYSTEMS CORPORATION
    Inventors: Mitsuaki KATO, Kenji HIROHATA, Akira KANO, Akihiro GORYU
  • Publication number: 20210296279
    Abstract: A semiconductor device 10 includes a pair of electrodes 16 and a conductive connection member 21 electrically bonded to the pair of electrodes 16. At least a portion of a perimeter of a bonding surface 24 of at least one of the pair of electrodes 16 and the conductive connection member 21 includes an electromigration reducing area 22.
    Type: Application
    Filed: August 28, 2020
    Publication date: September 23, 2021
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Mitsuaki KATO, Takahiro OMORI, Akihiro GORYU, Tomoya FUMIKURA, Kenji HIROHATA, Tetsuya KUGIMIYA
  • Patent number: 11101299
    Abstract: It is an object of the present invention to provide a semiconductor display device having an interlayer insulating film which can obtain planarity of a surface while controlling film formation time, can control treatment time of heating treatment with an object of removing moisture, and can prevent moisture in the interlayer insulating film from being discharged to a film or an electrode adjacent to the interlayer insulating film. An inorganic insulating film containing nitrogen, which is less likely to transmit moisture compared with an organic resin, is formed so as to cover a TFT. Next, an organic resin film containing photosensitive acrylic resin is applied to the organic insulting film, and the organic resin film is partially exposed to light to be opened. Thereafter, an inorganic insulting film containing nitrogen, which is less likely to transmit moisture compared with an organic resin, is fanned so as to cover the opened organic resin film.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: August 24, 2021
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunpei Yamazaki, Satoshi Murakami, Masahiko Hayakawa, Kiyoshi Kato, Mitsuaki Osame
  • Patent number: 11079427
    Abstract: An inspection device comprises: a detecting unit that is connected to a plurality of semiconductor chips having mutually different rates of change of electrical resistance with respect to stress loading direction, and that detects an electrical resistance value of each semiconductor chip from electric current flowing in each semiconductor chip; a first memory unit that is used to hold model data meant for converting an electrical resistance value into a characteristic value indicating at least either temperature, or stress, or strain; a converting unit that converts the electrical resistance value of each semiconductor chip as detected by the detecting unit into the characteristic value using the model data held in the first memory unit; and a second memory unit that is used to store the characteristic value, which is obtained by conversion by the converting unit, as time-series data for each of the plurality of semiconductor chips.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: August 3, 2021
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Mitsuaki Kato, Akihiro Goryu, Kenji Hirohata
  • Patent number: 11007768
    Abstract: A printing device including a conveyance rod which discharges and introduces a screen mask and a board support member; and a control section. The control section performs a mask exchange process including a mask discharge process of discharging the screen mask to be discharged and a mask introduction process of introducing the screen mask to be introduced by controlling a conveyance rod. In addition, the control section performs a support member exchange process including a support member discharge process of discharging the board support member to be discharged and a support member introduction process of introducing the support member to be introduced by controlling the conveyance rod.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: May 18, 2021
    Assignee: FUJI CORPORATION
    Inventors: Ritsuo Hirukawa, Yasunori Kamegai, Takeshi Kondo, Mitsuaki Kato, Tsuyoshi Mizukoshi, Atsushi Torii, Jun Iisaka, Kazuhiro Kusunoki
  • Publication number: 20210110087
    Abstract: An analysis mesh generation method is used for a modeling simulation of an article modeled according to a tool path. The method comprises: inputting the tool path for a product to be analyzed; defining an initial mesh that is made up of a number of microelements and encompasses the tool path; and determining overlap between the tool path and the microelements, removing non-overlapping microelements from the initial mesh, and storing an association of the tool path with overlapping microelements.
    Type: Application
    Filed: March 9, 2018
    Publication date: April 15, 2021
    Inventor: Mitsuaki KATO
  • Patent number: 10889101
    Abstract: A screen printer including a squeegee device to spread from above solder paste on a stencil; a clamp device to grip a board conveyed to a position below the stencil by a board conveyance member that is flat and provided with a board holding portion in a central opening portion, the clamp device gripping the board via the board conveyance member; a board supporting device to support the board from below and move the board in a vertical direction inside the clamp device; and a raising and lowering device to move the board supported inside the clamp device in the vertical direction and position the board at a printing position, and the clamp device is provided with a board printing guide member to be removably attached to an upper end of a pair of clamp members to sandwich the board conveyance member in a widthwise direction.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: January 12, 2021
    Assignee: FUJI CORPORATION
    Inventors: Mitsuaki Kato, Yoshimune Yokoi
  • Patent number: 10856458
    Abstract: A first conveyor belt and second conveyor belt are disposed on guide rail which is disposed so as to extend in a circuit substrate conveyance direction. Then, the circuit substrate supported by both the conveyor belts of the first conveyor belt and the second conveyor belt is held by substrate holding device, and work is performed on the held circuit substrate. In the transfer device having such a structure, for example, when the circuit substrate on which an operation has been completed is conveyed out by the second conveyor belt, a new circuit substrate is conveyed into the transfer device by the first conveyor belt. In this way, it is possible to perform printing work on a new circuit substrate at an early stage and shorten a cycle time.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: December 1, 2020
    Assignee: FUJI CORPORATION
    Inventors: Ritsuo Hirukawa, Takeshi Kondo, Shoji Fukakusa, Mitsuaki Kato, Atsushi Torii, Jun Iisaka
  • Patent number: 10847620
    Abstract: A semiconductor device comprises a semiconductor chip and a mounting substrate. The semiconductor chip has an element structure including: a silicon carbide substrate that has a hexagonal crystal structure; a gate electrode that is disposed on a part above a first surface corresponding to a (0001) plane or a (000-1) plane of the silicon carbide substrate; an insulating film that is interposed between the silicon carbide substrate and the gate electrode; and a source and a drain that are disposed with respect to the silicon carbide substrate and the gate electrode such that at least a part of a channel through which a carrier moves extends in a <1-100> direction of crystal orientation of the silicon carbide substrate. The mounting substrate is fixed with the semiconductor chip such that compressive stress in a <11-20> direction of crystal orientation of the silicon carbide substrate is applied to the semiconductor chip at least in operation.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: November 24, 2020
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Akihiro Goryu, Mitsuaki Kato, Kenji Hirohata
  • Publication number: 20200207072
    Abstract: A screen printing machine for appropriately contact between a mask and a board, comprising: a mask-holding device configured to hold a mask; a board-positioning device configured to hold a board and to position the held board with respect to a mask held by the mask-holding device from below; a squeegee device configured to spread a cream solder with respect to the mask; a height-measuring device configured to measure the height of the mask and the board; a control device configured to control each device, and to calculate the thickness of a mask lower layer, integrally formed with the mask, based on the measurement values obtained from the height-measuring device; and an operation display device configured to input operation and to display calculation values from the control device, and the like.
    Type: Application
    Filed: September 7, 2017
    Publication date: July 2, 2020
    Applicant: FUJI CORPORATION
    Inventor: Mitsuaki KATO
  • Publication number: 20200189261
    Abstract: A printing device including a conveyance rod which discharges and introduces a screen mask and a board support member; and a control section. The control section performs a mask exchange process including a mask discharge process of discharging the screen mask to be discharged and a mask introduction process of introducing the screen mask to be introduced by controlling a conveyance rod. In addition, the control section performs a support member exchange process including a support member discharge process of discharging the board support member to be discharged and a support member introduction process of introducing the support member to be introduced by controlling the conveyance rod.
    Type: Application
    Filed: February 20, 2020
    Publication date: June 18, 2020
    Applicant: FUJI CORPORATION
    Inventors: Ritsuo HIRUKAWA, Yasunori KAMEGAI, Takeshi KONDO, Mitsuaki KATO, Tsuyoshi MIZUKOSHI, Atsushi TORII, Jun IISAKA, Kazuhiro KUSUNOKI
  • Patent number: 10589514
    Abstract: A printing device including a conveyance rod which discharges and introduces a screen mask and a board support member; and a control section. The control section performs a mask exchange process including a mask discharge process of discharging the screen mask to be discharged and a mask introduction process of introducing the screen mask to be introduced by controlling a conveyance rod. In addition, the control section performs a support member exchange process including a support member discharge process of discharging the board support member to be discharged and a support member introduction process of introducing the support member to be introduced by controlling the conveyance rod.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: March 17, 2020
    Assignee: FUJI CORPORATION
    Inventors: Ritsuo Hirukawa, Yasunori Kamegai, Takeshi Kondo, Mitsuaki Kato, Tsuyoshi Mizukoshi, Atsushi Torii, Jun Iisaka, Kazuhiro Kusunoki
  • Publication number: 20200077548
    Abstract: A first conveyor belt and second conveyor belt are disposed on guide rail which is disposed so as to extend in a circuit substrate conveyance direction. Then, the circuit substrate supported by both the conveyor belts of the first conveyor belt and the second conveyor belt is held by substrate holding device, and work is performed on the held circuit substrate. In the transfer device having such a structure, for example, when the circuit substrate on which an operation has been completed is conveyed out by the second conveyor belt, a new circuit substrate is conveyed into the transfer device by the first conveyor belt. In this way, it is possible to perform printing work on a new circuit substrate at an early stage and shorten a cycle time.
    Type: Application
    Filed: December 15, 2016
    Publication date: March 5, 2020
    Applicant: FUJI CORPORATION
    Inventors: Ritsuo HIRUKAWA, Takeshi KONDO, Shoji FUKAKUSA, Mitsuaki KATO, Atsushi TORII, Jun IISAKA
  • Publication number: 20190351670
    Abstract: A screen printer comprising: a board positioning device configured to convey and hold a board to a work position in the screen printer; a mask holding device configured to hold a mask above the work position; a squeegee device configured to spread a cream solder on a mask on the board; a correction device configured to correct a relative position between the board of the board positioning device and the mask of the mask holding device; a control device configured to acquire inspection data of a print state from a print inspection device provided inside or outside the screen printer and perform correction control on the correction device by a correction value corrected according to a deviation amount of printing based on the inspection data; and an input device configured to include an instruction input section that senses an inspection instruction operation of an operator and transmit, to the control device, an inspection data acquisition signal for acquiring the inspection data of the print state from the pr
    Type: Application
    Filed: January 6, 2017
    Publication date: November 21, 2019
    Applicant: FUJI CORPORATION
    Inventor: Mitsuaki KATO
  • Publication number: 20190337290
    Abstract: A printing apparatus of the present disclosure is for performing printing of a viscous fluid onto a print target using a screen mask, the printing apparatus including: a moving section configured to perform at least one of moving an exchangeable member to an exchange position or loading and unloading of the exchangeable member, for at least two types of the exchangeable member that, out of a cartridge configured to house the viscous fluid, a squeegee, a screen mask, a cleaning member used to clean the screen mask, and a support member configured to fix the print target, include at least one out of the cartridge, the squeegee, and the cleaning member; and an exchange control section configured to control the moving section to perform exchange processing of exchanging the exchangeable member.
    Type: Application
    Filed: December 5, 2016
    Publication date: November 7, 2019
    Applicant: FUJI CORPORATION
    Inventors: Ritsuo HIRUKAWA, Takeshi KONDO, Mitsuaki KATO, Atsushi TORII, Jun IISAKA
  • Publication number: 20190224960
    Abstract: A screen printer including a squeegee device to spread from above solder paste on a stencil; a clamp device to grip a board conveyed to a position below the stencil by a board conveyance member that is flat and provided with a board holding portion in a central opening portion, the clamp device gripping the board via the board conveyance member; a board supporting device to support the board from below and move the board in a vertical direction inside the clamp device; and a raising and lowering device to move the board supported inside the clamp device in the vertical direction and position the board at a printing position, and the clamp device is provided with a board printing guide member to be removably attached to an upper end of a pair of clamp members to sandwich the board conveyance member in a widthwise direction.
    Type: Application
    Filed: October 13, 2016
    Publication date: July 25, 2019
    Applicant: FUJI CORPORATION
    Inventors: Mitsuaki KATO, Yoshimune YOKOI
  • Publication number: 20190221646
    Abstract: A semiconductor device comprises a semiconductor chip and a mounting substrate. The semiconductor chip has an element structure including: a silicon carbide substrate that has a hexagonal crystal structure; a gate electrode that is disposed on a part above a first surface corresponding to a (0001) plane or a (000-1) plane of the silicon carbide substrate; an insulating film that is interposed between the silicon carbide substrate and the gate electrode; and a source and a drain that are disposed with respect to the silicon carbide substrate and the gate electrode such that at least a part of a channel through which a carrier moves extends in a <1-100> direction of crystal orientation of the silicon carbide substrate. The mounting substrate is fixed with the semiconductor chip such that compressive stress in a <11-20> direction of crystal orientation of the silicon carbide substrate is applied to the semiconductor chip at least in operation.
    Type: Application
    Filed: August 30, 2018
    Publication date: July 18, 2019
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Akihiro GORYU, Mitsuaki Kato, Kenji Hirohata