Patents by Inventor Mitsuaki Nanba

Mitsuaki Nanba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for depositing solder onto aluminum metal material
    Patent number: 4848646
    Abstract: A method for depositing solder onto aluminum metal material comprises steps of:(a) activating the surface of aluminum metal;(b) substituting zinc for the surface of aluminum as activated;(c) forming a nickel coating film over the surface of the zinc-substituted layer on the aluminum metal material by the non-electrode plating; and(d) attaching soldering material onto the nickel coating film surface.
    Type: Grant
    Filed: September 19, 1988
    Date of Patent: July 18, 1989
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Mitsuharu Morishita, Shiro Iwatani, Mitsuaki Nanba
  • Cooling means for semiconductor device
    Patent number: 4417267
    Abstract: A cooling means for a semiconductor device comprises a heat radiating plate made of aluminum or aluminum alloy, having a fitting part for a semiconductor device; an alloy layer formed only at said fitting part of the heat radiating plate to allow easy soldering and a solder layer for bonding said semiconductor device to said alloy layer.
    Type: Grant
    Filed: May 13, 1981
    Date of Patent: November 22, 1983
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hifumi Wada, Mitsuaki Nanba