Patents by Inventor Mitsuaki Negishi

Mitsuaki Negishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130294013
    Abstract: The object of the present invention is to provide a condenser that exhibits excellent conductivity of the solid electrolyte layer, and has a low ESR, a high degree of heat resistance, and a high withstand voltage. A condenser of the present invention includes an anode composed of a valve metal, a dielectric layer formed by oxidation of the surface of the anode, and a solid electrolyte layer formed on the surface of the dielectric layer, wherein the solid electrolyte layer contains a ?-conjugated conductive polymer, a polyanion, and an amide compound.
    Type: Application
    Filed: May 20, 2013
    Publication date: November 7, 2013
    Applicant: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Tailu NING, Kazuyoshi Yoshida, Yasushi Masahiro, Sou Matsubayashi, Rika Abe, Mitsuaki Negishi
  • Patent number: 8541686
    Abstract: A wiring member including: a copper foil; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness within the range of 5 to 200 nm; an organic polymer film; and an insulating adhesive layer, wherein the insulating adhesive layer is provided between the organic polymer film formed on the noise suppressing layer and the copper foil, or between the noise suppressing layer formed on the organic polymer film and the copper foil. Further, there is provided a method for producing the wiring member.
    Type: Grant
    Filed: April 8, 2009
    Date of Patent: September 24, 2013
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga, Mitsuaki Negishi
  • Publication number: 20130168142
    Abstract: A wiring member including: a copper foil; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness within the range of 5 to 200 nm; an organic polymer film; and an insulating adhesive layer, wherein the insulating adhesive layer is provided between the organic polymer film formed on the noise suppressing layer and the copper foil, or between the noise suppressing layer formed on the organic polymer film and the copper foil. Further, there is provided a method for producing the wiring member.
    Type: Application
    Filed: April 8, 2009
    Publication date: July 4, 2013
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga, Mitsuaki Negishi
  • Patent number: 8472165
    Abstract: The object of the present invention is to provide a condenser that exhibits excellent conductivity of the solid electrolyte layer, and has a low ESR, a high degree of heat resistance, and a high withstand voltage. A condenser of the present invention includes an anode composed of a valve metal, a dielectric layer formed by oxidation of the surface of the anode, and a solid electrolyte layer formed on the surface of the dielectric layer, wherein the solid electrolyte layer contains a ?-conjugated conductive polymer, a polyanion, and an amide compound.
    Type: Grant
    Filed: February 8, 2007
    Date of Patent: June 25, 2013
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Tailu Ning, Kazuyoshi Yoshida, Yasushi Masahiro, Sou Matsubayashi, Rika Abe, Mitsuaki Negishi
  • Patent number: 8394183
    Abstract: An asymmetric membrane contains a porous layer and a dense layer adjacent thereto. The porous layer and the dense layer are formed of a polymeric material. The porous layer and/or dense layer contains a filler. The amount of the filler is 11 parts by mass or more per 100 parts by mass of the polymeric material contained in the asymmetric membrane.
    Type: Grant
    Filed: October 27, 2008
    Date of Patent: March 12, 2013
    Assignees: Shin-Etsu Polymer Co., Ltd., Denso Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Junya Ishida, Mitsuaki Negishi, Yuzo Morioka, Mika Kawakita, Katsunori Iwase, Manabu Maeda, Masahiko Minemura, Mamoru Hagiwara
  • Patent number: 8339770
    Abstract: A capacitor having a high degree of electric strength, a high electrostatic capacity, and a low ESR, which can be readily downsized, is provided. The capacitor according to the present invention includes an anode made of porous valve metal, a dielectric layer formed by oxidizing the surface of the anode, and a solid electrolyte layer formed on the surface of the dielectric layer. The solid electrolyte layer includes a ? conjugated conductive polymer, a polyanion, and an ion-conductive compound.
    Type: Grant
    Filed: February 21, 2007
    Date of Patent: December 25, 2012
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Kazuyoshi Yoshida, Tailu Ning, Hironao Fujiki, Mitsuaki Negishi
  • Patent number: 8134084
    Abstract: The present invention relates to a wiring member including: a copper foil layer having a smooth surface with a surface roughness Rz of 2 ?m or less; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness of 5 to 200 nm; and an insulating resin layer provided between the smooth surface of the copper foil layer and the noise suppressing layer, and also relates to a printed wiring board equipped with the wiring member.
    Type: Grant
    Filed: June 27, 2007
    Date of Patent: March 13, 2012
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga, Mitsuaki Negishi
  • Publication number: 20100294132
    Abstract: Disclosed is an asymmetric membrane having a porous layer and a dense layer adjacent to the porous layer. The porous layer and the dense layer are made of a polymer material. The porous layer and/or the dense layer contains a filler.
    Type: Application
    Filed: October 27, 2008
    Publication date: November 25, 2010
    Applicants: SHIN-ETSU POLYMER CO., LTD., DENSO CORPORATION, SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Junya Ishida, Mitsuaki Negishi, Yuzo Morioka, Mika Kawakita, Katsunori Iwase, Manabu Maeda, Masahiko Minemura, Mamoru Hagiwara
  • Publication number: 20100165546
    Abstract: A capacitor having a high degree of electric strength, a high electrostatic capacity, and a low ESR, which can be readily downsized, is provided. The capacitor according to the present invention includes an anode made of porous valve metal, a dielectric layer formed by oxidizing the surface of the anode, and a solid electrolyte layer formed on the surface of the dielectric layer. The solid electrolyte layer includes a ? conjugated conductive polymer, a polyanion, and an ion-conductive compound.
    Type: Application
    Filed: February 21, 2007
    Publication date: July 1, 2010
    Applicant: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Kazuyoshi Yoshida, Tailu Ning, Hironao Fujiki, Mitsuaki Negishi
  • Publication number: 20090021894
    Abstract: The object of the present invention is to provide a condenser that exhibits excellent conductivity of the solid electrolyte layer, and has a low ESR, a high degree of heat resistance, and a high withstand voltage. A condenser of the present invention includes an anode composed of a valve metal, a dielectric layer formed by oxidation of the surface of the anode, and a solid electrolyte layer formed on the surface of the dielectric layer, wherein the solid electrolyte layer contains a ?-conjugated conductive polymer, a polyanion, and an amide compound.
    Type: Application
    Filed: February 8, 2007
    Publication date: January 22, 2009
    Inventors: Tailu Ning, Kazuyoshi Yoshida, Yasushi Masahiro, Sou Matsubayashi, Rika Abe, Mitsuaki Negishi
  • Publication number: 20080049410
    Abstract: The present invention relates to a wiring member including: a copper foil layer having a smooth surface with a surface roughness Rz of 2 ?m or less; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness of 5 to 200 nm; and an insulating resin layer provided between the smooth surface of the copper foil layer and the noise suppressing layer, and also relates to a printed wiring board equipped with the wiring member.
    Type: Application
    Filed: June 27, 2007
    Publication date: February 28, 2008
    Inventors: Toshiyuki KAWAGUCHI, Kazutoki TAHARA, Tsutomu SAGA, Mitsuaki NEGISHI