Patents by Inventor Mitsuaki Sato

Mitsuaki Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240150366
    Abstract: [Problem] A compound useful as an active ingredient of a pharmaceutical composition for treating pancreatic cancer is provided. [Solution] The present inventors have studied about a compound that is useful as an active ingredient of a pharmaceutical composition for treating pancreatic cancer and have found that a 4-aminoquinazoline compound has an excellent G12D mutant KRAS inhibition activity and can be used as a therapeutic agent for pancreatic cancer, thus completing the present invention. The 4-aminoquinazoline compound of the present invention or a salt thereof can be used as a therapeutic agent for pancreatic cancer.
    Type: Application
    Filed: February 14, 2022
    Publication date: May 9, 2024
    Inventors: Kenichi KAWAGUCHI, Kazuyuki KURAMOTO, Tomoyoshi IMAIZUMI, Takahiro MORIKAWA, Mitsuaki OKUMURA, Sunao IMADA, Eiji KAWAMINAMI, Ryo SATO, Yohei SEKI, Hisao HAMAGUCHI, Hiroki ISHIOKA, Hiroki FUKUDOME, Ikumi KURIWAKI, Takeyuki NAGASHIMA
  • Patent number: 11804400
    Abstract: A substrate processing apparatus that includes a chamber, a substrate support disposed in the chamber, and a connection is provided. The chamber is provided with a bottom including a first flow path, and the substrate support includes a second flow path. The connection connects the first flow path to the second flow path, and the connection includes a sleeve through which the first flow path is in fluid communication with the second flow path, and a core including a first rod segment and a first elastic foam segment. The core is disposed in the sleeve, and a gap is defined between an inner surface of the sleeve and a side surface of the first rod segment.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: October 31, 2023
    Assignee: Tokyo Electron Limited
    Inventor: Mitsuaki Sato
  • Patent number: 11664200
    Abstract: A placing table includes an edge ring disposed to surround a substrate, the edge ring having a first recess portion at a lower portion thereof; an electrostatic chuck having a first placing surface on which the substrate is placed, a second placing surface on which the edge ring is placed, and an electrode embedded therein to face the second placing surface; an annular member disposed to surround the electrostatic chuck, the annular member having a second recess portion; and an elastic member disposed in a space surrounded by the first recess portion, the electrostatic chuck and the second recess portion.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: May 30, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yasuharu Sasaki, Toshiya Tsukahara, Mitsuaki Sato
  • Publication number: 20220157573
    Abstract: An edge ring disposed around a processing target substrate includes a first member of an annular shape, which is made of a first material and has a first inclined portion at a lower portion of an inner peripheral side surface thereof; and a second member of an annular shape, which is made of a second material different from the first material and has a second inclined portion facing the first inclined portion, the second member being provided under the first member.
    Type: Application
    Filed: November 10, 2021
    Publication date: May 19, 2022
    Inventors: Junichi Sasaki, Masashi Ikegami, Mitsuaki Sato, Kazuhiko Akahane
  • Publication number: 20210280450
    Abstract: A substrate processing apparatus that includes a chamber, a substrate support disposed in the chamber, and a connection is provided. The chamber is provided with a bottom including a first flow path, and the substrate support includes a second flow path. The connection connects the first flow path to the second flow path, and the connection includes a sleeve through which the first flow path is in fluid communication with the second flow path, and a core including a first rod segment and a first elastic foam segment. The core is disposed in the sleeve, and a gap is defined between an inner surface of the sleeve and a side surface of the first rod segment.
    Type: Application
    Filed: February 25, 2021
    Publication date: September 9, 2021
    Inventor: Mitsuaki SATO
  • Publication number: 20210183685
    Abstract: Provided is an edge ring to reduce the frequency of replacement of an edge ring used for plasma processing and to suppress the leakage of a heat transfer gas. The edge ring has an annular first member and an annular second member, the first member has a recess on the lower surface and is made of a first material having plasma resistance, and the second member is arranged in the recess of the first member and is made of a second material having a rigidity lower than that of the first material.
    Type: Application
    Filed: December 16, 2020
    Publication date: June 17, 2021
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Sungjae LEE, Toshiya TSUKAHARA, Mitsuaki SATO, Tetsuji SATO
  • Publication number: 20200144090
    Abstract: A placing table includes an edge ring disposed to surround a substrate; an electrostatic chuck having a first placing surface on which the substrate is placed and a second placing surface on which the edge ring is placed; and an elastic member placed at a position lower than the first placing surface within a gap between an inner circumferential surface of the edge ring and a side surface of the electrostatic chuck between the first placing surface and the second placing surface.
    Type: Application
    Filed: November 4, 2019
    Publication date: May 7, 2020
    Inventors: Toshiya Tsukahara, Mitsuaki Sato, Junichi Sasaki, Namho Yun, Jisoo Suh
  • Publication number: 20200144036
    Abstract: A placing table includes an edge ring disposed to surround a substrate, the edge ring having a first recess portion at a lower portion thereof; an electrostatic chuck having a first placing surface on which the substrate is placed, a second placing surface on which the edge ring is placed, and an electrode embedded therein to face the second placing surface; an annular member disposed to surround the electrostatic chuck, the annular member having a second recess portion; and an elastic member disposed in a space surrounded by the first recess portion, the electrostatic chuck and the second recess portion.
    Type: Application
    Filed: November 1, 2019
    Publication date: May 7, 2020
    Inventors: Yasuharu Sasaki, Toshiya Tsukahara, Mitsuaki Sato
  • Patent number: 5466277
    Abstract: A sintered Al-alloy, which has a composition of 0.2 to 2.0% of Mg, 10.0 to 35.0% of Si, from 0.2 to 4.0% of Cu, and Al and unavoidable impurities in balance, is produced by using a mixture of the main powder (10.0-35.0% of Si, 0.2-2.0% of Cu, and Al and unavoidable impurities in balance) and at least one metal or mother-alloy powder selected from (a)-(i): (a) Mg powder; (b) Al--Mg powder; (c) Al--Cu powder; (d) Al--Mg--Si powder; (e) Al--Cu--Si powder; (f) Al--Mg--Cu powder; (g) Al--Mg--Cu--Si powder; (h) Mg--Cu powder; and, (i) Mg--Cu--Si powder.
    Type: Grant
    Filed: March 30, 1994
    Date of Patent: November 14, 1995
    Assignee: Showa Denko K.K.
    Inventors: Shin Miura, Youichi Hirose, Mitsuaki Sato
  • Patent number: 5304343
    Abstract: An aluminum-alloy main-starting powder for producing a sintered aluminum-alloy consists of from 0.1 to 3.0% of Cu, the balance being Al and unavoidable impurities. Mother alloy powder consists of from 4 to 20% of Mg, from 12 to 30% of Si, and Al and unavoidable impurities in balance.
    Type: Grant
    Filed: October 19, 1992
    Date of Patent: April 19, 1994
    Assignee: Showa Denko K.K.
    Inventors: Shin Miura, Youichi Hirose, Yoshio Machida, Mitsuaki Sato
  • Patent number: 5292358
    Abstract: A sintered aluminum-alloy consisting essentially in weight of 0.1-2.0% Mg, 0.1-2.0% Si, 0.2-6.0% Cu and Al and unavoidable impurities in balance is produced by sintering a mixture of a first aluminum-alloy starting powder and at least one second aluminum-alloy starting powder. The first aluminum-alloy powder consists of 0.1-3.0% Cu and Al and unavoidable impurities in balance and the second aluminum-alloy is selected from (1) an aluminum alloy starting powder consisting of 4-20% Mg, 12-30% Si and Al and unavoidable impurities in balance and (2) an aluminum-alloy starting powder consisting of from 0.1-20.0% Mg, 1-20% Si, 30-50% Cu and Al and unavoidable impurities in balance.
    Type: Grant
    Filed: October 19, 1992
    Date of Patent: March 8, 1994
    Assignee: Showa Denko K.K.
    Inventors: Shin Miura, Youichi Hirose, Yoshio Machida, Mitsuaki Sato
  • Patent number: 5176740
    Abstract: An aluminum-alloy main-starting powder for producing a sintered aluminum-alloy consists of from 0.1 to 3.0% of Cu, the balance being Al and unavoidable impurities. Mother alloy powder consists of from 4 to 20% of Mg, from 12 to 30% of Si, and Al and unavoidable impurities in balance. A mixture of the two powders may also be produced. Further, from 0.2 to 2.0% of a lubricant may be added to the mixture.
    Type: Grant
    Filed: December 28, 1990
    Date of Patent: January 5, 1993
    Assignee: Showa Denko K.K.
    Inventors: Shin Miura, Youichi Hirose, Yoshio Machida, Mitsuaki Sato