Patents by Inventor MITSUBISHI MATERIALS CORPORATION
MITSUBISHI MATERIALS CORPORATION has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20140271380Abstract: This invention is a heater used to heat the feed process gas from 450° C. to greater than about 600° C. for the fluidized bed reactor (FBR) used for conversion of silicon tetrachloride (STC) to trichlorosilane (TCS). The invention involves stacked heater element carbon plates. The design of the plates allow the plates to act as baffles which improve heat transfer to the feed gas. Also, the heat gradients across each plate is calculated to be approximately 100° C. which is much lower than the gradient seen by conventional vertical heater elements. The design of the present invention prevents electrical grounding. In the design, the elements are surrounded by graphite wrapped in carbon felt to prevent heat loss by radiation and conduction.Type: ApplicationFiled: March 15, 2013Publication date: September 18, 2014Inventors: Mitsubishi Polycrystalline Silicon America Corporation (MIPSA), Mitsubishi Materials Corporation
-
Publication number: 20130224401Abstract: A silicon seed rod assembly used for producing polycrystalline silicon by means of a vapor deposition method includes two rod-shape silicon seed rods; and a silicon connection member bridging the silicon seed rods, wherein an opening-end peripheral edge of a through-hole on one side surface of the connection member is sharper than that on the other side surface thereof, and an opening-end peripheral surface on the one side surface thereof is formed into a flat contact surface disposed in a direction perpendicular to a perforation direction of the through-hole, and wherein a upper end portion of the silicon seed rod is inserted into the through-hole so that the contact surface comes into contact with the support surface of the silicon seed rod.Type: ApplicationFiled: April 8, 2013Publication date: August 29, 2013Applicant: MITSUBISHI MATERIALS CORPORATIONInventor: MITSUBISHI MATERIALS CORPORATION
-
Publication number: 20130214412Abstract: A method of forming a thin film interconnect in which a film is formed by sputtering method using a Cu—Ca alloy target and a thin film interconnect formed by the method, the method comprising: forming a Cu—Ca alloy film by sputtering method using a Cu—Ca alloy target that contains 0.5 atomic % or more and less than 5 atomic % of Ca, and the balance consisting of Cu and unavoidable impurities; and performing heat treatment of the Cu—Ca alloy film at a temperature of 300 to 700° C. in an inert gas atmosphere containing trace amount of oxygen defined by oxygen partial pressure in the range of 10?4 to 10?10 atm.Type: ApplicationFiled: February 14, 2013Publication date: August 22, 2013Applicant: MITSUBISHI MATERIALS CORPORATIONInventor: MITSUBISHI MATERIALS CORPORATION
-
Publication number: 20130213261Abstract: A silver powder for silver clay, wherein a main component is Ag, and an amount of P is controlled to be 100 ppm or less.Type: ApplicationFiled: December 31, 2012Publication date: August 22, 2013Applicant: MITSUBISHI MATERIALS CORPORATIONInventor: MITSUBISHI MATERIALS CORPORATION
-
Publication number: 20130214216Abstract: A conductive reflective film has a silver nanoparticle-sintered film with a surface coating composition containing a hydrolysate of a metal alkoxide wet-coated thereto. The coated film is then fired. Also provided is a method of manufacturing the conductive reflective film comprising the steps of coating a surface coating composition containing a hydrolysate of a metal alkoxide on a silver nanoparticle-sintered film using a wet coating method, and firing the silver nanoparticle-sintered film having the coated film. The conductive reflective film provides improved adhesion properties with respect to a base material while maintaining a high reflectivity and a high conductivity of a silver nanoparticle-sintered film.Type: ApplicationFiled: February 15, 2013Publication date: August 22, 2013Applicant: MITSUBISHI MATERIALS CORPORATIONInventor: Mitsubishi Materials Corporation
-
Publication number: 20130205862Abstract: A die for press working includes a punch part and a die part. The outer peripheral surface and tip surface of the punch part and the inner peripheral surface of the die part are coated with carbon films having a surface roughness Ra of 0.05 ?m or lower. An intra-punch refrigerant flow channel in the punch part allows a cooling medium to flow. An intra-die refrigerant flow channel in the die part allows the cooling medium to flow. The intra-punch refrigerant flow channel has a central flow channel portion where a tip on the central axis of the punch part is disposed at a tip of the punch part. Radial flow channel portions have base ends connected to the tip of the central flow channel portion, extending radially at mutually equiangular intervals. Outer peripheral flow channel portions have base ends connected to the tips of the radial flow channel portions.Type: ApplicationFiled: February 1, 2013Publication date: August 15, 2013Applicant: MITSUBISHI MATERIALS CORPORATIONInventor: MITSUBISHI MATERIALS CORPORATION
-
Publication number: 20130196171Abstract: Tin-plated copper-alloy material for terminal having: a substrate made of Cu or Cu alloy; an Sn-based surface layer formed on a surface of the substrate; and a Cu—Ni—Sn alloy layer including Ni formed between the Sn-based surface layer and the substrate, in which the Cu—Ni—Sn alloy layer is made of: fine Cu—Ni—Sn alloy particles; and coarse Cu—Ni—Sn alloy particles, an average thickness of the Sn-based surface layer is not less than 0.2 ?m and not more than 0.6 ?m, an area ratio of the Cu—Ni—Sn alloy layer exposed at a surface of the Sn-based surface layer is not less than 10% and not more than 40%, and a coefficient of kinetic friction of the tin-plated copper-alloy material for terminal is not more than 0.3.Type: ApplicationFiled: January 22, 2013Publication date: August 1, 2013Applicant: MITSUBISHI MATERIALS CORPORATIONInventor: MITSUBISHI MATERIALS CORPORATION
-
Publication number: 20130180302Abstract: This ring rolling mill includes a main roll and a mandrel that are brought close to or separated from each other, and roll a peripheral portion of a ring-shaped body in a radial direction of the ring-shaped body while the ring-shaped body is rotated along its peripheral direction in a state where the peripheral portion of the ring-shaped body is pinched in the radial direction between an outer peripheral surface of the main roll, and an outer peripheral surface of the mandrel. This ring rolling mill further includes a mechanism which inclines and supports the mandrel with respect to the rotation axis of the main roll such that the gap between the outer peripheral surface of the mandrel and the outer peripheral surface of the main roll differs on one side and on the other side as seen in a direction along the rotation axis of the main roll.Type: ApplicationFiled: December 27, 2012Publication date: July 18, 2013Applicant: Mitsubishi Materials CorporationInventor: Mitsubishi Materials Corporation
-
Publication number: 20130155571Abstract: A liquid composition is provided for forming a thin film in the form of a mixed composite metal oxide in which a composite oxide B containing copper (Cu) and a composite oxide C containing manganese (Mn) are mixed into a composite metal oxide A represented with the general formula: Ba1-xSrxTiyO3, wherein the molar ratio B/A of the composite oxide B to the composite metal oxide A is within the range of 0.002<B/A<0.05, and the molar ratio C/A of the composite oxide C to the composite metal oxide A is within the range of 0.002<C/A<0.03.Type: ApplicationFiled: December 17, 2012Publication date: June 20, 2013Applicants: STMICROELECTRONICS(TOURS) SAS, MITSUBISHI MATERIALS CORPORATIONInventors: MITSUBISHI MATERIALS CORPORATION, STMICROELECTRONICS(TOURS) SAS
-
Publication number: 20130156631Abstract: A pickling solution, including: 50 g/L to 400 g/L of sulfuric acid; 1 g/L to 100 g/L of at least one oxidant selected from a group consisting of nitric acid, hydrogen peroxide, peroxodisulfate ions, and iron (III) ions; 0.01 g/L to 10 g/L of at least one additive selected from a group consisting of aromatic sulfonic acid, aromatic sulfonate, alkylamine, aromatic carboxylic acid, and aromatic carboxylate; 0.005 g/L to 10 g/L of at least one surfactant selected from a group consisting of alkylbenzene sulfonic acid and alkylbenzene sulfonate; and 10 g/L to 300 g/L of copper sulfate, is used to remove oxide film, and then reused by being electrolyzed and adding the oxidant, the additive and the surfactant in amounts equivalent to consumed amounts.Type: ApplicationFiled: December 14, 2012Publication date: June 20, 2013Applicant: MITSUBISHI MATERIALS CORPORATIONInventor: Mitsubishi Materials Corporation
-
Publication number: 20130136937Abstract: A composition for forming a ferroelectric thin film is a composition for forming a ferroelectric thin film consisting of a lead titanate-based perovskite film or a lead zirconate titanate-based complex perovskite film. The composition includes lead acetate, a stabilizing agent consisting of acetylacetone or diethanolamine, and polyvinylpyrrolidone. The ratio of the molar number of the monomer-converted polyvinylpyrrolidone to the molar number of the perovskite B site atoms included in the composition is more than 0 and less than 0.015. The weight-average molecular weight of the polyvinylpyrrolidone is 5,000 to 100,000.Type: ApplicationFiled: November 26, 2012Publication date: May 30, 2013Applicant: MITSUBISHI MATERIALS CORPORATIONInventor: MITSUBISHI MATERIALS CORPORATION
-
Publication number: 20130136667Abstract: An apparatus for producing trichlorosilane in which reacted gas including trichlorosilane and hydrogen chloride is produced by heating raw gas including silicon tetrachloride and hydrogen, the apparatus having: a reaction vessel having a substantially cylindrical shape and being provided with a heated wall forming a gas flow-passage along an axis direction; and a heater heating the heated wall, wherein a folding flow-passage is provided at an uppermost stream of the gas flow-passage and has: an inlet flow-passage in which raw gas is introduced; and a turning part connected to a downstream of the inlet flow-passage in which a flow direction of the raw gas is turned at least once in an opposite direction, the turning part is formed between the inlet flow-passage and the heated wall in the folding flow-passage, and a turning length of the folding flow-passage along the axis direction is smaller than a maximum length of the gas flow-passage along the axis direction.Type: ApplicationFiled: November 27, 2012Publication date: May 30, 2013Applicant: MITSUBISHI MATERIALS CORPORATIONInventor: MITSUBISHI MATERIALS CORPORATION
-
Publication number: 20130126119Abstract: This manufacturing apparatus for a multi-channel tube having a plurality of parallel channels includes: a crucible; and a die set for forming the multi-channel tube from molten copper supplied from the crucible, the die set including: a hollow portion having an inner surface shaped like the profile of the multi-channel tube; punches which are inserted into the hollow portion from an inlet end of the hollow portion to define a space between the inner surface of the hollow portion and each of the punches; and a feed passage which is disposed between the crucible and the space, and configured to feed the molten copper from the crucible to the space, the molten copper being supplied from the crucible to the space within the die set through the feed passage to solidify as it passes through the hollow portion.Type: ApplicationFiled: November 16, 2012Publication date: May 23, 2013Applicants: MITSUBISHI MATERIALS CORPORATION, CTA TECHNOLOGY (PROPRIETARY) LIMITEDInventors: CTA TECHNOLOGY (PROPRIETARY) LIMITED, MITSUBISHI MATERIALS CORPORATION
-
Publication number: 20130121908Abstract: The present invention relates to a method for producing trichlorosilane having a reduced amount of boron compounds. The method including: (A) reacting metallurgical grade silicon with hydrogen chloride in a fluidized-bed reactor to produce a reaction gas including trichlorosilane; (B) first distilling the reaction gas, for separating first vapor fractions and first residue fractions, by setting a distillation temperature at a top of a distillation column between about a boiling point of trichlorosilane and about a boiling point of tetrachlorosilane and feeding the first vapor fractions to a second distillation column; (C) second distilling, for separating the trichlorosilane and second vapor fractions including boron compounds, by setting a distillation temperature at a top of the distillation column between about a boiling point of dichlorosilane and about a boiling point of trichlorosilane; and (D) feeding back the second vapor fractions to the fluidized-bed reactor.Type: ApplicationFiled: December 28, 2012Publication date: May 16, 2013Applicants: MITSUBISHI MATERIALS CORPORATION, Mitsubishi Polycrystalline Silicon America Corporation (MIPSA)Inventors: Mitsubishi Polycrystalline Silicon America Corporation (MIPSA), MITSUBISHI MATERIALS CORPORATION
-
Publication number: 20130108382Abstract: Disclosed herein is an end mill capable of preventing an increase in cutting resistance, chipping, or damage due to cutting chip clogging from being generated in each bottom cutting edge having a small pitch in a rotational direction side of the end mill even when the pitches between the bottom cutting edges in a circumferential direction of each thereof differ from one another. An end mill includes an end mill body which is rotated about an axis thereof; an odd number of five or more outer peripheral cutting edges formed around a front end portion of the end mill body; and bottom cutting edges which are formed at the front end of the end mill body so as to respectively extend from the tips of the outer peripheral cutting edges toward the axis, wherein the outer peripheral cutting edges have different helix angles with respect to the axis.Type: ApplicationFiled: October 2, 2012Publication date: May 2, 2013Applicant: MITSUBISHI MATERIALS CORPORATIONInventor: MITSUBISHI MATERIALS CORPORATION
-
Publication number: 20130099032Abstract: An apparatus for fracturing in which: a fracturing tooth is formed so as to have a larger base part than a top end; a fixing cover is formed along a longitudinal direction of rolls and is provided with fixing holes for fracturing teeth arranged along the longitudinal direction, expanded parts which are formed by expanding both sides of the fixing holes, and an indented part which is formed by narrowing a part between the fixing holes with respect to the expanded parts; the base part of the fracturing tooth is held between the roll and the fixing cover fixed on the roll and the indented part and the expanded part of the adjacent fixing cover are engaged with each other in fracturing teeth unit, so that the fracturing teeth are arranged in a staggered manner.Type: ApplicationFiled: October 16, 2012Publication date: April 25, 2013Applicant: MITSUBISHI MATERIALS CORPORATIONInventor: Mitsubishi Materials Corporation
-
Publication number: 20130099031Abstract: An apparatus for fracturing in which: a fracturing tooth is formed so that a base-end portion has a larger diameter than that of a top-end portion, and a tapered part is formed at the base-end portion so as to expand from the top toward the base; a fixing cover is formed along a longitudinal direction of rolls; in the fixing cover, fixing holes for fracturing teeth are formed along the longitudinal direction so that the fracturing tooth is inserted therein; each of the fixing holes has a slope in which the tapered part is in contact at a surface; a fracturing teeth unit is fixed to the roll in a state in which the top-end portion of the fracturing tooth is protruded from the fixing hole radially-outwardly of the roll and the tapered part is wedged between the slope of the fixing hole and the roll.Type: ApplicationFiled: October 16, 2012Publication date: April 25, 2013Applicant: MITSUBISHI MATERIALS CORPORATIONInventor: MITSUBISHI MATERIALS CORPORATION