Abstract: A bonding material is described that is well suited to bonding polymer films, such as polyester films, to other substrates. In one embodiment, for instance, the bonding material can be used to bond a polyester film to a layer containing an ethylene-vinyl acetate copolymer to form a backing material for a photovoltaic device. The bonding material generally comprises a polymer component combined with a cross-linking agent. The polymer component may comprise an alkylene carboxylic acid copolymer, such as an ethylene acrylic acid copolymer or an ethylene methacrylic acid copolymer. In an alternative embodiment, the polymer component may comprise a phenoxy resin. The cross-linking agent, on the other hand may comprise an oxazoline polymer.