Patents by Inventor Mitsugu Katsumi

Mitsugu Katsumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8201722
    Abstract: A resonator for joining metal members utilizing ultrasonic vibration includes an ultrasonic horn having a length of at least half wavelength of a resonance frequency of ultrasonic vibration transmitted from a vibrator, and a joining tool provided on the ultrasonic horn so as to project in a direction normal to a vibration transmission direction of the ultrasonic horn at a position of a point of a maximum vibration amplitude of the ultrasonic horn. The joining tool is formed into a linear bar made of a material excellent in acoustic property and is provided on a distal end thereof with a tool head projecting laterally.
    Type: Grant
    Filed: June 3, 2010
    Date of Patent: June 19, 2012
    Assignee: Ultex Corporation
    Inventors: Shigeru Sato, Mayumi Kouya, Mitsugu Katsumi, Ryoichi Ishii, Takahiro Ito
  • Publication number: 20110174347
    Abstract: A resonator is used for ultrasonic machining and attached to the side or bottom of a liquid tank so as to pass through the liquid tank used in ultrasonic machining equipment for dipping a workpiece part in machining liquid given supersonic vibration. The resonator includes a working vessel formed in one end of the resonator within the liquid tank as a dent opening upward so as to enable the workpiece part to be inserted therein from above and part of the machining liquid in the liquid tank to be accommodated therein as separated from the machining liquid in the liquid tank.
    Type: Application
    Filed: January 15, 2010
    Publication date: July 21, 2011
    Applicant: ULTEX CORPORATION
    Inventors: Shigeru SATO, Mayumi KOUYA, Mitsugu KATSUMI, Ryoichi ISHII, Takahiro ITO, Hideyuki OBATA
  • Publication number: 20100320255
    Abstract: A resonator for joining metal members utilizing ultrasonic vibration includes an ultrasonic horn having a length of at least half wavelength of a resonance frequency of ultrasonic vibration transmitted from a vibrator, and a joining tool provided on the ultrasonic horn so as to project in a direction normal to a vibration transmission direction of the ultrasonic horn at a position of a point of a maximum vibration amplitude of the ultrasonic horn. The joining tool is formed into a linear bar made of a material excellent in acoustic property and is provided on a distal end thereof with a tool head projecting laterally.
    Type: Application
    Filed: June 3, 2010
    Publication date: December 23, 2010
    Applicant: ULTEX CORPORATION
    Inventors: Shigeru SATO, Mayumi Kouya, Mitsugu Katsumi, Ryoichi Ishii, Takahiro Ito
  • Patent number: 7854247
    Abstract: An ultrasonic vibration bonding resonator includes a resonance body, bonding working portions having a bonding working face and provided at a point of maximum oscillation on upper and lower surfaces of the resonance body and support portions provided at two points of minimum oscillation apart from the bonding working portions to opposite sides in a direction of ultrasonic vibration as projecting from front and back surfaces of the resonance body. It includes a resonance body, tool-attaching portions provided at a point of maximum oscillation on upper and lower surfaces of the resonance body, a bonding working portion having a bonding working face and attached to one of the tool-attaching portions, and support portions provided at two points of minimum oscillation apart from the bonding working portion to opposite sides in a direction of ultrasonic vibration as projecting from front and back surfaces of the resonance body.
    Type: Grant
    Filed: September 10, 2008
    Date of Patent: December 21, 2010
    Assignee: Ultex Corporation
    Inventors: Shigeru Sato, Mayumi Kouya, Mitsugu Katsumi, Ryoichi Ishii
  • Publication number: 20090266869
    Abstract: An ultrasonic vibration bonding resonator includes a resonance body, bonding working portions having a bonding working face and provided at a point of maximum oscillation on upper and lower surfaces of the resonance body and support portions provided at two points of minimum oscillation apart from the bonding working portions to opposite sides in a direction of ultrasonic vibration as projecting from front and back surfaces of the resonance body. Otherwise, it includes a resonance body, tool-attaching portions provided at a point of maximum oscillation on upper and lower surfaces of the resonance body, a bonding working portion having a bonding working face and attached to one of the tool-attaching portions with a screw, support portions provided at two points of minimum oscillation apart from the bonding working portion to opposite sides in a direction of ultrasonic vibration as projecting from front and back surfaces of the resonance body.
    Type: Application
    Filed: September 10, 2008
    Publication date: October 29, 2009
    Applicant: ULTEX CORPORATION
    Inventors: Shigeru SATO, Mayumi KOUYA, Mitsugu KATSUMI, Ryoichi ISHII
  • Patent number: 6491785
    Abstract: An ultrasonic vibration bonding machine which enables appropriate bonding by selecting a pressure curve according to the sizes of portions to be bonded together and the physical properties of their materials and the like. Pressure inside the pressure chamber of an air cylinder which is a pressure control unit for bonding work and the normal rotation and reverse rotation of a motor which constitutes part of a vertical drive unit for bonding work are controlled to bond together a first member and a second member with ultrasonic vibration under pressure which rises from a first pressure set value to a second pressure value from a vibration start time.
    Type: Grant
    Filed: June 20, 2000
    Date of Patent: December 10, 2002
    Assignee: Ultex Corporation
    Inventors: Shigeru Sato, Mitsugu Katsumi, Seiya Nakai
  • Patent number: 5931367
    Abstract: A resonator for an ultrasonic bonding apparatus, which comprises an ultrasonic horn having a recessed portion in the exterior surface and a threaded hole, a bonding working portion having a chip base fitted in the recessed portion and a chip body provided on the chip base, and a screw member having a screw portion to fit into the threaded hole and a through-hole through which the chip body is put without contact with said screw member so that the screw member is screwed into the threaded hole, the bonding portion is fixed to the ultrasonic horn, with the chip body projecting through the through-hole for contact with a workpiece.
    Type: Grant
    Filed: May 15, 1997
    Date of Patent: August 3, 1999
    Assignee: Ultex Corporation
    Inventors: Shigeru Sato, Mitsugu Katsumi, Seiya Nakai
  • Patent number: 5884833
    Abstract: A support portion for attaching a horn main body to a solder tank is provided on the horn main body at a nodal point f2 and ultrasonic vibration from an external transducer is transmitted to solder in the solder tank through the horn main body.
    Type: Grant
    Filed: April 17, 1997
    Date of Patent: March 23, 1999
    Assignee: Ultex Corporation
    Inventors: Shigeru Sato, Mitsugu Katsumi, Ryoichi Ishii
  • Patent number: 5884831
    Abstract: An ultrasonic vibration bonding chip mounter includes a chip carrying unit arranged above a chip supply unit, a prealignment unit and a mounting unit which are arranged in a row and having a movable table which can move back and forth in a direction parallel to a direction where these units are arranged, a pick-up unit, attached to the movable table, for transferring a chip from the chip supply unit to the prealignment unit, and an ultrasonic vibration bonding unit, attached to the movable table, for transferring the chip from the prealignment unit to a mounting unit so that the chips are transferred from the chip supply unit to the prealignment unit and further to the mounting unit by the reciprocation of the movable table one by one.
    Type: Grant
    Filed: April 24, 1997
    Date of Patent: March 23, 1999
    Assignee: Ultex Corporation
    Inventors: Shigeru Sato, Mitsugu Katsumi, Seiya Nakai
  • Patent number: 5730832
    Abstract: To stabilize bonding strength by concentrating bonding energy upon members to be bonded together, when an overlapped interface of a plurality of members to be bonded together is to be bonded by ultrasonic vibration, heaters 6 and 7 are caused to generate heat to heat the bonding working portion 3d of a resonator 2, whereby bonding energy generated by ultrasonic vibration and bonding energy generated by heating are provided to the interface so that bonding energy can be concentrated upon the interface without increasing the energy of ultrasonic vibration and bonding strength can be stabilized. Further, when electric heaters are used as the heaters 6 and 7, operationability is improved. Moreover, when heater holes 3e and 3f are formed in the resonator 2 and electric heaters are fitted into the holes 3e and 3f, heater installation work is facilitated. The heater may be provided in the mount.
    Type: Grant
    Filed: August 20, 1996
    Date of Patent: March 24, 1998
    Assignee: Ultex Corporation
    Inventors: Shigeru Sato, Mitsugu Katsumi, Seiya Nakai