Patents by Inventor Mitsugu Shirai
Mitsugu Shirai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6795105Abstract: A laser printing apparatus is formed by a laser oscillator 10, galvano mirrors 42, 44 for scanning the laser light emitted from the laser oscillator 10, and an f&thgr; lens 40 for focusing the laser light emitted from the laser oscillator 10 on MCCs 32, 34 serving as the member to be printed. The laser oscillator 10 is an YLF laser oscillator which emits the laser light of the third harmonics in the ultraviolet range. The laser printing is performed on the MCCs 32, 34 serving as the member to be printed by using the laser light emitted from the laser oscillator 10.Type: GrantFiled: March 13, 2002Date of Patent: September 21, 2004Assignee: Hitachi, Ltd.Inventors: Kaoru Katayama, Kenichi Inoue, Mitsugu Shirai, Tsutomu Sakamoto
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Patent number: 6705505Abstract: A soldering system which reduces the numbers of steps for paste supply and soldering onto a printed circuit board. A printed circuit board has through holes through which a lead of each provided part is to be inserted. A printing mask is matched with the through holes and a paste receiving plate having holes to which solder paste is supplied corresponding to the through holes is disposed. A printing roller is swept by forcibly rotating it to fill with solder paste, then a printing squeegee follows the printing roller to further fill through holes. Parts are loaded on the through holes and reflowing is carried out on the printed circuit board and paste receiving plate, so that the parts are soldered to the printed circuit board.Type: GrantFiled: October 24, 2002Date of Patent: March 16, 2004Assignee: Hitachi, Ltd.Inventors: Fumio Yoshikawa, Hideyuki Fukasawa, Mitsugu Shirai, Hideaki Sasaki, Toshitaka Murakawa, Kenichi Hamamura
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Patent number: 6551449Abstract: Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.Type: GrantFiled: January 4, 2001Date of Patent: April 22, 2003Assignee: Hitachi, Ltd.Inventors: Keiji Fujikawa, Yutaka Hashimoto, Isamu Takaoka, Shinichi Kazui, Hideaki Sasaki, Hitoshi Odashima, Mitsugu Shirai
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Publication number: 20030057264Abstract: A soldering system which reduces the numbers of steps for paste supply and soldering onto a printed circuit board. A printed circuit board has through holes through which a lead of each provided part is to be inserted. A printing mask is matched with the through holes and a paste receiving plate having holes to which solder paste is supplied corresponding to the through holes is disposed. A printing roller is swept by forcibly rotating it to fill with solder paste, then a printing squeegee follows the printing roller to further fill through holes. Parts are loaded on the through holes and reflowing is carried out on the printed circuit board and paste receiving plate, so that the parts are soldered to the printed circuit board.Type: ApplicationFiled: October 24, 2002Publication date: March 27, 2003Inventors: Fumio Yoshikawa, Hideyuki Fukasawa, Mitsugu Shirai, Hideaki Sasaki, Toshitaka Murakawa, Kenichi Hamamura
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Patent number: 6533162Abstract: An improved soldering system which reduces the numbers of steps for paste supply and soldering in soldering lead provided parts and surface mounting parts onto a printed circuit board. A printed circuit board has through holes through which a lead of each lead provided part is to be inserted and lands for surface mounting parts. A printing mask is matched with the through holes and lands and a paste receiving plate having holes to which solder paste is to be supplied corresponding to each of the through holes is disposed. A printing roller is swept by forcibly rotating it so as to fill with solder paste, then a printing squeegee is swept following that printing roller so as to further fill with solder paste.Type: GrantFiled: December 11, 2000Date of Patent: March 18, 2003Assignee: Hitachi, Ltd.Inventors: Fumio Yoshikawa, Hideyuki Fukasawa, Mitsugu Shirai, Hideaki Sasaki, Toshitaka Murakawa, Kenichi Hamamura
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Patent number: 6471115Abstract: The present invention is a process for manufacturing an electronic circuit device by applying a solder material to electronic parts or electrodes on a printed circuit board; the process comprising the steps of removing an initial surface oxide film and an organic contaminant film from the surfaces of the solder material and electrode, covering the solder material and an area to which solder is to be applied which is comprised of the electrode, with a liquid vaporizing up after the bonding is completed in the step of heat-melting the solder material, to thereby prevent reoxidation of the joining area surface, and heat-melting the solder material, to carry out solder bonding without using any flux.Type: GrantFiled: June 2, 2000Date of Patent: October 29, 2002Assignee: Hitachi, Ltd.Inventors: Masahito Ijuin, Toru Nishikawa, Ryohei Sato, Mitsugu Shirai, Yuzo Taniguchi, Kosuke Inoue, Masahide Harada, Tetsuya Hayashida
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Patent number: 6433810Abstract: A laser printing apparatus is formed by a laser oscillator 10, galvano mirrors 42, 44 for scanning the laser light emitted from the laser oscillator 10, and an f&thgr; lens 40 for focusing the laser light emitted from the laser oscillator 10 on MCCs 32, 34 serving as the member to be printed. The laser oscillator 10 is an YLF laser oscillator which emits the laser light of the third harmonics in the ultraviolet range. The laser printing is performed on the MCCs 32, 34 serving as the member to be printed by using the laser light emitted from the laser oscillator 10.Type: GrantFiled: March 9, 2000Date of Patent: August 13, 2002Assignee: Hitachi, Ltd.Inventors: Kaoru Katayama, Kenichi Inoue, Mitsugu Shirai, Tsutomu Sakamoto
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Publication number: 20020093562Abstract: A laser printing apparatus is formed by a laser oscillator 10, galvano mirrors 42, 44 for scanning the laser light emitted from the laser oscillator 10, and an f&thgr; lens 40 for focusing the laser light emitted from the laser oscillator 10 on MCCs 32, 34 serving as the member to be printed. The laser oscillator 10 is an YLF laser oscillator which emits the laser light of the third harmonics in the ultraviolet range. The laser printing is performed on the MCCs 32, 34 serving as the member to be printed by using the laser light emitted from the laser oscillator 10.Type: ApplicationFiled: March 13, 2002Publication date: July 18, 2002Applicant: Hitachi, Ltd.Inventors: Kaoru Katayama, Kenichi Inoue, Mitsugu Shirai, Tsutomu Sakamoto
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Patent number: 6410881Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.Type: GrantFiled: June 18, 2001Date of Patent: June 25, 2002Assignee: Hitachi, Ltd.Inventors: Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai, Mitsunori Tamura
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Publication number: 20010050138Abstract: Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.Type: ApplicationFiled: January 4, 2001Publication date: December 13, 2001Applicant: Hitachi, Ltd.Inventors: Keiji Fujikawa, Yutaka Hashimoto, Isamu Takaoka, Shinichi Kazui, Hideaki Sasaki, Hitoshi Odashima, Mitsugu Shirai
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Publication number: 20010039725Abstract: This invention provides a process for manufacturing electronic circuits, according to which soldering can be carried out without using flux by applying a metal surface treatment procedure which allows oxide film, organic matters, carbon or the like on the surface of metal to be easily removed without using complex process nor unfavorably affecting electronic devices or circuit substrates.Type: ApplicationFiled: June 18, 2001Publication date: November 15, 2001Applicant: Hitachi, Ltd.Inventors: Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai, Mitsunori Tamura
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Patent number: 6269998Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.Type: GrantFiled: November 3, 2000Date of Patent: August 7, 2001Assignee: Hitachi, Ltd.Inventors: Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai, Mitsunori Tamura
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Publication number: 20010000906Abstract: An improved soldering system which reduces the numbers of steps for paste supply and soldering in soldering lead provided parts and surface mounting parts onto a printed circuit board. A printed circuit board has through holes through which a lead of each lead provided part is to be inserted and lands for surface mounting parts. A printing mask is matched with the through holes and lands and a paste receiving plate having holes to which solder paste is to be supplied corresponding to each of the through holes is disposed. A printing roller is swept by forcibly rotating it so as to fill with solder paste, then a printing squeegee is swept following that printing roller so as to further fill with solder paste.Type: ApplicationFiled: December 11, 2000Publication date: May 10, 2001Inventors: Fumio Yoshikawa, Hideyuki Fukasawa, Mitsugu Shirai, Hideaki Sasaki, Toshitaka Murakawa, Kenichi Hamamura
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Patent number: 6203655Abstract: Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.Type: GrantFiled: November 23, 1998Date of Patent: March 20, 2001Assignee: Hitachi, Ltd.Inventors: Keiji Fujikawa, Yutaka Hashimoto, Isamu Takaoka, Shinichi Kazui, Hideaki Sasaki, Hitoshi Odashima, Mitsugu Shirai
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Patent number: 6193144Abstract: An improved soldering system which reduces the numbers of steps for paste supply and soldering in soldering lead provided parts and surface mounting parts onto a printed circuit board. A printed circuit board has through holes through which a lead of each lead provided part is to be inserted and lands for surface mounting parts. A printing mask is matched with the through holes and lands and a paste receiving plate having holes to which solder paste is to be supplied corresponding to each of the through holes is disposed. A printing roller is swept by forcibly rotating it so as to fill with solder paste, then a printing squeegee is swept following that printing roller so as to further fill with solder paste.Type: GrantFiled: June 22, 1998Date of Patent: February 27, 2001Assignee: Hitachi, Ltd.Inventors: Fumio Yoshikawa, Hideyuki Fukasawa, Mitsugu Shirai, Hideaki Sasaki, Toshitaka Murakawa, Kenichi Hamamura
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Patent number: 6161748Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.Type: GrantFiled: March 30, 2000Date of Patent: December 19, 2000Assignee: Hitachi, Ltd.Inventors: Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai, Mitsunori Tamura
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Patent number: 6137687Abstract: In a method for manufacturing a printed circuit board, this printed circuit board can be manufactured by executing a simple manufacturing step within a short time period at in low cost without requiring a complex manufacturing process. A conductive material is pattern-printed on a base board and the printed conductive material is hardened to form a first conductor layer. Subsequently, an insulating material is pattern-printed on the first conductor layer, and the printed insulating material is hardened to thereby form a first insulating layer. A manufacturing step similar to the above-described step is repeatedly performed to thereby form a second conductor layer, a second insulating layer, and a third conductor layer. Furthermore, a manufacturing step similar to the above-explained step is repeatedly performed, so that a printed circuit board having a multi-conductor layer can be manufactured.Type: GrantFiled: January 19, 2000Date of Patent: October 24, 2000Assignee: Hitachi, Ltd.Inventors: Mitsugu Shirai, Shinichi Kazui, Hideaki Sasaki, Keiji Fujikawa, Makoto Matsuoka
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Patent number: 6133135Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.Type: GrantFiled: June 1, 1999Date of Patent: October 17, 2000Assignee: Hitachi, Ltd.Inventors: Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai, Mitsunori Tamura
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Patent number: 5973406Abstract: An electronic device is solder bonded properly without using fluxes nor precise positioning with respect to a substrate. A bond pad with a size about twice the size of terminal pad of the electronic device is formed in a region on the substrate where the electronic device is to be mounted. After placing the electronic device of the substrate surface, the whole unit is heated in a nitrogen atmosphere to melt a bump formed on the terminal pad of the electronic device. The molten solder wets and spreads over the bond pads formed on the substrate, thereby establishing reflow soldering between the bond pads and the terminal pads. The position of the electronic device with respect to the substrate is spontaneously corrected due to a self-alignment function induced by wetting and spreading of the molten solder over the bond pad of the substrate.Type: GrantFiled: August 25, 1997Date of Patent: October 26, 1999Assignee: Hitachi, Ltd.Inventors: Masahide Harada, Toru Nishikawa, Ryohei Satoh, Osamu Yamada, Takayuki Uda, Mitsugu Shirai
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Patent number: 5940728Abstract: A process for manufacturing electronic circuits, according to which soldering can be carried out without using flux by applying a metal surface treatment procedure which allows oxide film, organic matters, carbon or the like on the surface of metal to be easily removed without using a complex process nor unfavorably affecting electronic devices or circuit substrates. A process of connecting an electronic device and a circuit substrate by means of solder comprises the steps of irradiating the solder with a laser beam to clean the solder, aligning and mounting the electronic device on the circuit substrate, and hot-melting said solder in a low-oxygen content atmosphere to bond the electronic device and the circuit substrate.Type: GrantFiled: May 15, 1996Date of Patent: August 17, 1999Assignee: Hitachi, Ltd.Inventors: Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai, Mitsunori Tamura