Patents by Inventor Mitsugu Sumitani

Mitsugu Sumitani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat sink for portable electronic devices
    Patent number: 6164368
    Abstract: A heat sink for use in a portable electronic device for disposing of the heat generated by an electronic component of the device, the heat sink comprising in its entirety a metal clad plate composed of two metal sheets and having a nonbonded portion in a required pattern, the nonbonded portion providing a heat pipe portion formed by outwardly inflating at least one of the two metal sheets of the nonbonded portion to make a hollow portion and enclosing a working liquid in the hollow portion, the metal clad plate having on one surface thereof a mount portion for the electronic component at a region thereof where the heat pipe portion is partly present, the heat pipe portion having a heat receiving portion at the region thereof where the mount portion is present. When a heat-generating electronic component is attached to the mount portion, the working liquid in the heat receiving portion is heated with the heat produced by the component to evaporate.
    Type: Grant
    Filed: June 23, 1999
    Date of Patent: December 26, 2000
    Assignee: Showa Aluminum Corporation
    Inventors: Yuichi Furukawa, Mitsugu Sumitani, Tomio Ito
  • Heat sink for portable electronic devices
    Patent number: 5937936
    Abstract: A heat sink for use in a portable electronic device for disposing of the heat generated by an electronic component of the device, the heat sink comprising in its entirety a metal clad plate composed of two metal sheets and having a nonbonded portion in a required pattern, the nonbonded portion providing a heat pipe portion formed by outwardly inflating at least one of the two metal sheets of the nonbonded portion to make a hollow portion and enclosing a working liquid in the hollow portion, the metal clad plate having on one surface thereof a mount portion for the electronic component at a region thereof where the heat pipe portion is partly present, the heat pipe portion having a heat receiving portion at the region thereof where the mount portion is present. When a heat-generating electronic component is attached to the mount portion, the working liquid in the heat receiving portion is heated with the heat produced by the component to evaporate.
    Type: Grant
    Filed: August 29, 1997
    Date of Patent: August 17, 1999
    Assignee: Showa Aluminum Corporation
    Inventors: Yuichi Furukawa, Mitsugu Sumitani, Tomio Ito