Abstract: A semiconductor insulation structure is disclosed for a semiconductor module, incorporating therein a semiconductor element, with which an electrically conductive structural body is held in pressured contact via an intervening insulation member. The semiconductor insulation structure includes a deformation preventing structure to avoid the insulation member from deforming when applied with load thereto. In one aspect, the deformation preventing structure includes a deformation resistant abutment surface, formed on the semiconductor module, and a readily deforming abutment surface formed on the electrically conductive structural body. In another aspect, the deformation preventing structure includes a reinforcement formed on a cooler and held in contact with the insulation member in an area placed in opposition to an outer circumferential periphery of the semiconductor module.