Abstract: A probe according to an embodiment is a probe used in inspecting an electronic device. The probe includes an end portion capable of contacting a surface of an electrode of the electronic device. The end portion has a recessed portion.

Abstract: An inspection apparatus for an electronic device is provided. The electronic device includes a substrate and an electrode located on the substrate. The inspection apparatus includes a support to support the electronic device, a probe to be brought into contact with a surface of the electrode, a temperature adjusting device configured to adjust at least one of a temperature of the surface of the electrode and a temperature of the probe such that the temperature of the surface of the electrode and the temperature of the probe are different from each other, and a temperature measuring device configured to measure the temperature of the surface of the electrode.

Abstract: An optical coupling device including a plurality of optical fibers, each including first and second bared optical fiber portions, and first and second coated optical fiber portions; a holder including a first component having a first surface and a rear end, a second component disposed on the first surface of the first component and on the first bared optical fiber portions, and an adhesive resin body disposed between the first surface of the first component and the second component; a first resin body in contact with the first coated optical fiber portions and the first component; and a second resin body extending along the rear end of the first component and covering the first coated optical fiber portions. The first resin body is disposed between the adhesive resin body and the second resin body. The second resin body has a lower Young's modulus than the first resin body.

Abstract: An optical connecting device includes: a holder part having first and second holder members and a resin body therebetween; and multiple optical fibers each having first and second resin-uncoated fiber portions and the first and second resin-coated fiber portions. The first resin-uncoated fiber portion is disposed between first portions of the first and second holder members so as to extend in a direction of a first axis and be arranged along a first reference plane. The second resin-uncoated fiber portion and the first resin-coated fiber portion extend between second portions of the first and second holder members. One of the first and second holder members has a through-hole, extending along a second axis intersecting the first axis in the second portions thereof, receiving the resin body. The first and second holder members have first and second inner faces, separated away from the first reference plane, in the second portions, respectively.

Abstract: An optical coupling device including a plurality of optical fibers, each including a first and a second bared optical fiber portions, and a first and a second coated optical fiber portions; a holder including a first component having a first surface and a rear end, a second component disposed on the first surface and on the first bared optical fiber portions, and an adhesive resin body disposed between the first surface and the second component; a first resin body in contact with the first coated optical fiber portions and the first component; and a second resin body extending along the rear end of the first component and covering the first coated optical fiber portions. The first resin body is disposed between the adhesive resin body and the second resin body. The second resin body has a lower Young's modulus than the first resin body.

Abstract: A method for fabricating an optical connecting device with a holder having a through hole, multiple optical fibers, a guide member, and a resin body includes steps of: preparing optical-fiber parts to provide the multiple optical fibers; preparing first and second parts to provide the holder, the first and second parts having grooves for providing the through hole of the holder; fixing the parts providing the holder and the optical-fiber parts to each other to form a first product having the through hole produced from the grooves; providing an optical connector tool; positioning a component of the tool in the through hole of the first product to provide the guide member; and thereafter, fixing the component in the through hole with resin to form a second product in which the resin provides the resin body.

Abstract: An optical connecting device includes a holder including a first component including a first outer part having a first ridge, a second outer part having a second ridge and an inner part having a bottom of a recess being defined by the first ridge and the second ridge, a second component being located between the first ridge of the first outer part and the second ridge of the second outer part, and an adhesive member being provided between the first component and the second component; and a plurality of optical fibers being arrayed between the bottom of the first component and the second component, wherein the optical fibers, the first ridge, and the second ridge extend in a direction of a first axis, and the first outer part, the inner part, and the second outer part are arrayed in a direction of a second axis crossing the first axis.

Abstract: An optical connecting device includes: a holder part having first and second holder members and a resin body therebetween; and multiple optical fibers each having first and second resin-uncoated fiber portions and the first and second resin-coated fiber portions. The first resin-uncoated fiber portion is disposed between first portions of the first and second holder members so as to extend in a direction of a first axis and be arranged along a first reference plane. The second resin-uncoated fiber portion and the first resin-coated fiber portion extend between second portions of the first and second holder members. One of the first and second holder members has a through-hole, extending along a second axis intersecting the first axis in the second portions thereof, receiving the resin body. The first and second holder members have first and second inner faces, separated away from the first reference plane, in the second portions, respectively.

Abstract: An optical processing apparatus includes: a circuit hoard having first and second areas arranged in a direction of a first axis; a semiconductor device having an optical coupling element; an optical connector having an optical fiber and a holder with first and second holder parts, and the optical connector being supported by the second area and the semiconductor device disposed on the first area; and a supporting base having a thickness smaller than that of the semiconductor device. The supporting base is disposed between the second holder part and the second area. The optical fiber has a first optical fiber portion supported by the first holder part, and a second optical fiber portion held by the first and second holder parts. The first optical fiber portion has a tip end and a cladding face which is positioned with respect to the optical coupling element and is separated apart from the semiconductor device.

Abstract: An optical connecting device includes: a holder; an optical fiber supported by the holder; and a guide part supported by the holder. The holder includes first and second resin bodies arranged apart from each other, a supporting part, and a first lid part, a supporting groove, and a groove. The connecting device features: the first resin body being in contact with the optical fiber between the supporting part and the first lid part, the guide part being supported in the groove, the second resin body bonding the guide part to the supporting part, the optical fiber extending in the support groove in the principal surface of the supporting part, and the first lid part being disposed apart from the guide part on the optical fiber, and the optical fiber being between the supporting part and the first lid part.

Abstract: A semiconductor device includes: a printed substrate having a through hole from an upper face to a lower face thereof; a first semiconductor element mounted on the printed substrate; an interposer mounted on the upper face of the printed substrate; a second semiconductor element adjacent to the interposer and arranged to overlap with the through hole; and a bonding wire coupling a first pad to a second pad, the first pad being on an upper face of the interposer and being positioned on the second semiconductor element side, the second pad being on an upper face of the second semiconductor element and being positioned on the interposer side, wherein the interposer has an edge face protruding with respect to a wall face of the through hole of the printed substrate toward the second semiconductor element, and the edge face faces with an edge face of the second semiconductor element.

Abstract: An optical processing apparatus includes: a circuit board having first and second areas arranged in a direction of a first axis; a semiconductor device having an optical coupling element; an optical connector having an optical fiber and a holder with first and second holder parts, and the optical connector being supported by the second area and the semiconductor device disposed on the first area; and a supporting base having a thickness smaller than that of the semiconductor device. The supporting base is disposed between the second holder part and the second area. The optical fiber has a first optical fiber portion supported by the first holder part, and a second optical fiber portion held by the first and second holder parts. The first optical fiber portion has a tip end and a cladding face which is positioned to the optical coupling element and separated apart from the semiconductor device.

Abstract: A method for fabricating an optical connecting device includes: preparing a product for an optical connecting device which includes first and second parts for a holder, and optical fibers extending in a direction of a first axis between first faces of the first and second parts, the first and second parts of the product being arranged in a direction of a second axis intersecting that of the first axis, the first faces of the first part and the first face of the second part extending in the direction of the first axis and a direction of a third axis, and the third axis intersecting the direction of the first axis and the direction of the second axis; and moving one of a processing device and the product relative to the other to process the product in the direction of the second axis so as to reach the optical fibers.

Abstract: An optical connecting device includes: a holder having a first end, a second end, and a through hole extending in a direction of a first axis from one of the first end and the second end to the other; multiple optical fibers held by the holder; a guide member extending in the through hole; and a resin body separating a side face of the guide member from an inner face of the through hole.

Abstract: A stub device includes: a holder having a first portion and a second portion, the first portion and the second portion being arranged in a direction of a first axis, the first portion having a first end face and a second end face, and the second portion having an installation face; and optical fibers held by the holder to extend in the direction of the first axis. Core ends of the optical fibers and the first end face are arranged along a first reference plane. The second end face and the installation face extend along second and third reference planes, respectively, which are inclined with the first reference plane at acute angles. The second end face is apart from cores of the optical fibers in the first portion, and the installation face having a surface roughness larger than that of the second end face.

Abstract: An optical connecting device includes: a holder; an optical fiber supported by the holder; and a guide part supported by the holder including first and second resin bodies, a supporting part, and a first lid part, the supporting part having a principal surface and a groove extending in a direction of a first axis the groove having first and second faces, the first resin body being in contact with the optical fiber between the supporting part and the first lid part, the guide part being supported in the groove, the second resin body bonding the guide part to the supporting part, the optical fiber extending in the direction of the first axis on the principal surface of the supporting part, and the first lid part being disposed apart from the guide part on the optical fiber, the optical fiber being between the supporting part and the first lid part.

Abstract: A semiconductor device includes: a printed substrate having a through hole from an upper face to a lower face thereof; a first semiconductor element mounted on the printed substrate; an interposer mounted on the upper face of the printed substrate; a second semiconductor element adjacent to the interposer and arranged to overlap with the through hole; and a bonding wire coupling a first pad to a second pad, the first pad being on an upper face of the interposer and being positioned on the second semiconductor element side, the second pad being on an upper face of the second semiconductor element and being positioned on the interposer side, wherein the interposer has an edge face protruding with respect to a wall face of the through hole of the printed substrate toward the second semiconductor element, and the edge face faces with an edge face of the second semiconductor element.

Abstract: An optical connecting device includes: a holder having a first side face extending in a direction of a first axis, and first and second parts arranged arranged in a direction of a second axis intersecting the first axis; a guiding member having a side face extending in the direction of the first axis; optical fibers extending in the direction of the first axis, and a resin body disposed between the first and second parts, the first part having a first portion with a first groove extending in the direction of the second axis, and a second portion with a first opening extending from the first side face to the first groove. The resin body is disposed in the first opening and between the side face of the guiding member and the first groove and between the side face of the guiding member and the first portion of the first part.

Abstract: To provide an optical probe for OCT and a method of manufacturing the optical probe that can reduce reflected light generated at a boundary portion between an optical fiber and a lensed fiber. An optical probe for OCT includes an optical fiber that transmits irradiation light and back-scattered light and a lensed fiber that is fusion spliced to an end face of the optical fiber, that emits irradiation light toward the inside of a living body while collimating the irradiation light, and that collects and guides back-scattered light to the end face of the optical fiber. A refractive index adjusting material is added to the lensed fiber, and the refractive index adjusting material is diffused in an end part of the optical fiber.

Abstract: To provide an optical probe for OCT and a method of manufacturing the optical probe that can reduce reflected light generated at a boundary portion between an optical fiber and a lensed fiber. An optical probe for OCT includes an optical fiber that transmits irradiation light and back-scattered light and a lensed fiber that is fusion spliced to an end face of the optical fiber, that emits irradiation light toward the inside of a living body while collimating the irradiation light, and that collects and guides back-scattered light to the end face of the optical fiber. A refractive index adjusting material is added to the lensed fiber, and the refractive index adjusting material is diffused in an end part of the optical fiber.