Abstract: A first connection portion is located on one side of a predetermined flow path member in a plane direction. The predetermined flow path member and another flow path member are bonded by brazing at the first connection portion. A second connection portion is located on the other side of the predetermined flow path member. The predetermined flow path member and another flow path member are bonded by brazing at the second connection portion. A brazing material layer extends over the predetermined flow path member, the first connection portion, and the second connection portion. A hilling portion is a portion of the predetermined flow path member. The hilling portion is curved to protrude toward a side on which the brazing material layer is provided. The hilling portion extends along a direction in which the first connection portion or the second connection portion extends.

Abstract: A first connection portion is located on one side of a predetermined flow path member in a plane direction. The predetermined flow path member and another flow path member are bonded by brazing at the first connection portion. A second connection portion is located on the other side of the predetermined flow path member. The predetermined flow path member and another flow path member are bonded by brazing at the second connection portion. A brazing material layer extends over the predetermined flow path member, the first connection portion, and the second connection portion. A hilling portion is a portion of the predetermined flow path member. The hilling portion is curved to protrude toward a side on which the blazing material layer is provided. The hilling portion extends along a direction in which the first connection portion or the second connection portion extends.

Abstract: A heat exchanger includes: stacked tubes through which a refrigerant flows; and a fin joined to the tube to increase a heat exchange area with air flowing around the tube. A cross-section of the fin perpendicular to a flow direction of the air is shaped in a wave shape that has: planar sections substantially parallel to the flow direction of the air; and a top for connecting between the adjacent planar sections. A clearance is defined in the planar section of the fin. When a portion of the fin where the shortest distance from a center line between the adjacent planar sections becomes the maximum is set as a furthest section in a cross-section perpendicular to a stacking direction of the tubes, the clearance is defined in one furthest section or at least one of a plurality of furthest sections.

Abstract: A heat exchanger includes: stacked tubes through which a refrigerant flows; and a fin joined to the tube to increase a heat exchange area with air flowing around the tube. A cross-section of the fin perpendicular to a flow direction of the air is shaped in a wave shape that has: planar sections substantially parallel to the flow direction of the air; and a top for connecting between the adjacent planar sections. A clearance is defined in the planar section of the fin. When a portion of the fin where the shortest distance from a center line between the adjacent planar sections becomes the maximum is set as a furthest section in a cross-section perpendicular to a stacking direction of the tubes, the clearance is defined in one furthest section or at least one of a plurality of furthest sections.

Abstract: A heat exchanger includes a heat exchange portion in which at least tubes of refrigerant tubes or coolant tubes are stacked and at least one of refrigerant or coolant exchanges heat with air. An air passage is formed in a space formed between tubes of the refrigerant tubes and the coolant tubes which are adjacent to each other. An upstream heat exchange portion located on an upstream side in a flow direction of air and a downstream heat exchange portion located downstream of the upstream heat exchange portion in the flow direction of air are provided as the heat exchange portion. A ratio of the number of the refrigerant tubes to the total number of tubes of the upstream heat exchange portion is different from a ratio of the number of the refrigerant tubes to the total number of tubes of the downstream heat exchange portion.

Abstract: A cooler capable of reducing the fabrication cost is provided. In the cooler, in which electronic parts 6 are held between neighboring tubes 1, each of the tubes 1 is formed by joining the edges of plates 1a, 1b, each of which is formed into a predetermined shape by press molding, and fins 5 for accelerating heat exchange are arranged in the tube 1. As an inner wall conventionally exists when the tube 1 is manufactured by extrusion, can be removed, it is no longer necessary to remove the inner wall by machining, therefore, the fabrication cost can be reduced.

Abstract: In a heat exchanger with a plurality of tubes, a header tank includes a core plate bonded to the tubes, a tank body fixed to the core plate, and an elastic member arranged between a bottom portion of a groove portion provided at an outer peripheral portion of the core plate and a tip end portion of the tank body to be elastically deformable therebetween. The elastic member is provided with a position determination portion which protrudes approximately in parallel with an inner bottom surface of the bottom portion of the groove portion. Furthermore, the position determination portion is configured in the elastic member to have a clearance between the position determination portion and the bottom surface of the bottom portion of the groove portion, and a clearance between the position determination portion and the tip end portion of the tank body.

Abstract: A stacked type cooler 1 for cooling a plurality of electronic components 6 from two surfaces of each component includes a plurality of cooling tubes 2 having a flat shape and coolant flow passage 21 for allowing a coolant to flow, and a connecting pipe 3 for communicating these cooling tubes 2. The plurality of cooling tubes 2 is arranged and stacked in such a fashion as to interpose the electronic components 6 between the cooling tubes. The plurality of cooling tubes 2 includes an outside cooling tube 2b and an inside cooling tube 2a. The inside cooling tube 2a includes at least a first coolant flow passage 211 facing a first tube wall 231 constituting a first main surface 221 of the inside cooling tube 2a and a second coolant flow passage 212 facing a second tube wall 232 constituting a second main surface 222 on the opposite side to the first main surface 221. The coolant flow passage 21 is formed into two or more stages in a direction of thickness of the inside cooling tube 2a.

Abstract: A cooler capable of reducing the fabrication cost is provided. In the cooler, in which electronic parts 6 are held between neighboring tubes 1, each of the tubes 1 is formed by joining the edges of plates 1a, 1b, each of which is formed into a predetermined shape by press molding, and fins 5 for accelerating heat exchange are arranged in the tube 1. As an inner wall conventionally exists when the tube 1 is manufactured by extrusion, can be removed, it is no longer necessary to remove the inner wall by machining, therefore, the fabrication cost can be reduced.

Abstract: A cooler cools a plurality of electric parts from both sides thereof. The cooler includes a plurality of cooling units including a pair of cooling tubes for flowing coolant therethrough. A pair of cooling tubes having a flat shape is disposed to sandwich the electric part so that both sides of the electric part are cooled by a pair of cooling tubes. The cooling units are disposed to align in a stacking direction. A clearance is disposed between the neighboring cooling units in the stacking direction.

Abstract: A semiconductor insulation structure is disclosed for a semiconductor module, incorporating therein a semiconductor element, with which an electrically conductive structural body is held in pressured contact via an intervening insulation member. The semiconductor insulation structure includes a deformation preventing structure to avoid the insulation member from deforming when applied with load thereto. In one aspect, the deformation preventing structure includes a deformation resistant abutment surface, formed on the semiconductor module, and a readily deforming abutment surface formed on the electrically conductive structural body. In another aspect, the deformation preventing structure includes a reinforcement formed on a cooler and held in contact with the insulation member in an area placed in opposition to an outer circumferential periphery of the semiconductor module.

Abstract: A heat exchanger unit has tubes each having a body section and at least one of an inner pipe section and an outer pipe section extending from the body section and defining an opening at an end. Each of the inner pipe section and the outer pipe section has a first portion and a second portion adjacent to the first portion. The tubes are stacked such that the body sections are spaced from each other. Further, the inner pipe section is received in the outer pipe section such that the first portion of the inner pipe section overlaps the first portion of the outer pipe section, and the second portions of the inner and outer pipe sections are located on opposite sides of the overlapped first portions. The first and second portions of the inner pipe section have an outer diameter smaller than an inner diameter of the first and second portions of the outer pipe section.

Abstract: A lamination-type cooler comprises: a plurality of cooling pipes for interposing and cooling electronic parts; and a pair of refrigerant headers respectively engaged with both end portions of the plurality of cooling pipes, for laminating and fixing the plurality of cooling pipes. Both end portions of a refrigerant passage formed in each cooling pipe are respectively communicated with header passages formed in the refrigerant headers. The cooling pipes are composed so that a plurality of electronic parts can be interposed between the cooling pipes being arranged in a line in a direction perpendicular to the laminating direction of the cooling pipes and also perpendicular to the passage forming direction of the refrigerant passage.

Abstract: A cooler capable of reducing the fabrication cost is provided. In the cooler, in which electronic parts 6 are held between neighboring tubes 1, each of the tubes 1 is formed by joining the edges of plates 1a, 1b, each of which is formed into a predetermined shape by press molding, and fins 5 for accelerating heat exchange are arranged in the tube 1. As an inner wall conventionally exists when the tube 1 is manufactured by extrusion, can be removed, it is no longer necessary to remove the inner wall by machining, therefore, the fabrication cost can be reduced.

Abstract: A stacked type cooler 1 for cooling a plurality of electronic components 6 from two surfaces of each component includes a plurality of cooling tubes 2 having a flat shape and coolant flow passage 21 for allowing a coolant to flow, and a connecting pipe 3 for communicating these cooling tubes 2. The plurality of cooling tubes 2 is arranged and stacked in such a fashion as to interpose the electronic components 6 between the cooling tubes. The plurality of cooling tubes 2 includes an outside cooling tube 2b and an inside cooling tube 2a. The inside cooling tube 2a includes at least a first coolant flow passage 211 facing a first tube wall 231 constituting a first main surface 221 of the inside cooling tube 2a and a second coolant flow passage 212 facing a second tube wall 232 constituting a second main surface 222 on the opposite side to the first main surface 221. The coolant flow passage 21 is formed into two or more stages in a direction of thickness of the inside cooling tube 2a.

Abstract: A cooler cools a plurality of electric parts from both sides thereof. The cooler includes a plurality of cooling units including a pair of cooling tubes for flowing coolant therethrough. A pair of cooling tubes having a flat shape is disposed to sandwich the electric part so that both sides of the electric part are cooled by a pair of cooling tubes. The cooling units are disposed to align in a stacking direction. A clearance is disposed between the neighboring cooling units in the stacking direction.

Abstract: Repairing or replacing a heat-generating instrument in a heat collector entails providing an electromagnetic valve on an upstream side of a fluid passage for supplying fluid pressure to a heat-collecting diaphragm (101).