Patents by Inventor Mitsuharu Kohda
Mitsuharu Kohda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6946052Abstract: This invention is to guarantee that in separating a plate member such as a bonded substrate stack, a fluid is injected to an appropriate portion of the plate member. While a bonded substrate stack (50) is rotated, the vertical position of its peripheral portion is measured throughout its perimeter by a measuring device (150). Then, while the vertical position of a nozzle (120) is dynamically adjusted on the basis of the measurement result, and at the same time, the bonded substrate stack (50) is rotated, the bonded substrate stack (50) is separated into two substrates at a porous layer by injecting a fluid ejected from the nozzle (120).Type: GrantFiled: April 30, 2004Date of Patent: September 20, 2005Assignee: Canon Kabushiki KaishaInventors: Kazutaka Yanagita, Mitsuharu Kohda, Kiyofumi Sakaguchi, Akira Fujimoto
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Patent number: 6946046Abstract: This invention is to appropriately separate a bonded substrate stack regardless of some distortion in the bonded substrate stack or the like. This separating apparatus includes a first nozzle which forms a jet with a large width and a second nozzle which forms a jet with a small width. When the outer portion of a bonded substrate stack is to be separated, a jet formed by the first nozzle is used. After that, when a portion inside the outer portion is to be separated, a jet formed by the second nozzle is used.Type: GrantFiled: September 21, 2004Date of Patent: September 20, 2005Assignee: Canon Kabushiki KaishaInventors: Kazutaka Yanagita, Mitsuharu Kohda, Kiyofumi Sakaguchi, Akira Fujimoto
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Patent number: 6867110Abstract: This invention is to guarantee that in separating a plate member such as a bonded substrate stack, a fluid is injected to an appropriate portion of the plate member. While a bonded substrate stack (50) is rotated, the vertical position of its peripheral portion is measured throughout its perimeter by a measuring device (150). Then, while the vertical position of a nozzle (120) is dynamically adjusted on the basis of the measurement result, and at the same time, the bonded substrate stack (50) is rotated, the bonded substrate stack (50) is separated into two substrates at a porous layer by injecting a fluid ejected from the nozzle (120).Type: GrantFiled: May 23, 2002Date of Patent: March 15, 2005Assignee: Canon Kabushiki KaishaInventors: Kazutaka Yanagita, Mitsuharu Kohda, Kiyofumi Sakaguchi, Akira Fujimoto
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Publication number: 20050034821Abstract: This invention is to appropriately separate a bonded substrate stack regardless of some distortion in the bonded substrate stack or the like. This separating apparatus includes a first nozzle which forms a jet with a large width and a second nozzle which forms a jet with a small width. When the outer portion of a bonded substrate stack is to be separated, a jet formed by the first nozzle is used. After that, when a portion inside the outer portion is to be separated, a jet formed by the second nozzle is used.Type: ApplicationFiled: September 21, 2004Publication date: February 17, 2005Applicant: CANON KABUSHIKI KAISHAInventors: Kazutaka Yanagita, Mitsuharu Kohda, Kiyofumi Sakaguchi, Akira Fujimoto
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Patent number: 6852187Abstract: This invention is to appropriately separate a bonded substrate stack regardless of some distortion in the bonded substrate stack or the like. This separating apparatus includes a first nozzle which forms a jet with a large width and a second nozzle which forms a jet with a small width. When the outer portion of a bonded substrate stack is to be separated, a jet formed by the first nozzle is used. After that, when a portion inside the outer portion is to be separated, a jet formed by the second nozzle is used.Type: GrantFiled: June 25, 2002Date of Patent: February 8, 2005Assignee: Canon Kabushiki KaishaInventors: Kazutaka Yanagita, Mitsuharu Kohda, Kiyofumi Sakaguchi, Akira Fujimoto
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Patent number: 6833312Abstract: This invention is to support a plate member such as a bonded substrate stack in a horizontal state without coming into contact with one surface of the member and also to efficiently progress separation. Separation is executed while arranging a bonded substrate stack (50) generated by bonding a seed substrate (10) to a handle substrate (20) such that the seed substrate (10) remains on the lower side. At the first stage, the peripheral portion is separated while causing a first substrate support section (101) to chuck and support the central portion of the lower surface of the bonded substrate stack (50). Then, at the second stage, the central portion is separated while causing a second substrate support section (102) to support the lower peripheral portion and side of the bonded substrate stack (50).Type: GrantFiled: May 23, 2002Date of Patent: December 21, 2004Assignee: Canon Kabushiki KaishaInventors: Kazutaka Yanagita, Mitsuharu Kohda, Kiyofumi Sakaguchi, Akira Fujimoto
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Patent number: 6825099Abstract: This invention is to appropriately separate a bonded substrate stack regardless of some distortion in the bonded substrate stack or the like. This separating apparatus includes a position adjusting mechanism (140) for adjusting the position of a nozzle (120) which ejects a fluid. A bonded substrate stack (50) is separated while changing the level of the nozzle (120) stepwise by the position adjusting mechanism (140) in accordance with a program which is set in advance on the assumption that the bonded substrate stack (50) has a distortion within a predetermined range.Type: GrantFiled: June 25, 2002Date of Patent: November 30, 2004Assignee: Canon Kabushiki KaishaInventors: Kazutaka Yanagita, Mitsuharu Kohda, Kiyofumi Sakaguchi, Akira Fujimoto
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Publication number: 20040221963Abstract: This invention is to guarantee that in separating a plate member such as a bonded substrate stack, a fluid is injected to an appropriate portion of the plate member. While a bonded substrate stack (50) is rotated, the vertical position of its peripheral portion is measured throughout its perimeter by a measuring device (150). Then, while the vertical position of a nozzle (120) is dynamically adjusted on the basis of the measurement result, and at the same time, the bonded substrate stack (50) is rotated, the bonded substrate stack (50) is separated into two substrates at a porous layer by injecting a fluid ejected from the nozzle (120).Type: ApplicationFiled: April 30, 2004Publication date: November 11, 2004Applicant: CANON KABUSHIKI KAISHAInventors: Kazutaka Yanagita, Mitsuharu Kohda, Kiyofumi Sakaguchi, Akira Fujimoto
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Publication number: 20030010445Abstract: This invention is to appropriately separate a bonded substrate stack regardless of some distortion in the bonded substrate stack or the like. This separating apparatus includes a first nozzle which forms a jet with a large width and a second nozzle which forms a jet with a small width. When the outer portion of a bonded substrate stack is to be separated, a jet formed by the first nozzle is used. After that, when a portion inside the outer portion is to be separated, a jet formed by the second nozzle is used.Type: ApplicationFiled: June 25, 2002Publication date: January 16, 2003Inventors: Kazutaka Yanagita, Mitsuharu Kohda, Kiyofumi Sakaguchi, Akira Fujimoto
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Publication number: 20030003687Abstract: This invention is to appropriately separate a bonded substrate stack regardless of some distortion in the bonded substrate stack or the like. This separating apparatus includes a position adjusting mechanism (140) for adjusting the position of a nozzle (120) which ejects a fluid. A bonded substrate stack (50) is separated while changing the level of the nozzle (120) stepwise by the position adjusting mechanism (140) in accordance with a program which is set in advance on the assumption that the bonded substrate stack (50) has a distortion within a predetermined range.Type: ApplicationFiled: June 25, 2002Publication date: January 2, 2003Inventors: Kazutaka Yanagita, Mitsuharu Kohda, Kiyofumi Sakaguchi, Akira Fujimoto
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Publication number: 20020174958Abstract: This invention is to guarantee that in separating a plate member such as a bonded substrate stack, a fluid is injected to an appropriate portion of the plate member. While a bonded substrate stack (50) is rotated, the vertical position of its peripheral portion is measured throughout its perimeter by a measuring device (150). Then, while the vertical position of a nozzle (120) is dynamically adjusted on the basis of the measurement result, and at the same time, the bonded substrate stack (50) is rotated, the bonded substrate stack (50) is separated into two substrates at a porous layer by injecting a fluid ejected from the nozzle (120).Type: ApplicationFiled: May 23, 2002Publication date: November 28, 2002Inventors: Kazutaka Yanagita, Mitsuharu Kohda, Kiyofumi Sakaguchi, Akira Fujimoto
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Publication number: 20020174959Abstract: This invention is to support a plate member such as a bonded substrate stack in a horizontal state without coming into contact with one surface of the member and also to efficiently progress separation. Separation is executed while arranging a bonded substrate stack (50) generated by bonding a seed substrate (10) to a handle substrate (20) such that the seed substrate (10) remains on the lower side. At the first stage, the peripheral portion is separated while causing a first substrate support section (101) to chuck and support the central portion of the lower surface of the bonded substrate stack (50). Then, at the second stage, the central portion is separated while causing a second substrate support section (102) to support the lower peripheral portion and side of the bonded substrate stack (50).Type: ApplicationFiled: May 23, 2002Publication date: November 28, 2002Inventors: Kazutaka Yanagita, Mitsuharu Kohda, Kiyofumi Sakaguchi, Akira Fujimoto