Patents by Inventor Mitsuharu SHIMODA

Mitsuharu SHIMODA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230307244
    Abstract: In one embodiment, a method of manufacturing a semiconductor device includes etching a film with etching gas that includes a chain hydrocarbon compound expressed as CxHyFz where C, H and F respectively denote carbon, hydrogen and fluorine, “x” denotes an integer of three or more, and “y” and “z” respectively denote integers of one or more. Furthermore, the CxHyFz is the chain hydrocarbon compound in which each of terminal carbon atoms on a carbon chain of the chain hydrocarbon compound is bonded only to fluorine atoms out of hydrogen and fluorine atoms.
    Type: Application
    Filed: May 30, 2023
    Publication date: September 28, 2023
    Applicants: KIOXIA CORPORATION, KANTO DENKA KOGYO CO., LTD.
    Inventors: Takaya ISHINO, Toshiyuki SASAKI, Mitsuharu SHIMODA, Hisashi SHIMIZU
  • Patent number: 11315797
    Abstract: Provided is a plasma etching method that enables, in a semiconductor fabrication process, selective processing of a film consisting of a single material, such as SiO2 or SiN, or a composite material of SiO2 and SiN over a mask material as well as processing into satisfactorily vertical processed shapes.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: April 26, 2022
    Assignee: KANTO DENKA KOGYO CO., LTD.
    Inventors: Korehito Kato, Yoshinao Takahashi, Mitsuharu Shimoda, Yoshihiko Iketani
  • Publication number: 20210233774
    Abstract: Provided is a plasma etching method that enables, in a semiconductor fabrication process, selective processing of a film consisting of a single material, such as SiO2 or SiN, or a composite material of SiO2 and SiN over a mask material as well as processing into satisfactorily vertical processed shapes It is possible, for example, to enhance selectivity over a mask material or other materials excluding an etching target, to reduce damage on sidewalls, and to suppress etching in the lateral direction by generating a plasma of a gas compound having a thioether skeleton represented by general formula (1) or a mixed gas thereof and etching a film consisting of a composite material or a single material, such as SiO2 or SiN, thereby depositing a protective film that contains sulfur atoms and has a lower content of fluorine atoms than the cases of using common hydrofluorocarbon gases.
    Type: Application
    Filed: June 21, 2019
    Publication date: July 29, 2021
    Inventors: Korehito KATO, Yoshinao TAKAHASHI, Mitsuharu SHIMODA, Yoshihiko IKETANI
  • Publication number: 20210193475
    Abstract: In one embodiment, a method of manufacturing a semiconductor device includes etching a film with etching gas that includes a chain hydrocarbon compound expressed as CxHyFz where C, H and F respectively denote carbon, hydrogen and fluorine, “x” denotes an integer of three or more, and “y” and “z” respectively denote integers of one or more. Furthermore, the CxHyFz is the chain hydrocarbon compound in which each of terminal carbon atoms on a carbon chain of the chain hydrocarbon compound is bonded only to fluorine atoms out of hydrogen and fluorine atoms.
    Type: Application
    Filed: March 10, 2021
    Publication date: June 24, 2021
    Applicants: Kioxia Corporation, KANTO DENKA KOGYO CO., LTD.
    Inventors: Takaya ISHINO, Toshiyuki SASAKI, Mitsuharu SHIMODA, Hisashi SHIMIZU
  • Publication number: 20200377434
    Abstract: An object of the present invention is to provide a simple, low-cost, and industrial method of producing a compound having a polyene skeleton containing hydrogen and fluorine and/or chlorine. A method of producing a. halogenated diene represented by formula (1): A1A2C=CA3-CA4=CA5A6 [A1, A2, A5, and A6 are each independently hydrogen, fluorine, chlorine, a (perfluoro)alkyl group having 1 to 3 carbon atoms, or a (perfluoro)alkenyl group; A3 and A4 are each independently hydrogen, fluorine, or chlorine; at least one of A1 to A6 is hydrogen; at least one of A1 to A6 is fluorine or chlorine] comprises a step of subjecting the same or different halogenated olefin(s) represented by for (2): A7A8C=CA9X [A7 and A8 are each independently hydrogen, fluorine, chlorine, a (perfluoro)alkyl group having 1 to 3 carbon atoms, or a (perfluoro)alkenyl group; A9 is each independently hydrogen, fluorine, or chlorine; X is bromine or iodine] to a coupling reaction in the presence of a zero-valent metal.
    Type: Application
    Filed: April 26, 2018
    Publication date: December 3, 2020
    Inventors: Hideki AMII, Mitsuharu SHIMODA, Yoshihiko IKETANI, Ryo KIMURA