Patents by Inventor Mitsuhaya Tsukamoto

Mitsuhaya Tsukamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8371027
    Abstract: In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: February 12, 2013
    Assignee: Panasonic Corporation
    Inventors: Masafumi Inoue, Mitsuhaya Tsukamoto, Masahiro Kihara, Syoichi Nishi
  • Patent number: 8240543
    Abstract: Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been printed, and mounting the electronic component on the board on which the solder paste has been printed by a loading head, whether the transfer of the solder paste to the solder bumps is necessary or not is judged on the basis of the measurement result of the height of the solder paste. In case that it is judged that the transfer is necessary, the transfer of the solder paste is executed, and thereafter the electronic component is mounted on the board. Hereby, it is possible to prevent the poor joint in case that a thin-sized semiconductor package which causes easily warp deformation is mounted on the board by soldering.
    Type: Grant
    Filed: March 26, 2007
    Date of Patent: August 14, 2012
    Assignee: Panasonic Corporation
    Inventors: Syoichi Nishi, Mitsuhaya Tsukamoto, Masahiro Kihara, Masafumi Inoue
  • Patent number: 8020286
    Abstract: One objective of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can prevent a mounting defect due to a positioning error in the direction of the thickness of a substrate, and that can deliver a specific mounting quality. According to an electronic component mounting system, which is constituted by coupling a plurality of apparatuses used for mounting electronic components, the height measurement device 22 of a printing inspection apparatus measures the heights at height measurement points, designated on the upper face of a substrate, and outputs the measurement results as substrate height data.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: September 20, 2011
    Assignee: Panasonic Corporation
    Inventors: Masafumi Inoue, Mitsuhaya Tsukamoto, Syoichi Nishi, Masahiro Kihara
  • Publication number: 20090293265
    Abstract: One objective of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can prevent a mounting defect due to a positioning error in the direction of the thickness of a substrate, and that can deliver a specific mounting quality. According to an electronic component mounting system, which is constituted by coupling a plurality of apparatuses used for mounting electronic components, the height measurement device 22 of a printing inspection apparatus measures the heights at height measurement points, designated on the upper face of a substrate, and outputs the measurement results as substrate height data.
    Type: Application
    Filed: December 20, 2006
    Publication date: December 3, 2009
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO.
    Inventors: Masafumi Inoue, Mitsuhaya Tsukamoto, Syoichi Nishi, Masahiro Kihara
  • Publication number: 20090064489
    Abstract: In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process.
    Type: Application
    Filed: April 12, 2007
    Publication date: March 12, 2009
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Masafumi Inoue, Mitsuhaya Tsukamoto, Masahiro Kihara, Syoichi Nishi
  • Publication number: 20090014501
    Abstract: Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been printed, and mounting the electronic component on the board on which the solder paste has been printed by a loading head, whether the transfer of the solder paste to the solder bumps is necessary or not is judged on the basis of the measurement result of the height of the solder paste. In case that it is judged that the transfer is necessary, the transfer of the solder paste is executed, and thereafter the electronic component is mounted on the board. Hereby, it is possible to prevent the poor joint in case that a thin-sized semiconductor package which causes easily warp deformation is mounted on the board by solder-joint.
    Type: Application
    Filed: March 26, 2007
    Publication date: January 15, 2009
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Syoichi Nishi, Mitsuhaya Tsukamoto, Masahiro Kihara, Masafumi Inoue
  • Publication number: 20070020748
    Abstract: The present invention is intended to provide an apparatus for screening protein crystallization conditions that can screen protein crystallization conditions efficiently by the vapor diffusion method using the sitting drop technique.
    Type: Application
    Filed: April 28, 2004
    Publication date: January 25, 2007
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Itsuro Motegi, Hirofumi Matsuzaki, Hideyoshi Kitahara, Mitsuhaya Tsukamoto, Kouji Shimogawa, Masataka Magoori, Akira Higuchi
  • Patent number: 6757966
    Abstract: A component mounting system which includes a printer for printing solder on electrodes formed on a board; a first inspection unit for detecting positions of printed solder and outputting solder position detection results; a component mounting unit for picking up components from a component feeder carriage and placing the components on the board using mounting heads; a second inspection unit for inspecting positions of the components placed and outputting component position detection results; a soldering unit for soldering the components onto the board by heating and melting solder; and a main controller for updating at least a control parameter for controlling the printer operation or a control parameter for the component mounting unit operation based on at least the solder position detection results or component position detection results. The above configuration enables the accurate and efficient quality control throughout the mounting process.
    Type: Grant
    Filed: October 25, 2001
    Date of Patent: July 6, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masafumi Inoue, Mitsuhaya Tsukamoto, Masat Fujioka
  • Publication number: 20020083570
    Abstract: A component mounting system which includes a printer for printing solder on electrodes formed on a board; a first inspection unit for detecting positions of printed solder and outputting solder position detection results; a component mounting unit for picking up components from a component feeder carriage and placing the components on the board using mounting heads; a second inspection unit for inspecting positions of the components placed and outputting component position detection results; a soldering unit for soldering the components onto the board by heating and melting solder; and a main controller for updating at least a control parameter for controlling the printer operation or a control parameter for the component mounting unit operation based on at least the solder position detection results or component position detection results. The above configuration enables the accurate and efficient quality control throughout the mounting process.
    Type: Application
    Filed: October 25, 2001
    Publication date: July 4, 2002
    Inventors: Masafumi Inoue, Mitsuhaya Tsukamoto, Masato Fujioka