Patents by Inventor Mitsuhiko Ueda

Mitsuhiko Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210229120
    Abstract: A mist-generating device includes: a droplet generating unit that generates, in a third liquid, a functional droplet including a first liquid that is spherical and a second liquid that covers an entirety of the first liquid and has a volatility lower than a volatility of the first liquid; and a mist-generating unit that generates a multilayer mist obtained by atomizing the third liquid containing the functional droplet.
    Type: Application
    Filed: June 25, 2019
    Publication date: July 29, 2021
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Mitsuhiko UEDA, Tatsuya KIRIYAMA, Hiroaki TACHIBANA, Shogo SHIBUYA
  • Patent number: 10535807
    Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: January 14, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takanori Aketa, Mitsuhiko Ueda, Toru Hirano
  • Publication number: 20180254398
    Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.
    Type: Application
    Filed: May 8, 2018
    Publication date: September 6, 2018
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takanori AKETA, Mitsuhiko UEDA, Toru HIRANO
  • Patent number: 9997685
    Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.
    Type: Grant
    Filed: September 3, 2014
    Date of Patent: June 12, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takanori Aketa, Mitsuhiko Ueda, Toru Hirano
  • Patent number: 9818923
    Abstract: The light emitting device includes the cap including the ultraviolet light transmitting part made of glass for transmitting ultraviolet light. In the light emitting device, the first electrode of the ultraviolet light emitting element and the first conductor of the mounting substrate are bonded with the first bond made of AuSn, the second electrode of the ultraviolet light emitting element and the second conductor of the mounting substrate are bonded with the second bond made of AuSn, and the first bonding metal layer of the mounting substrate and the second bonding metal layer of the cap are bonded with the third bond made of AuSn.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: November 14, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Mitsuhiko Ueda, Yoshiharu Sanagawa, Takanori Aketa
  • Publication number: 20170279019
    Abstract: The light emitting device includes the cap including the ultraviolet light transmitting part made of glass for transmitting ultraviolet light. In the light emitting device, the first electrode of the ultraviolet light emitting element and the first conductor of the mounting substrate are bonded with the first bond made of AuSn, the second electrode of the ultraviolet light emitting element and the second conductor of the mounting substrate are bonded with the second bond made of AuSn, and the first bonding metal layer of the mounting substrate and the second bonding metal layer of the cap are bonded with the third bond made of AuSn.
    Type: Application
    Filed: October 27, 2015
    Publication date: September 28, 2017
    Inventors: Mitsuhiko UEDA, Yoshiharu SANAGAWA, Takanori AKETA
  • Patent number: 9508679
    Abstract: A mounting method of mounting chips on a substrate includes a temporarily-bonding process, and a main-bonding process. Temporarily-bonding process is to perform a first basic process, repeatedly depending on the number of the chips. First basic process includes a first step and a second step. First step is to align, on a first metal layer of the substrate, a second metal layer of each chip. Second step is to temporarily bond each chip by subjecting the first and second metal layers to solid phase diffusion bonding. Main-bonding process is to perform a second basic process, repeatedly depending on the number of the chips. Second basic process includes a third step and a fourth step. Third step is to recognize a position of each chip temporarily mounted on the substrate. Fourth step is to firmly bond each chip by subjecting the first and second metal layers to liquid phase diffusion bonding.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: November 29, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Mitsuhiko Ueda, Yoshiharu Sanagawa, Takanori Aketa, Shintaro Hayashi
  • Patent number: 9478682
    Abstract: The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: October 25, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masao Kirihara, Hiroshi Yamanaka, Yoshiharu Sanagawa, Takanori Aketa, Yushi Nakamura, Mitsuhiko Ueda
  • Patent number: 9470346
    Abstract: A pipe connection joint which is repeatedly usable when an analysis column is replaced with another in a liquid chromatographic device. To this end, an elastic body is built into a compression screw for inserting a pipe passed through a ferrule into the analysis column to thereby axially movably support the pipe, and a pipe clamp is secured in advance at a predetermined position of the pipe. A distance between the ferrule and the pipe clamp changes on the basis of the length of a portion of the pipe sticking out from the ferrule and the pressing force of the elastic body applied to the pipe.
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: October 18, 2016
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Shoji Tomida, Shintaro Kubo, Mitsuhiko Ueda
  • Patent number: 9425373
    Abstract: A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: August 23, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takanori Aketa, Yoshiharu Sanagawa, Mitsuhiko Ueda, Takaaki Yoshihara, Shintaro Hayashi, Toshihiko Sato
  • Publication number: 20160218262
    Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.
    Type: Application
    Filed: September 3, 2014
    Publication date: July 28, 2016
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LT D.
    Inventors: Takanori AKETA, Mitsuhiko UEDA, Toru HIRANO
  • Publication number: 20160020374
    Abstract: A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode.
    Type: Application
    Filed: March 11, 2014
    Publication date: January 21, 2016
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takanori AKETA, Yoshiharu SANAGAWA, Mitsuhiko UEDA, Takaaki YOSHIHARA, Shintaro HAYASHI, Toshihiko SATO
  • Publication number: 20150285414
    Abstract: The present invention provides a pipe connection joint which is repeatedly usable when an analysis column or the like is replaced with another in a liquid chromatographic device. To this end, an elastic body is built into a compression screw for inserting a pipe passed through a ferrule into the analysis column to thereby axially movably support the pipe, and a pipe clamp is secured in advance at a predetermined position of the pipe. A distance between the ferrule and the pipe clamp changes on the basis of the length of a portion of the pipe sticking out from the ferrule and the pressing force of the elastic body applied to the pipe. Consequently, in a liquid chromatographic device, a pipe connection joint for the analysis column or the like can be repeatedly used of plural times.
    Type: Application
    Filed: November 20, 2013
    Publication date: October 8, 2015
    Inventors: Shoji Tomida, Shintaro Kubo, Mitsuhiko Ueda
  • Publication number: 20150287696
    Abstract: A mounting method of mounting chips on a substrate includes a temporarily-bonding process, and a main-bonding process. Temporarily-bonding process is to perform a first basic process, repeatedly depending on the number of the chips. First basic process includes a first step and a second step. First step is to align, on a first metal layer of the substrate, a second metal layer of each chip. Second step is to temporarily bond each chip by subjecting the first and second metal layers to solid phase diffusion bonding. Main-bonding process is to perform a second basic process, repeatedly depending on the number of the chips. Second basic process includes a third step and a fourth step. Third step is to recognize a position of each chip temporarily mounted on the substrate. Fourth step is to firmly bond each chip by subjecting the first and second metal layers to liquid phase diffusion bonding.
    Type: Application
    Filed: March 11, 2013
    Publication date: October 8, 2015
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Mitsuhiko Ueda, Yoshiharu Sanagawa, Takanori Aketa, Shintaro Hayashi
  • Patent number: 8952331
    Abstract: An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which includes a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between the infrared sensor device and the case and the signal processing circuit device, and which includes a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: February 10, 2015
    Assignee: Panasonic Corporation
    Inventors: Mitsuhiko Ueda, Takami Okubayashi, Takanori Sugiyama, Yoshiharu Sanagawa, Takanori Aketa, Yushi Nakamura, Masao Kirihara
  • Publication number: 20140318224
    Abstract: A high-pressure constant flow rate pump transfers a solvent from a low-pressure side liquid transfer system even if a difference between mixing ratios is large when solvents are mixed during high-pressure gradient liquid transfer. A pressure detection value from a second pressure sensor and a pressure detection value from a fourth pressure sensor are compared with each other. If the pressure detection value PA1 of the second pressure sensor is equal to or greater than the pressure detection value PA2 of the fourth pressure sensor, a second check valve comes into an opened state and operation is ended. If PA1 is less PA2, leakage determination is implemented. If it is determined that no leakage occurs, the type of the solvent is identified. A compression distance of a second plunger which is determined for each solvent and stored in a memory is added and the first plunger is driven.
    Type: Application
    Filed: April 17, 2014
    Publication date: October 30, 2014
    Applicant: Hitachi High-Technologies Corporation
    Inventors: Yugo ONODA, Daisuke AKIEDA, Hiroyuki WADA, Toyoaki TANOUE, Mitsuhiko UEDA, Takashi YAGI
  • Patent number: 8862057
    Abstract: A communication device includes a control unit that establishes a wireless communication between a communication unit and an external device by using setting data received from the external device. The device also includes a data processing unit that stores the setting data in a storage unit before the wireless communication is released. Further, the device includes a power input unit that receives power from outside. A communication releasing unit releases the wireless communication between the communication unit and the external device. The control unit uses the setting data stored in the storage unit at a time of re-performing a wireless communication between the communication unit and the external device. The communication releasing unit does not release the wireless communication when the power is being supplied via the power input unit even when a predetermined time has passed.
    Type: Grant
    Filed: April 1, 2013
    Date of Patent: October 14, 2014
    Assignee: Sony Corporation
    Inventors: Takashi Matsuo, Mitsuhiko Ueda, Yosuke Tsuda
  • Publication number: 20130333491
    Abstract: A liquid sample introducing apparatus capable of executing a process with high reliability and high speed is realized. An injection valve includes a sample storage loop connected to a mobile phase flow passage for supplying a sample to a detector of a liquid chromatograph apparatus. A sample is sucked in a needle through a valve and a pipe by a syringe, being introduced to the sample storage loop, being supplied to the mobile phase flow passage. A washing solution from a washing solution bottle is supplied to the needle by a washing unit through the valve and the pipe to wash the inner wall of the needle. The washing solution from the washing solution bottle is supplied to a washing tank by the washing unit through the valve and a pipe to wash the external wall of the needle in the washing tank.
    Type: Application
    Filed: August 20, 2013
    Publication date: December 19, 2013
    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Yoshiaki SEKI, Kimihiko ISHII, Mitsuhiko UEDA, Katsutoshi SHIMIZU, Hiroshi SUZUKI
  • Publication number: 20130333452
    Abstract: Disclosed is a liquid chromatograph provided with: a first flow path switching means which switches between connection of a sample storage loop to a mobile phase flow path and separation of the sample storage loop from the mobile phase flow path; a needle which suctions and discharges a sample; a weighing means which performs suction and discharge of the sample to the needle while weighing the sample; a cleaning solution feeding means which feeds a cleaning solution; a second flow path switching means which switches between at least two types of cleaning solutions; a third flow path switching means which switches between connection of the needle and the weighing means and connection of the needle and the cleaning solution feeding means; and a control means which controls operation of the first flow path switching means, the weighing means, the cleaning solution feeding means, the second flow path switching means, and the third flow path switching means, wherein the total amount of the sample is injected into
    Type: Application
    Filed: November 17, 2011
    Publication date: December 19, 2013
    Inventors: Hiroshi Suzuki, Kimihiko Ishii, Mitsuhiko Ueda, Katsutoshi Shimizu, Yoshiaki Seki
  • Patent number: 8522628
    Abstract: A liquid sample introducing apparatus capable of executing a process with high reliability and high speed is realized. An injection valve includes a sample storage loop connected to a mobile phase flow passage for supplying a sample to a detector of a liquid chromatograph apparatus. A sample is sucked in a needle through a valve and a pipe by a syringe, being introduced to the sample storage loop, being supplied to the mobile phase flow passage. A washing solution from a washing solution bottle is supplied to the needle by a washing unit through the valve and the pipe to wash the inner wall of the needle. The washing solution from the washing solution bottle is supplied to a washing tank by the washing unit through the valve and a pipe to wash the external wall of the needle in the washing tank.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: September 3, 2013
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Yoshiaki Seki, Kimihiko Ishii, Mitsuhiko Ueda, Katsutoshi Shimizu, Hiroshi Suzuki