Abstract: A mist-generating device includes: a droplet generating unit that generates, in a third liquid, a functional droplet including a first liquid that is spherical and a second liquid that covers an entirety of the first liquid and has a volatility lower than a volatility of the first liquid; and a mist-generating unit that generates a multilayer mist obtained by atomizing the third liquid containing the functional droplet.

Abstract: An automatic analyzer 1 includes a reagent bottle installation unit 200 that installs a reagent bottle 301 containing a reagent used for analysis; a nozzle unit 210 that couples a supply flow path 220 that connects a location where the reagent is used and the inside of the reagent bottle 301 installed in the reagent bottle installation unit 200 to the reagent bottle 301; and a stopper 202 that is disposed on the movement path of a reagent aspiration nozzle 400 of the nozzle unit 210 and prevents the reagent aspiration nozzle 400 from being inserted into the reagent bottle 301. This automatic analyzer realizes the prevention of misplacement of reagent types and the prevention of removal of the reagents at the incorrect timing with less space and constituent components.

Abstract: A flowpath switch valve is configured for extended service life by spreading the region, of the sliding surfaces of a stator and a rotor, that is subject to wear over the entirety of the sliding surfaces. The stator has fixed stator flowpaths, and the rotor has rotor flowpaths. A flowpath switch valve, depending on the rotor rotation state, realizes connection patterns that include: a first connection pattern wherein a rotor flowpath 241 connects a fixed stator flowpath 31 and a fixed stator flowpath 32; a second connection pattern wherein the rotor flowpath 241 connects the fixed stator flowpath 31 and a fixed stator flowpath 36; a third connection pattern wherein a rotor flowpath 242 connects the fixed stator flowpath 31 and the fixed stator flowpath 32; and a fourth connection pattern wherein the rotor flowpath 242 connects the fixed stator flowpath 31 and the fixed stator flowpath 36.

Abstract: A mist-generating device includes: a droplet generating unit that generates, in a third liquid, a functional droplet including a first liquid that is spherical and a second liquid that covers an entirety of the first liquid and has a volatility lower than a volatility of the first liquid; and a mist-generating unit that generates a multilayer mist obtained by atomizing the third liquid containing the functional droplet.

Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.

Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.

Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.

Abstract: The light emitting device includes the cap including the ultraviolet light transmitting part made of glass for transmitting ultraviolet light. In the light emitting device, the first electrode of the ultraviolet light emitting element and the first conductor of the mounting substrate are bonded with the first bond made of AuSn, the second electrode of the ultraviolet light emitting element and the second conductor of the mounting substrate are bonded with the second bond made of AuSn, and the first bonding metal layer of the mounting substrate and the second bonding metal layer of the cap are bonded with the third bond made of AuSn.

Abstract: The light emitting device includes the cap including the ultraviolet light transmitting part made of glass for transmitting ultraviolet light. In the light emitting device, the first electrode of the ultraviolet light emitting element and the first conductor of the mounting substrate are bonded with the first bond made of AuSn, the second electrode of the ultraviolet light emitting element and the second conductor of the mounting substrate are bonded with the second bond made of AuSn, and the first bonding metal layer of the mounting substrate and the second bonding metal layer of the cap are bonded with the third bond made of AuSn.

Abstract: A mounting method of mounting chips on a substrate includes a temporarily-bonding process, and a main-bonding process. Temporarily-bonding process is to perform a first basic process, repeatedly depending on the number of the chips. First basic process includes a first step and a second step. First step is to align, on a first metal layer of the substrate, a second metal layer of each chip. Second step is to temporarily bond each chip by subjecting the first and second metal layers to solid phase diffusion bonding. Main-bonding process is to perform a second basic process, repeatedly depending on the number of the chips. Second basic process includes a third step and a fourth step. Third step is to recognize a position of each chip temporarily mounted on the substrate. Fourth step is to firmly bond each chip by subjecting the first and second metal layers to liquid phase diffusion bonding.

Abstract: The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.

Abstract: A pipe connection joint which is repeatedly usable when an analysis column is replaced with another in a liquid chromatographic device. To this end, an elastic body is built into a compression screw for inserting a pipe passed through a ferrule into the analysis column to thereby axially movably support the pipe, and a pipe clamp is secured in advance at a predetermined position of the pipe. A distance between the ferrule and the pipe clamp changes on the basis of the length of a portion of the pipe sticking out from the ferrule and the pressing force of the elastic body applied to the pipe.

Abstract: A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode.

Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.

Abstract: A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode.

Abstract: A mounting method of mounting chips on a substrate includes a temporarily-bonding process, and a main-bonding process. Temporarily-bonding process is to perform a first basic process, repeatedly depending on the number of the chips. First basic process includes a first step and a second step. First step is to align, on a first metal layer of the substrate, a second metal layer of each chip. Second step is to temporarily bond each chip by subjecting the first and second metal layers to solid phase diffusion bonding. Main-bonding process is to perform a second basic process, repeatedly depending on the number of the chips. Second basic process includes a third step and a fourth step. Third step is to recognize a position of each chip temporarily mounted on the substrate. Fourth step is to firmly bond each chip by subjecting the first and second metal layers to liquid phase diffusion bonding.

Abstract: The present invention provides a pipe connection joint which is repeatedly usable when an analysis column or the like is replaced with another in a liquid chromatographic device. To this end, an elastic body is built into a compression screw for inserting a pipe passed through a ferrule into the analysis column to thereby axially movably support the pipe, and a pipe clamp is secured in advance at a predetermined position of the pipe. A distance between the ferrule and the pipe clamp changes on the basis of the length of a portion of the pipe sticking out from the ferrule and the pressing force of the elastic body applied to the pipe. Consequently, in a liquid chromatographic device, a pipe connection joint for the analysis column or the like can be repeatedly used of plural times.

Abstract: An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which includes a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between the infrared sensor device and the case and the signal processing circuit device, and which includes a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device.

Abstract: A high-pressure constant flow rate pump transfers a solvent from a low-pressure side liquid transfer system even if a difference between mixing ratios is large when solvents are mixed during high-pressure gradient liquid transfer. A pressure detection value from a second pressure sensor and a pressure detection value from a fourth pressure sensor are compared with each other. If the pressure detection value PA1 of the second pressure sensor is equal to or greater than the pressure detection value PA2 of the fourth pressure sensor, a second check valve comes into an opened state and operation is ended. If PA1 is less PA2, leakage determination is implemented. If it is determined that no leakage occurs, the type of the solvent is identified. A compression distance of a second plunger which is determined for each solvent and stored in a memory is added and the first plunger is driven.

Abstract: A communication device includes a control unit that establishes a wireless communication between a communication unit and an external device by using setting data received from the external device. The device also includes a data processing unit that stores the setting data in a storage unit before the wireless communication is released. Further, the device includes a power input unit that receives power from outside. A communication releasing unit releases the wireless communication between the communication unit and the external device. The control unit uses the setting data stored in the storage unit at a time of re-performing a wireless communication between the communication unit and the external device. The communication releasing unit does not release the wireless communication when the power is being supplied via the power input unit even when a predetermined time has passed.