Abstract: An electric motor is controlled according to the back and forth movement of an input rod, which is caused by brake pedal operation; a primary piston is propelled to generate hydraulic brake pressure in a master cylinder; and the hydraulic brake pressure is fed back to the input rod through an input piston. The input piston is resiliently held by springs with respect to the primary piston. A jump-in clearance is created between the input piston and the input rod by a rearward spring. At the initial stage of braking, hydraulic brake pressure is not transmitted to the input rod due to the jump-in clearance, which provides jump-in characteristics. The jump-in clearance can be set, regardless of the amount of a relative displacement between the primary piston and the input piston, so that the range of adjustment for regenerative braking can be set larger than the jump-in clearance.

Abstract: An input rod is operated by a brake pedal to introduce the air into a variable-pressure chamber through a control valve to propel a power piston, thereby advancing a primary piston to generate a brake fluid pressure in a master cylinder. A part of the reaction force from the fluid pressure is transmitted to the input rod through a reaction member. The primary piston is provided with an idle stroke in which no fluid pressure is generated, and the reaction force to be transmitted to a plunger is limited by a reaction force adjusting spring. In the region of the idle stroke, a fluid pressure is supplied to a wheel cylinder through a fluid pressure control unit to perform regenerative cooperative control, and a reaction force from a reaction spring is applied to the input rod.

Abstract: A pneumatic booster (40) disposed between a brake pedal (5) and a master cylinder (7) includes a cylindrical member (60) provided on an outer circumferential side of an output rod (58). A seal member (62) seals between an outer circumferential side of the cylindrical member and a cylindrical portion of a front shell, and an O-ring seals between the cylindrical member and the output rod. The cylindrical member causes a differential pressure between a negative pressure chamber (A) and an atmosphere chamber (C) to be applied to a valve body (46). One axial side of the cylindrical member is configured to cause an atmosphere pressure to be applied to the valve body by abutting against a cylindrical protruding portion of the valve body, thereby pushing the valve body with the aid of the differential pressure in the direction as a biasing direction of a return spring.

Abstract: An electric motor is controlled according to the back and forth movement of an input rod, which is caused by brake pedal operation; a primary piston is propelled to generate hydraulic brake pressure in a master cylinder; and the hydraulic brake pressure is fed back to the input rod through an input piston. The input piston is resiliency held by springs with respect to the primary piston. A jump-in clearance is created between the input piston and the input rod by a rearward spring. At the initial stage of braking, hydraulic brake pressure is not transmitted to the input rod due to the jump-in clearance, which provides jump-in characteristics. The jump-in clearance can be set, regardless of the amount of a relative displacement between the primary piston and the input piston, so that the range of adjustment for regenerative braking can be set larger than the jump-in clearance.

Abstract: A controller controls a hydraulic control device to generate a target braking force corresponding to the stroke of a brake pedal by adjusting a controlled hydraulic braking force portion generated by the hydraulic control device on the basis of the relationship with a master hydraulic braking force portion generated from the brake hydraulic pressure in a master cylinder and a regenerative braking force portion generated by a regenerative brake device. The regenerative brake device maximizes the regenerative braking force portion before the stroke of the brake pedal reaches an idle stroke, and thereafter, the hydraulic control device 5 starts braking by the controlled hydraulic braking force portion. When the stroke of the brake pedal reaches the idle stroke, the master cylinder starts braking by the master hydraulic braking force portion.

Abstract: A pneumatic booster (40) disposed between a brake pedal (5) and a master cylinder (7) includes a cylindrical member (60) provided on an outer circumferential side of an output rod (58). A seal member (62) seals between an outer circumferential side of the cylindrical member and a cylindrical portion of a front shell, and an O-ring seals between the cylindrical member and the output rod. The cylindrical member causes a differential pressure between a negative pressure chamber (A) and an atmosphere chamber (C) to be applied to a valve body (46). One axial side of the cylindrical member is configured to cause an atmosphere pressure to be applied to the valve body by abutting against a cylindrical protruding portion of the valve body, thereby pushing the valve body with the aid of the differential pressure in the direction as a biasing direction of a return spring.

Abstract: A controller controls a hydraulic control device to generate a target braking force corresponding to the stroke of a brake pedal by adjusting a controlled hydraulic braking force portion generated by the hydraulic control device on the basis of the relationship with a master hydraulic braking force portion generated from the brake hydraulic pressure in a master cylinder and a regenerative braking force portion generated by a regenerative brake device. The regenerative brake device maximizes the regenerative braking force portion before the stroke of the brake pedal reaches an idle stroke, and thereafter, the hydraulic control device 5 starts braking by the controlled hydraulic braking force portion. When the stroke of the brake pedal reaches the idle stroke, the master cylinder starts braking by the master hydraulic braking force portion.

Abstract: A method of manufacturing a semiconductor wafer, including a step of differentiating the glossiness of a front surface from that of a rear surface of the wafer by holding the semiconductor wafer in a wafer holding hole formed in a carrier plate, and simultaneously polishing a front and back surface of said semiconductor wafer by driving said carrier plate to make a circular motion associated with no rotation on its own axis within a plane parallel with a surface of said carrier plate between a pair of polishing members disposed to face to each other, by using an abrasive body with a semiconductor wafer sink rate different in polishing from that of an abrasive body for one of a polishing member on an upper surface plate and a polishing member on a lower surface plate so as to simultaneously polish both the front and rear surfaces of the semiconductor wafer, or differentiating by differentiating the rotating speed of the upper surface plate from that of the lower surface plate.

Abstract: An input rod is operated by a brake pedal to introduce the air into a variable-pressure chamber through a control valve to propel a power piston, thereby advancing a primary piston to generate a brake fluid pressure in a master cylinder. A part of the reaction force from the fluid pressure is transmitted to the input rod through a reaction member. The primary piston is provided with an idle stroke in which no fluid pressure is generated, and the reaction force to be transmitted to a plunger is limited by a reaction force adjusting spring. In the region of the idle stroke, a fluid pressure is supplied to a wheel cylinder through a fluid pressure control unit to perform regenerative cooperative control, and a reaction force from a reaction spring is applied to the input rod.

Abstract: In a semiconductor device manufacturing method having the etching step of an electrode material film constituting a capacitor using ferroelectric substance or high- dielectric substance, etching of a conductive film that acts as an electrode of the capacitor formed over a semiconductor substrate is carried out in an atmosphere containing bromine, and a heating temperature of the semiconductor substrate is set in a range of 300° C. to 600° C., otherwise etching of at least the conductive film is carried out in an atmosphere to which only hydrogen bromide and oxygen are supplied from an outside.

Abstract: A method of manufacturing a semiconductor wafer, including a step of differentiating the glossiness of a front surface from that of a rear surface of the wafer by holding the semiconductor wafer in a wafer holding hole formed in a carrier plate, and simultaneously polishing a front and back surface of said semiconductor wafer by driving said carrier plate to make a circular motion associated with no rotation on its own axis within a plane parallel with a surface of said carrier plate between a pair of polishing members disposed to face to each other, by using an abrasive body with a semiconductor wafer sink rate different in polishing from that of an abrasive body for one of a polishing member on an upper surface plate and a polishing member on a lower surface plate so as to simultaneously polish both the front and rear surfaces of the semiconductor wafer, or differentiating by differentiating the rotating speed of the upper surface plate from that of the lower surface plate.

Abstract: A method of manufacturing a semiconductor wafer, comprising the step of differentiating the glossiness of a front surface from that of a rear surface of the wafer by using an abrasive cloth with a semiconductor wafer sink rate different in polishing from that of the other abrasive cloth for one of a polishing cloth (14) on an upper surface plate (12) and a polishing cloth (15) on a lower surface plate (13) so as to simultaneously polish both the front and rear surfaces of the semiconductor wafer (W), or differentiating by differentiating the rotating speed of the upper surface plate from that of the lower surface plate.

Abstract: An etching technique suitable for miniaturization is provided. An inorganic film is formed on an object to be subjected, the object having a lower electrode film, a dielectric film, and an upper electrode film laminated in that order on a substrate. A patterned organic resist film is disposed on the surface of the inorganic film. The inorganic film, upper electrode film, and the dielectric film are etched using the organic resist film as a mask, and then, the organic resist film is removed with the gas used to etch the lower electrode film; and the lower electrode film is etched using the inorganic film as a mask that has been exposed. Since the film serving as a mask is not re-formed, a fine pattern can be produced with good precision.

Abstract: In a pneumatic booster, a front shell and a rear shell are connected by means of a rod. A stud bolt on one end of the rod extends through the front shell to the outside, and a support plate fitted around the stud bolt is engaged with the rod and abutted against an inner surface of the front shell. A seal member is provided in an annular groove formed in the support plate. A projection is formed in the support plate. When the support plate is reversely mounted on the stud bolt, the projection is abutted against the front shell, and the seal member is unable to provide a seal between the stud bolt and the front shell. In a leak inspection, air is flowed into a constant-pressure chamber through a cut portion formed in a distal end of the projection, to thereby detect reverse mounting of the support plate.

Abstract: An elastic member is interposed between a reaction disk and a plunger. By moving the plunger to open a poppet seal such that atmospheric air is introduced into the variable pressure chambers, a pressure differential is created between the variable pressure chambers and constant pressure chambers (negative pressure). As a result, servo power is applied to an output rod, and a resulting reaction force is partly transmitted back to an input rod through the reaction disk. During a rapid braking operation, a piston is caused to retract by a pin, thus pushing the elastic member into an outer peripheral groove formed on the piston so that the elastic member is axially compressed. As a result, the movement amount of the plunger can be increased without receiving a reaction force, enabling the rapid development of servo power.

Abstract: In a pneumatic booster, a front shell and a rear shell are connected by means of a rod. A stud bolt on one end of the rod extends through the front shell to the outside, and a support plate fitted around the stud bolt is engaged with the rod and abutted against an inner surface of the front shell. A seal member is provided in an annular groove formed in the support plate. A projection is formed in the support plate. When the support plate is reversely mounted on the stud bolt, the projection is abutted against the front shell, and the seal member is unable to provide a seal between the stud bolt and the front shell. In a leak inspection, air is flowed into a constant-pressure chamber through a cut portion formed in a distal end of the projection, to thereby detect reverse mounting of the support plate.

Abstract: A valve body 2 is connected to a power piston, which divides a housing into a constant pressure chamber (negative pressure) and a variable pressure chamber. In the valve body 2, there is provided a brake assisting mechanism 10 between a reaction disk 3 and a plunger 9. A poppet seal 12 is opened by movement of the plunger 9, to thereby introduce atmospheric air into the variable pressure chamber and generate a thrust force in the power piston. During rapid braking, a plunger rod 23 advances relative to a sleeve 21, and balls 30 shift outward and the plunger rod 23 directly abuts against a reaction rod 22, resulting in contraction of the brake assisting mechanism 10. Therefore, the amount of movement of the plunger 9 can be increased without being affected by a reaction force from the reaction disk 3, thus enabling rapid development of servo power.

Abstract: An elastic member is interposed between a reaction disk and a plunger. By moving the plunger to open a poppet seal such that atmospheric air is introduced into the variable pressure chambers, a pressure differential is created between the variable pressure chambers and constant pressure chambers (negative pressure). As a result, servo power is applied to an output rod, and a resulting reaction force is partly transmitted back to an input rod through the reaction disk. During a rapid braking operation, a piston is caused to retract by a pin, thus pushing the elastic member into an outer peripheral groove formed on the piston so that the elastic member is axially compressed. As a result, the movement amount of the plunger can be increased without receiving a reaction force, enabling the rapid development of servo power.

Abstract: A valve body 2 is connected to a power piston, which divides a housing into a constant pressure chamber (negative pressure) and a variable pressure chamber. In the valve body 2, there is provided a brake assisting mechanism 10 between a reaction disk 3 and a plunger 9. A poppet seal 12 is opened by movement of the plunger 9, to thereby introduce atmospheric air into the variable pressure chamber and generate a thrust force in the power piston. During rapid braking, a plunger rod 23 advances relative to a sleeve 21, and balls 30 shift outward and the plunger rod 23 directly abuts against a reaction rod 22, resulting in contraction of the brake assisting mechanism 10. Therefore, the amount of movement of the plunger 9 can be increased without being affected by a reaction force from the reaction disk 3, thus enabling rapid development of servo power.

Abstract: In a semiconductor device manufacturing method having the etching step of an electrode material film constituting a capacitor using ferroelectric substance or high- dielectric substance, etching of a conductive film that acts as an electrode of the capacitor formed over a semiconductor substrate is carried out in an atmosphere containing bromine, and a heating temperature of the semiconductor substrate is set in a range of 300° C. to 600° C., otherwise etching of at least the conductive film is carried out in an atmosphere to which only hydrogen bromide and oxygen are supplied from an outside.