Abstract: An organic electroluminescent element comprising a light emission layer and a hole blocking layer adjacent to the light emission layer, wherein, (i) the light emission layer contains a compound having a specified partial structure and having a molecular weight of not more than 1700; and (ii) the hole blocking layer contains a derivative selected from the group consisting of a styryl derivative, a boron derivative and a carboline derivative.

Abstract: The present invention pertains to a multilayer flexible wiring board. The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.

Abstract: A board piece 2 of the present invention comprises a non-thermoplastic resin film 11, a thermoplastic resin film 10 formed on the non-thermoplastic resin film 11 and a metal wiring 8 formed on the surface of the thermoplastic resin film 10. Metal wiring 8 is partially exposed on board piece 2 to form a contact 12. A low-melting metal coating 13 is formed on contact 12 and two board pieces 2a, 2b are pressed against each other under heating with contacts 12a, 12b thereof being in contact with each other so that thermoplastic resin films 10a, 10b soften to adhere board pieces 2a, 2b to each other and low-melting metal coatings 13a, 13b melt and then solidify to connect contacts 12a, 12b to each other. The region of metal wiring 8 not used for connection is wiring 17 connecting contacts 12 to each other and a cover film 19 can be provided on the surface thereof. Contacts 12a, 12b can also be connected by applying ultrasonic wave.

Abstract: Disclosed are an organic electroluminescent element comprising a light emission layer containing a phosphorescent compound and a hole transporting layer adjacent thereto containing a hole transporting material, wherein the hole transporting material has a 0-0 band of the phosphorescence spectra of from 300 to 450 nm and has a molecular weight of not less than 550, and an illuminator and a display each comprising the organic electroluminescent element.

Abstract: Disclosed is an organic electroluminescent element comprising an anode, a cathode and a component layer including a light emission layer, the component layer being provided between the anode and the cathode, wherein the component layer contains a compound represented by formula 1,

Abstract: Disclosed is an organic electroluminescent element comprising a component layer including a light emission layer, wherein the light emission layer contains a phosphorescent compound, and the component layer contains a compound represented by the following formula 1,

Abstract: A thermal transfer recording material comprising a support having thereon an image transferring layer containing a coloring material represented by Formula (I), Formula (I): wherein each R11 and R12 is independently a substituted or unsubstituted aliphatic group; R13 is a substituent and n is an integer of 0 to 4, provided that when n is 2 or more, a plurality of R13s are the same or different; R14 is an alkyl group; and each R15 and R16 is independently an alkyl group having 3 to 8 carbon atoms.

Abstract: The present invention pertains to a multilayer flexible wiring board.

Abstract: A board piece 2 of the present invention comprises a non-thermoplastic resin film 11, a thermoplastic resin film 10 formed on the non-thermoplastic resin film 11 and a metal wiring 8 formed on the surface of the thermoplastic resin film 10. Metal wiring 8 is partially exposed on board piece 2 to form a contact 12. A low-melting metal coating 13 is formed on contact 12 and two board pieces 2a, 2b are pressed against each other under heating with contacts 12a, 12b thereof being in contact with each other so that thermoplastic resin films 10a, 10b soften to adhere board pieces 2a, 2b to each other and low-melting metal coatings 13a, 13b melt and then solidify to connect contacts 12a, 12b to each other. The region of metal wiring 8 not used for connection is wiring 17 connecting contacts 12 to each other and a cover film 19 can be provided on the surface thereof. Contacts 12a, 12b can also be connected by applying ultrasonic wave.

Abstract: A board piece 2 of the present invention comprises a non-thermoplastic resin film 11, a thermoplastic resin film 10 formed on the non-thermoplastic resin film 11 and a metal wiring 8 formed on the surface of the thermoplastic resin film 10. Metal wiring 8 is partially exposed on board piece 2 to form a contact 12. A low-melting metal coating 13 is formed on contact 12 and two board pieces 2a, 2b are pressed against each other under heating with contacts 12a, 12b thereof being in contact with each other so that thermoplastic resin films 10a, 10b soften to adhere board pieces 2a, 2b to each other and low-melting metal coatings 13a, 13b melt and then solidify to connect contacts 12a, 12b to each other. The region of metal wiring 8 not used for connection is wiring 17 connecting contacts 12 to each other and a cover film 19 can be provided on the surface thereof. Contacts 12a, 12b can also be connected by applying ultrasonic wave.

Abstract: The present invention pertains to a multilayer flexible wiring board. The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.

Abstract: A thermal transfer recording material comprising a support having thereon an image transferring layer containing a coloring material represented by Formula (I), Formula (I): 1

Abstract: This invention provides a specially-shaped, double-face flexible printed wiring board having a small pitch at a high production yield. Metal wirings 22 and 32 formed on a base film 21, 31 of two elemental pieces 20 and 30 of a flexible printed wiring board are arranged in such a manner as to face each other while sandwiching a bonding film 16 not containing conductive particles between them, and are heat-pressed to each other. The adhesive resin film 16 so softened is pushed aside from the metal wirings 22 and 32 and the low melting point metal coating films 23 and 33 formed on the surface of the metal wirings 22 and 32 come into direct contact with each other and are fused. In this instance, the softened adhesive resin film 16 is charged between the metal wirings 22 and 32. Therefore, the molten low melting point metal does not scatter. The base films 21 and 31 are bonded by the adhesive resin film 16.

Abstract: The present invention aims to manufacture a reliable multilayer flexible wiring board at high yield. Flexible wiring board 10 used for multilayer flexible wiring board 40 of the present invention has metal coating 14 on the surface of metal wiring film 19, and metal coating 14 is exposed within the contact region. A wall member rising above the surface of metal coating 14 is provided around the exposed metal coating 14. The wall member is formed of wall face 23 of opening 17 in resin film 15 at the top of metal wiring film 19, for example. When bump 34 having low-melting metal coating 36 is contacted with metal coating 14 in said contact region and heated above the melting point of the solder metal under pressure, low-melting metal coating 36 melts. The molten low-melting metal is stopped by wall face 23 from overflowing outside the contact region so that any bridge cannot be formed by the solder metal between metal wiring film 19.

Abstract: A dye represented by the following formula (1); Formula (1)  wherein A represents an acidic nucleus, L1, L2 and L3 represent a methine group, n represents 0, 1 or 2, Z represents a nonmetalic atom group necessary to form a heterocyclic group by bonding with a nitrogen atom included in the above formula (1), Y represents a substituent represented by the following formula (2) or a heterocyclic group; Formula (2)  wherein R1 and R2 represent an alkyl group, and R1 and R2 may form a ring by bonding with each other, R3 represents a hydrogen atom or an electron withdrawing group: said dye represented by the above formula (1) has at least one carboxy group or one alkylsulfonamide group in an aromatic ring portion of its molecular structure.

Abstract: This invention is directed to an aqueous colored coating composition which is applied with a spray device having a fine-orifice nozzle(s), the composition comprising a neutralized acrylic copolymer containing an alkoxysilyl group and a carboxyl group and a coloring pigment.

Abstract: A silver halide color photographic light sensitive material is disclosed, comprising a support having thereon a silver halide emulsion layer containing silver halide grains, wherein said silver halide emulsion layer contains a cyan dye forming coupler represented by the following formula (1) or (2), ##STR1##

Abstract: A silver halide photographic light sensitive material comprising a support having thereon a silver halide emulsion layer containing a cyan dye-forming coupler represented by the following formula (I) or (II).

Abstract: A coating composition which consists essentially of:(A) a copolymer comprising 5 to 40 wt. % of an alkoxysilane-containing vinyl monomer which is a compound represented by the formula ##STR1## wherein A is ##STR2## R.sub.1 is a hydrogen atom or methyl group, R.sub.2 is a bivalent aliphatic saturated hydrocarbon group having 1 to 6 carbon atoms, R.sub.3 and R.sub.4 are the same or different and are each a phenyl group, alkyl group having 1 to 6 carbon atoms or alkoxy group having 1 to 10 carbon atoms, R.sub.5 is an alkyl group having 1 to 10 carbon atoms, m is 0 or 1, and n is an integer of 1 to 100, 5 to 50 wt. % of a hydroxyl-containing vinyl monomer and 30 to 70 wt. % of a fluorine-containing vinyl monomer, and (B) an amino resin in an amount of 5 to 50 wt. % based on the total amount of solids in the copolymer (A) and the amino resin (B).

Abstract: The invention provides an automotive top coating composition, comprising as the main components;: (A) an acrylic polymer prepared by copolymerizing 5 to 40% by weight of an alkoxysilane-containing vinyl monomer which is a compound represented by the formula ##STR1## wherein A is ##STR2## R.sub.1 is a hydrogen atom or a methyl group, R.sub.2 is a bivalent aliphatic saturated hydrocarbon group having 1 to 6 carbon atoms, R.sub.3 and R.sub.4 are the same or different and are each a phenyl group, an alkyl group having 1 to 6 carbon atoms or an alkoxy group having 1 to 10 carbon atoms, R.sub.4 is an alkyl group having 1 to 10 carbon atoms, and n is an integer of 1 to 100, 5 to 50% by weight of a hydroxyl-containing vinyl monomer and 10 to 90% by weight of a vinyl monomer which is copolymerizable with the above vinyl monomers, and (B) an amino resin in an amount of 5 to 50% by weight based on the total amount of resin solids in the coating composition.