Patents by Inventor Mitsuhiro HAGIHARA

Mitsuhiro HAGIHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring board and mounting structure using same
    Patent number: 9877387
    Abstract: A wiring board includes: an inorganic insulating layer having a via hole formed so as to penetrate the inorganic insulating layer in a thickness direction thereof; a conductive layer disposed on the inorganic insulating layer; and a via conductor which adheres to an inner wall of the via hole and is connected with the conductive layer. The inorganic insulating layer includes a first section including a plurality of inorganic insulating particles partly connected to each other, and a resin portion located in gaps between the inorganic insulating particles, and a second section which is interposed between the first section and the via conductor, including a plurality of inorganic insulating particles partly connected to each other, and a conducting portion composed of part of the via conductor which is located in gaps between the inorganic insulating particles.
    Type: Grant
    Filed: March 26, 2014
    Date of Patent: January 23, 2018
    Assignee: KYOCERA CORPORATION
    Inventors: Satoshi Kajita, Mitsuhiro Hagihara, Yuuhei Matsumoto
  • WIRING BOARD AND MOUNTING STRUCTURE USING SAME
    Publication number: 20160150642
    Abstract: A wiring board includes: an inorganic insulating layer having a via hole formed so as to penetrate the inorganic insulating layer in a thickness direction thereof; a conductive layer disposed on the inorganic insulating layer; and a via conductor which adheres to an inner wall of the via hole and is connected with the conductive layer. The inorganic insulating layer includes a first section including a plurality of inorganic insulating particles partly connected to each other, and a resin portion located in gaps between the inorganic insulating particles, and a second section which is interposed between the first section and the via conductor, including a plurality of inorganic insulating particles partly connected to each other, and a conducting portion composed of part of the via conductor which is located in gaps between the inorganic insulating particles.
    Type: Application
    Filed: March 26, 2014
    Publication date: May 26, 2016
    Applicant: KYOCERA CORPORATION
    Inventors: Satoshi KAJITA, Mitsuhiro HAGIHARA, Yuuhei MATSUMOTO