Abstract: A substrate processing apparatus, including: a processing chamber having a first and a second processing regions; a substrate mounting table rotatably installed in the processing chamber on which a substrate is mounted, and a rotation instrument configured to rotate the substrate mounting table such that the substrate passes through the first processing region and the second processing region in this order, at least one of the first and the second processing regions including: a gas supply part including a line-shaped opening portion extending in a radial direction of the substrate mounting table and configured to supply a gas from the opening portion into the region; and a gap holding member protruding from a ceiling of the processing chamber opposing the substrate, around the opening portion, toward the substrate such that a space on the substrate has a predetermined gap to serve as a passage of the supplied gas.

Abstract: A substrate processing apparatus, including: a processing chamber having a first and a second processing regions; a substrate mounting table rotatably installed in the processing chamber on which a substrate is mounted, and a rotation instrument configured to rotate the substrate mounting table such that the substrate passes through the first processing region and the second processing region in this order, at least one of the first and the second processing regions including: a gas supply part including a line-shaped opening portion extending in a radial direction of the substrate mounting table and configured to supply a gas from the opening portion into the region; and a gap holding member protruding from a ceiling of the processing chamber opposing the substrate, around the opening portion, toward the substrate such that a space on the substrate has a predetermined gap to serve as a passage of the supplied gas.

Abstract: The sizes required for maintenance are reduced and an occupying floor area is reduced. The substrate processing apparatus contains a load lock chamber 41 and a transfer chamber 24 respectively provided in order from the rear side within a case 11; and a processing chamber 53 provided above the load lock chamber 41 for processing wafers 1. An opening section 27A, and an opening and closing means 28A for opening and closing the opening section 27A are respectively provided in a location at the rear side of the transfer chamber 24 where the load lock chamber 41 is not arranged.

Abstract: An electric circuit includes a delayed clock generation circuit to which a first clock is supplied and which is configured to generate a first delayed clock and a second delayed clock, the first delayed clock being the first clock delayed by a first delay amount, and the second delayed clock being the first clock delayed by a second delay amount different from the first delay amount, an OR gate configured to receive the first clock, the first delayed clock, and the second delayed clock as inputs and to output a second clock, and a scan circuit to which the second clock is supplied.

Abstract: An electric circuit includes a delayed clock generation circuit to which a first clock is supplied and which is configured to generate a first delayed clock and a second delayed clock, the first delayed clock being the first clock delayed by a first delay amount, and the second delayed clock being the first clock delayed by a second delay amount different from the first delay amount, an OR gate configured to receive the first clock, the first delayed clock, and the second delayed clock as inputs and to output a second clock, and a scan circuit to which the second clock is supplied.

Abstract: In a safety stock control system, safety stock is changed in response to updating of a setting value so as to be continuously maintained as a proper value. The safety stock control system is comprised of a demand prediction means, an actual value calculating means, a predicted remainder calculating means, a parameter calculating means, and a safety stock calculating means for calculating safety stock based upon a parameter calculated by the parameter calculating means. In response to updating of the setting value, data of an area, which is different from such a data read when a plan is made, is temporarily read from a data storage means to the respective means, and then, various sorts of calculating process operations are carried out either one time or plural times.

Abstract: An extracting unit extracts unprocessed capturing destination in a circuit. A tracing unit traces an output branch point from a capturing destination and a determining unit determines an estimated failure site and a non-failure site in the circuit. A detecting unit narrows down an estimated failure site using a fail address. It is determined whether an identifying unit has identified a failure site. If the failure site has not been identified, a delay failure simulation is performed and a comparing unit compares the comparison result of the tester measurement and the result in the delay failure simulation to determine consistency between the results. The identifying unit identifies the failure site based on the consistency.

Abstract: The sizes required for maintenance are reduced and an occupying floor area is reduced. The substrate processing apparatus contains a load lock chamber 41 and a transfer chamber 24 respectively provided in order from the rear side within a case 11; and a processing chamber 53 provided above the load lock chamber 41 for processing wafers 1. An opening section 27A, and an opening and closing means 28A for opening and closing the opening section 27A are respectively provided in a location at the rear side of the transfer chamber 24 where the load lock chamber 41 is not arranged.

Abstract: An extracting unit extracts unprocessed capturing destination in a circuit. A tracing unit traces an output branch point from a capturing destination and a determining unit determines an estimated failure site and a non-failure site in the circuit. A detecting unit narrows down an estimated failure site using a fail address. It is determined whether an identifying unit has identified a failure site. If the failure site has not been identified, a delay failure simulation is performed and a comparing unit compares the comparison result of the tester measurement and the result in the delay failure simulation to determine consistency between the results. The identifying unit identifies the failure site based on the consistency.

Abstract: In a safety stock control system, safety stock is changed in response to updating of a setting value so as to be continuously maintained as a proper value. The safety stock control system is comprised of a demand prediction means, an actual value calculating means, a predicted remainder calculating means, a parameter calculating means, and a safety stock calculating means for calculating safety stock based upon a parameter calculated by the parameter calculating means. In response to updating of the setting value, data of an area, which is different from such a data read when a plan is made, is temporarily read from a data storage means to the respective means, and then, various sorts of calculating process operations are carried out either one time or plural times.

Abstract: The present invention discloses a technology for providing a method in on-line shopping and the like that allows products to be delivered efficiently and with no delivery errors to intermediary establishments, e.g., convenience stores, where packages can be picked up at a location other than a user's home address. A computer is set up to mediate delivery and receives a user selection via a network regarding whether a product is to be shipped to the user's home or to another site. If another site is selected, a map of the area showing potential destinations is displayed, and the recipient makes a selection from the map. Special offers available when the package is picked up at a site are also displayed. When the recipient specifies a delivery destination, a coupon containing a recipient authentication certificate and special offers is issued.

Abstract: A substrate processing apparatus comprises a substrate processing chamber for processing a substrate, a load lock chamber, a gas supply line for supplying gas into the load lock chamber, exhaust lines for exhausting the load lock chamber, a moving mechanism provided in the load lock chamber and capable of moving the substrate, local exhaust lines capable of locally exhausting dust generating portions of the moving mechanism, a flow rate controlling device provided in the gas supply line and flow rate controlling devices provided in the local exhaust lines. The flow rates of the flow rate controlling devices are monitored and controlled to control the inside pressure of the load lock chamber to be slightly higher than the atmosphere pressure, thereby preventing the backward flow from the vent line.

Abstract: According to the present invention, a service issuing system 1110 comprises identification number issuing means 1120 for issuing an identification number 1130 required to receive a service in accordance with an application from a user system 1210, encryption means 1150 for encrypting the identification number 1130 and generating encrypted data 1160 by a private key 1140 corresponding to a public key owned by a service provider, and encryption means 1170 for encrypting the encrypted data 1160 and generating encrypted data 1180 by an encryption key 1240 corresponding to a decryption key owned by the user system 1210.

Abstract: A substrate processing apparatus comprises a semiconductor wafer processing chamber, a wafer transfer device, a wafer cassette holding unit, a wafer cassette transfer device and a wafer cassette bringing in/out section disposed in this order and a housing. The wafer cassette holding unit is movable between a wafer processing time position and a maintenance time position thereof and the wafer cassette transfer device is movable between a wafer processing time position and a maintenance time position thereof. The wafer cassette bringing in/out section is capable of rotating forward of the housing, whereby the front face of said housing is opened.

Abstract: A substrate processing apparatus comprises a substrate processing chamber for processing a substrate, a load lock chamber, a gas supply line for supplying gas into the load lock chamber, exhaust lines for exhausting the load lock chamber, a moving mechanism provided in the load lock chamber and capable of moving the substrate, local exhaust lines capable of locally exhausting dust generating portions of the moving mechanism, a flow rate controlling device provided in the gas supply line and flow rate controlling devices provided in the local exhaust lines. The flow rates of the flow rate controlling devices are monitored and controlled to control the inside pressure of the load lock chamber to be slightly higher than the atmosphere pressure, thereby preventing the backward flow from the vent line.

Abstract: A substrate processing apparatus comprises a semiconductor wafer processing chamber, a wafer transfer device, a wafer cassette holding unit, a wafer cassette transfer device and a wafer cassette bringing in/out section disposed in this order and a housing. The wafer cassette holding unit is movable between a wafer processing time position and a maintenance time position thereof and the wafer cassette transfer device is movable between a wafer processing time position and a maintenance time position thereof. The wafer cassette bringing in/out section is capable of rotating forward of the housing, whereby the front face of said housing is opened.

Abstract: A semiconductor manufacturing equipment, which comprises a boat elevator installed below a reaction chamber for loading a boat into the reaction chamber, cassette stocker installed opposite to the boat elevator, a wafer carrier installed between the cassette stocker and the boat elevator and used for transferring wafers between the cassette stocker and the boat, and a load-lock chamber for accommodating the boat elevator, whereby wafers are carried in the atmospheric air within the semiconductor manufacturing equipment, and the transport time is set in such manner that an increase of a natural oxide film formed on the wafers is 2 angstroms or less.

Abstract: A plurality of airtight chambers are connected through blocking means, which can communicate or shut off the chambers, and at least one of the airtight chambers is used as a processing chamber. One of the adjacent airtight chambers is replaced by a replacement gas, and the replacement gas is supplied to the other of the adjacent airtight chambers. When pressure difference or pressure in the two adjacent airtight chambers is below a predetermined value, the adjacent two airtight chambers are communicated, and pressure in the two airtight chambers is equalized.