Patents by Inventor Mitsuhiro Hori

Mitsuhiro Hori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9793456
    Abstract: A molded resin body for surface-mounted light-emitting device has a cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 ?m to 10 ?m, the glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMA) under the conditions of a temperature range of ?50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: October 17, 2017
    Assignee: KANEKA CORPORATION
    Inventors: Tomokazu Tozawa, Takahisa Iwahara, Hiroshi Ogoshi, Kazuhiko Hirabayashi, Shuhei Ozaki, Satoaki Iba, Kazuaki Kanai, Yasushi Kakehashi, Takao Manabe, Mitsuhiro Hori, Ryoichi Narita
  • Publication number: 20150008455
    Abstract: A molded resin body for surface-mounted light-emitting device has cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 ?m to 10 ?m, the glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMS) under the conditions of a temperature range of ?50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more.
    Type: Application
    Filed: September 26, 2012
    Publication date: January 8, 2015
    Applicant: KANEKA CORPORATION
    Inventors: Tomokazu Tozawa, Takahisa Iwahara, Hiroshi Ogoshi, Kazuhiko Hirabayashi, Shuhei Ozaki, Satoaki Iba, Kazuaki Kanai, Yasushi Kakehashi, Takao Manabe, Mitsuhiro Hori, Ryoichi Narita
  • Patent number: 8809458
    Abstract: A polysiloxane composition having high transparency, while being excellent in heat resistance and light resistance is provided. The polysiloxane composition is composed of (A) a polysiloxane which is a polysiloxane compound having a polyhedral skeleton having 6 to 24 silicon atoms in its molecule and which has at least one group containing a hydrolyzable silyl group bonded to a Si atom constituting the polyhedral skeleton, and (B) a photoacid generator. The hydrolyzable silyl group is preferably an alkoxysilyl group.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: August 19, 2014
    Assignee: Kaneka Corporation
    Inventors: Takao Manabe, Satoshi Sugiyama, Makoto Seino, Mitsuhiro Hori
  • Publication number: 20100063221
    Abstract: A polysiloxane composition having high transparency, while being excellent in heat resistance and light resistance is provided. A polysiloxane composition is composed of (A) a polysiloxane which is a polysiloxane compound having a polyhedral skeleton having 6 to 24 silicon atoms in its molecule and which has at least one group containing a hydrolyzable silyl group bonded to a Si atom constituting the polyhedral skeleton, and (B) a photoacid generator. The hydrolyzable silyl group is preferably an alkoxysilyl group.
    Type: Application
    Filed: November 29, 2007
    Publication date: March 11, 2010
    Inventors: Takao Manabe, Satoshi Sugiyama, Makoto Seino, Mitsuhiro Hori