Abstract: The present disclosure relates to a distance measurement apparatus and a biometric authentication apparatus that are capable of conducting high-precise distance measurement even in intense light such as sunlight. A light source applies light to a subject. An image sensor captures an image of the subject. A distance measurement section calculates a distance to the subject on the basis of the image obtained by the image capturing. A transparent member is formed, on the image sensor, so as to be integrated with the image sensor. In addition, the transparent member includes a transmission film that allows a peak wavelength band of the light of the light source to transmit therethrough. The present disclosure is applicable to a biometric authentication apparatus, for example.

Abstract: A solid-state imaging device includes a dielectric substrate, a solid-state imaging element disposed on the dielectric substrate, and including a photosensitive unit at a portion of a front surface thereof, an adhesive between the dielectric substrate and the solid-state imaging element, connection conductors, a sealant, and an upper package part. The solid-state imaging element includes a photosensitive unit at a portion of a front surface thereof, and is bonded to the dielectric substrate by the adhesive such that the adhesive is in contact with a portion of a rear surface of the solid-state imaging element so as to permit air flow along other portions of the rear surface of the solid-state image element. The connection conductors electrically connect the solid-state imaging element and the dielectric substrate. The upper package part is provided on the front surface of the solid-state imaging element so as to hermetically seal the photosensitive unit.

Abstract: A solid-state imaging device includes a dielectric substrate, a solid-state imaging element disposed on the dielectric substrate, and including a photosensitive unit at a portion of a front surface thereof, an adhesive between the dielectric substrate and the solid-state imaging element, connection conductors, a sealant, and an upper package part. The solid-state imaging element includes a photosensitive unit at a portion of a front surface thereof, and is bonded to the dielectric substrate by the adhesive such that the adhesive is in contact with a portion of a rear surface of the solid-state imaging element so as to permit air flow along other portions of the rear surface of the solid-state image element. The connection conductors electrically connect the solid-state imaging element and the dielectric substrate. The upper package part is provided on the front surface of the solid-state imaging element so as to hermetically seal the photosensitive unit.

Abstract: An optical disc device includes a conductive member of a bezel assembly with openings formed by a plurality of parting lines, and gaskets are attached to the upper and lower sides of the conductive member using conductive adhesion bond.

Abstract: An optical disc device includes a conductive member of a bezel assembly with openings formed by a plurality of parting lines, and gaskets are attached to the upper and lower sides of the conductive member using conductive adhesion bond.