Abstract: Provided is a double-sided pressure-sensitive adhesive tape excellent in impact-absorbing property in the entirety of a wide temperature range, in particular, in a low-temperature region. The double-sided pressure-sensitive adhesive tape of the present invention includes: a base material layer; and pressure-sensitive adhesive layers arranged on both surface sides of the base material layer, wherein an entirety of the double-sided pressure-sensitive adhesive tape has a storage modulus of elasticity E? in a range of from 1.0×105 Pa to 1.0×108 Pa, which is measured at from ?25° C. to 120° C. and a frequency of 1 Hz.

Abstract: Provided is a double-sided pressure-sensitive adhesive tape excellent in impact-absorbing property in the entirety of a wide temperature range, in particular, in a low-temperature region. The double-sided pressure-sensitive adhesive tape of the present invention includes: a base material layer; and pressure-sensitive adhesive layers arranged on both surface sides of the base material layer, wherein an entirety of the double-sided pressure-sensitive adhesive tape has a storage modulus of elasticity E' in a range of from 1.0×105 Pa to 1.0×108 Pa, which is measured at from -25° C. to 120° C. and a frequency of 1 Hz.

Abstract: Provided is an adsorption temporary fixing sheet having a sufficient shear adhesive strength in a direction parallel to its surface, and having a weak adhesive strength in a direction vertical to the surface. Also provided is a method of producing such adsorption temporary fixing sheet. The adsorption temporary fixing sheet includes a foam layer including an open-cell structure, wherein, when a silicon chip vertical adhesive strength of a surface of the foam layer after 20 hours at each of such different temperatures as ?40° C., 23° C., or 125° C. is represented by V1 (N/1 cm?), V2 (N/1 cm?), or V3 (N/1 cm?) and when a silicon chip shearing adhesive strength of the surface of the foam layer after 20 hours at each of the different temperatures (?40° C., 23° C., or 125° C.) is represented by H1 (N/1 cm?), H2 (N/1 cm?), or H3 (N/1 cm?), relationships of V1<H1, V2<H2, and V3<H3 are satisfied.

Abstract: Provided is an adsorption temporary fixing sheet having a sufficient shear adhesive strength in a direction parallel to its surface, having a weak adhesive strength in a direction vertical to the surface, and having excellent antistatic performance. The adsorption temporary fixing sheet includes a foam layer including an open-cell structure, and has a surface resistivity of from 1.0×104 to 1.0×1010?/?, wherein, when a silicon chip vertical adhesive strength of a surface of the foam layer after 18 hours at each of such different temperatures as ?30° C., 23° C., or 80° C. is represented by V1, V2, or V3 (N/1 cm2), and when a silicon chip shearing adhesive strength of the surface of the foam layer after 18 hours at each of such different temperatures as ?30° C., 23° C., or 80° C. is represented by H1, H2, or H3 (N/1 cm?), relationships of V1<H1, V2<H2, and V3<H3 are satisfied.

Abstract: Provided is a method of manufacturing an element-mounted substrate having mounted thereon elements with high positional accuracy. The method of manufacturing an element-mounted substrate of the present invention is a method of manufacturing an element-mounted substrate having elements mounted on a substrate, the method including: a step (I) of preparing a temporary fixing material with elements having arrayed thereon the elements by holding one surface of each of the elements on a temporary fixing material; a step (II) of arranging the temporary fixing material with elements on the substrate so that another surface of each of the elements adheres onto the substrate; and a step (III) of peeling the temporary fixing material from the elements adhering onto the substrate.

Abstract: Provided is an adsorption temporary fixing sheet having a sufficient shear adhesive strength in a direction parallel to its surface, having a weak adhesive strength in a direction vertical to the surface, and having excellent antistatic performance. The adsorption temporary fixing sheet includes a foam layer including an open-cell structure, and has a surface resistivity of from 1.0×104 to 1.0×1010?/?, wherein, when a silicon chip vertical adhesive strength of a surface of the foam layer after 18 hours at each of such different temperatures as ?30° C., 23° C., or 80° C. is represented by V1, V2, or V3 (N/1 cm?), and when a silicon chip shearing adhesive strength of the surface of the foam layer after 18 hours at each of such different temperatures as ?30° C., 23° C., or 80° C. is represented by H1, H2, or H3 (N/1 cm?), relationships of V1<H1, V2<H2, and V3<H3 are satisfied.

Abstract: Provided is a temporary fixing sheet including a silicone foam layer and having excellent antistatic performance and a satisfactory appearance. A temporary fixing sheet includes a silicone foam layer, wherein the silicone foam layer is formed of a silicone resin composition including: an organopolysiloxane having at least two alkenyl groups in a molecule thereof; an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule thereof; a mixture including water and an inorganic thickener; 0.2 part by weight to 1.2 parts by weight of a nonionic surfactant having an HLB value of 3 or more with respect to 1 part by weight of a component; 0.01 part by weight to 0.14 part by weight of a nonionic surfactant having an HLB value of less than 3 with respect to 1 part by weight of the component; a hydrosilylation reaction catalyst; a curing retarder; and a conductive substance.

Abstract: Provided is an adsorption temporary fixing sheet having a sufficient shear adhesive strength in a direction parallel to its surface, and having a weak adhesive strength in a direction vertical to the surface. Also provided is a method of producing such adsorption temporary fixing sheet. The adsorption temporary fixing sheet includes a foam layer including an open-cell structure, wherein, when a silicon chip vertical adhesive strength of a surface of the foam layer after 20 hours at each of such different temperatures as ?40° C., 23° C., or 125° C. is represented by V1 (N/1 cm?), V2 (N/1 cm?), or V3 (N/1 cm?) and when a silicon chip shearing adhesive strength of the surface of the foam layer after 20 hours at each of the different temperatures (?40° C., 23° C., or 125° C.) is represented by H1 (N/1 cm?), H2 (N/1 cm?), or H3 (N/1 cm?), relationships of V1<H1, V2<H2, and V3<H3 are satisfied.

Abstract: A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a substrate layer configured to support the pressure-sensitive adhesive agent layer. The pressure-sensitive adhesive layer has a storage modulus of 250 kPa or less at 23° C. The substrate layer has an elastic modulus of 1680 N/cm to 3000 N/cm both inclusive. The pressure-sensitive adhesive sheet shows a deviation amount less than 1.0 mm. The amount is the deviation amount of the pressure-sensitive adhesive sheet per 250 gf/cm2 of the sheet in a holding ability test at 80° C. after one hour from a time when the test is started.

Abstract: Provided is a conductive pressure-sensitive adhesive tape that achieves both strong adhesion to an adherend and a reworking property. A conductive pressure-sensitive adhesive tape (1) includes a pressure-sensitive adhesive layer (2) containing a pressure-sensitive adhesive resin containing a pressure-sensitive adhesive polymer and conductive particles (4) dispersed in the pressure-sensitive adhesive resin, in which: the pressure-sensitive adhesive layer (2) has a surface layer (22) that is formed of the pressure-sensitive adhesive resin and that forms a surface of the pressure-sensitive adhesive layer; and a thickness of the surface layer (22) includes an analysis depth from the surface of the pressure-sensitive adhesive layer when a spectral intensity derived from the conductive particles in glow discharge spectrometry becomes one half of a maximum thereof, and is 0.1 ?m or more and 0.9 ?m or less.

Abstract: Provided is a filler-containing pressure-sensitive adhesive tape having an excellent pressure-sensitive adhesive strength while suppressing the occurrence of a volatile component. The filler-containing pressure-sensitive adhesive tape includes a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive resin containing an acrylic polymer and a filler dispersed in the pressure-sensitive adhesive resin, in which the acrylic polymer contains at least a constituent unit derived from a (meth)acrylic acid alkyl ester having a linear or branched alkyl group having 1 to 20 carbon atoms, a constituent unit derived from a nitrogen-containing monomer, and a constituent unit derived from a carboxyl group-containing monomer, and has a ratio (mass ratio) of the constituent unit derived from the carboxyl group-containing monomer to the constituent unit derived from the nitrogen-containing monomer of from 0.01 to 40.

Abstract: A magnetic disk drive includes a base having an opening, a cover configured to close the opening of the base, and a pressure-sensitive adhesive sheet configured to seal a gap between the base and the cover. The pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer, and a substrate layer configured to support the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer has a storage modulus of 250 kPa or less at 23° C. The substrate layer has an elastic modulus of 1,680 N/cm to 3,000 N/cm. The pressure-sensitive adhesive sheet shows a deviation amount less than 1.0 mm, the amount being the deviation amount of the pressure-sensitive adhesive sheet per 250 gf/cm2 of the sheet in a holding ability test at 80° C. after one hour from a time when the holding ability test is started. Helium gas is accommodated in a cavity defined by the base and the cover.

Abstract: A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a substrate layer configured to support the pressure-sensitive adhesive agent layer. The pressure-sensitive adhesive layer has a storage modulus of 250 kPa or less at 23° C. The substrate layer has an elastic modulus of 1680 N/cm to 3000 N/cm both inclusive. The pressure-sensitive adhesive sheet shows a deviation amount less than 1.0 mm The amount is the deviation amount of the pressure-sensitive adhesive sheet per 250 gf/cm2 of the sheet in a holding ability test at 80° C. after one hour from a time when the test is started.

Abstract: A resin foam has a thickness recovery rate (23° C., one minute, 50% compression) of 70% or more and a strain recovery rate (80° C., 24 hours, 50% compression) of 80% or more. The thickness recovery rate is determined by compressing the resin foam, holding the resin foam in the compressed state, decompressing the resin foam, measuring a thickness of the resin foam one second after the decompression, and calculating a percentage of the measured thickness with respect to the initial thickness as the thickness recovery rate. The strain recovery rate is determined by compressing the resin foam, holding the resin foam in the compressed state, returning the resin foam to 23° C. while maintaining the compressed state, decompressing the resin foam, and determining a percentage of a recovered distance with respect to a compressed distance as the strain recovery rate.

Abstract: Provided is a resin foam that is satisfactorily flexible and highly resistant to heat, exhibits superior strain recoverability at high temperatures, and has a high instantaneous recovery rate. This resin foam is formed from a resin composition containing an acrylic polymer, an active-energy-ray-curable compound having two (meth)acryloyl groups per molecule, an active-energy-ray-curable compound having three or more (meth)acryloyl groups per molecule, and a thermal crosslinking agent. The active-energy-ray-curable compound having two (meth)acryloyl groups per molecule and the active-energy-ray-curable compound having three or more (meth)acryloyl groups per molecule are preferably contained in a total content of from 20 to 150 parts by weight per 100 parts by weight of the acrylic polymer.

Abstract: Provided is a resin foam which has satisfactory strain recovery, is particularly resistant to shrinkage of its cell structure caused by the resinous restitutive force at high temperatures, and exhibits superior high-temperature strain recovery. The resin foam according to the present invention is obtained from a resin composition including an elastomer and an active-energy-ray-curable compound. The resin composition gives an unfoamed measurement sample having a glass transition temperature of 30° C. or lower and a storage elastic modulus (E?) at 20° C. of 1.0×107 Pa or more, each determined by a dynamic viscoelastic measurement.

Abstract: Disclosed is a thermoplastic resin foam which is obtained by subjecting a thermoplastic resin composition containing a thermoplastic elastomer and an active-energy-ray-curable resin to foam molding to give a foamed structure, and irradiating the foamed structure with an active energy ray to allow the active-energy-ray-curable resin to form a cross-linked structure in the foamed structure. Also disclosed is a thermoplastic resin foam which is obtained by subjecting a thermoplastic resin composition containing a thermoplastic elastomer, an active-energy-ray-curable resin, and a thermal cross-linking agent to foam molding to give a foamed structure, irradiating the foamed structure with an active energy ray to allow the active-energy-ray-curable resin to form a cross-linked structure in the foamed structure, and heating the resulting foamed structure bearing the cross-linked structure to thereby allow the thermal cross-linking agent to form another cross-linked structure in the foamed structure.

Abstract: The present invention provides a process for producing a thermoplastic resin foam excellent in strength, flexibility, cushioning properties, strain recovery, and appearance, and exhibiting little shrinkage of the cell structure under a high temperature condition and a high expansion ratio. The process includes a foamed structure formation step of foam molding a thermoplastic resin composition containing a thermoplastic elastomer and an active energy-ray curable compound to thereby obtain a foamed structure; a foamed structure conveyance step of continuously conveying the foamed structure by a carrier sheet having a surface roughness (Ra) of 1 ?m or larger and a tensile break strength of 30 N/15 mm or higher, after the foamed structure formation step; and an active energy-ray irradiation step of irradiating the foamed structure with an active energy ray to thereby form a crosslinked structure by the active energy-ray curable compound in the foamed structure.

Abstract: There is provided a thermoplastic resin foam being excellent in strength, flexibility, cushioning properties, strain recovery and the like, particularly being low in the shrinkage of the cell structure due to the resilience of the resin, and being good in productivity. There is also provided a process for producing a thermoplastic resin foam which can produce, with good productivity, the thermoplastic resin foam being excellent in strength, flexibility, cushioning properties, strain recovery and the like, particularly being low in the shrinkage of the cell structure due to the resilience of the resin. The thermoplastic resin foam according to the present invention is obtained from a thermoplastic resin composition containing a thermoplastic elastomer, an active energy-ray curable compound and a radical trapping agent.

Abstract: Disclosed is a resin foam which excels in properties such as strength, flexibility, cushioning properties, and strain recovery, particularly has a cell structure resistant to shrinkage caused by the restoring force of the resin, and has a high expansion ratio. The cross-linked resin foam is obtained by heating a resin composition containing an elastomer, an active-energy-ray-curable compound, and a thermal crosslinking agent to form a cross-linked structure derived from the thermal crosslinking agent in the resin composition; subjecting the cross-linked-structure-containing resin composition to foam molding to give a foamed structure; and irradiating the foamed structure with an active energy ray to form another cross-linked structure derived from the active-energy-ray-curable compound to give the cross-linked resin foam.