Abstract: A valve spring includes a nitrided layer, and a core portion that is further inward than the nitrided layer. A chemical composition of the core portion consists of, in mass %, C: 0.53 to 0.59%, Si: 2.51 to 2.90%, Mn: 0.70 to 0.85%, P: 0.020% or less, S: 0.020% or less, Cr: 1.40 to 1.70%, Mo: 0.17 to 0.53%, V: 0.23 to 0.33%, Ca: 0.0001 to 0.0050%, Cu: 0.050% or less, Ni: 0.050% or less, Al: 0.0050% or less, Ti: 0.050% or less, and N: 0.0070% or less, with the balance being Fe and impurities. In the core portion, a number density of V-based precipitates having a maximum diameter ranging from 2 to 10 nm is 500 to 8000 per ?m2, and in the core portion, a numerical proportion of Ca sulfides with respect to a total number of oxide-based inclusions and sulfide-based inclusions is 0.20% or less.

Abstract: A damper spring having an excellent fatigue limit is provided. A damper spring according to the present embodiment includes a nitrided layer formed in an outer layer, and a core portion that is further inward than the nitrided layer. The chemical composition of the core portion consists of, in mass%, C: 0.53 to 0.59%, Si: 2.51 to 2.90%, Mn: 0.70 to 0.85%, P: 0.020% or less, 5: 0.020% or less, Cr: 1.40 to 1.70%, Mo: 0.17 to 0.53%, V: 0.23 to 0.33%, Cu: 0.050% or less, Ni: 0.050% or less, Al: 0.0050% or less, Ti: 0.050% or less, N: 0.0070% or less, and Nb: 0 to 0.020%, with the balance being Fe and impurities. In the core portion, a number density of V-based precipitates having a maximum diameter ranging from 2 to 10 nm is 500 to 8000 pieces/?m2.

Abstract: A switch device includes a panel housing a knob, the panel having a wall face around the knob. In at least one of outside faces of the knob, the outside faces opposing the wall face and another member adjacent to the knob, the outside face has a base part formed on an upper side thereof and a recess part formed in a lower side thereof. The recess part extends to a lower end of the outside face. The base part has an obliquely downwardly inclined parts formed on a lower edge part thereof. Accordingly, the device can ensure stable operation of the knob by discharging, from a gap between the panel and the knob, liquid that has entered the gap.

Abstract: In a switch device, a switch part is turned ON/OFF by operation of an operating knob housed in a recessed part of a panel so that a movable terminal and a fixed terminal are in contact or are separated. An outside face, opposing an inner peripheral face of the recessed part of the panel, of the operating knob is an inclined face that is inclined inward of the operating knob in going downward. A gap that widens in going downward is formed between the outside face of the operating knob and the inner peripheral face of the recessed part of the panel. Accordingly, the device can ensure stable operation of the operating knob by discharging, from the gap between the panel and the operating knob, liquid that has entered the gap, and that can improve the appearance.

Abstract: A switch device includes a panel housing a knob, the panel having a wall face around the knob. In at least one of outside faces of the knob, the outside faces opposing the wall face and another member adjacent to the knob, the outside face has a base part formed on an upper side thereof and a recess part formed in a lower side thereof. The recess part extends to a lower end of the outside face. The base part has an obliquely downwardly inclined parts formed on a lower edge part thereof. Accordingly, the device can ensure stable operation of the knob by discharging, from a gap between the panel and the knob, liquid that has entered the gap.

Abstract: In a switch device, a switch part is turned ON/OFF by operation of an operating knob housed in a recessed part of a panel so that a movable terminal and a fixed terminal are in contact or are separated. An outside face, opposing an inner peripheral face of the recessed part of the panel, of the operating knob is an inclined face that is inclined inward of the operating knob in going downward. A gap that widens in going downward is formed between the outside face of the operating knob and the inner peripheral face of the recessed part of the panel. Accordingly, the device can ensure stable operation of the operating knob by discharging, from the gap between the panel and the operating knob, liquid that has entered the gap, and that can improve the appearance.

Abstract: The probe unit includes probe groups of two or more contact probes to be in contact with one electrode of a contact target body on a side of one end in a longitudinal direction and the respective contact probes are to be in contact with separate electrodes of a board on a side of another end. The contact probe includes an end portion arranged on the side of one end, having nail portions in a tapered end shape, and brought into contact with the one electrode at the nail portions; a second contact unit arranged on the side of another end, and to be in contact with a corresponding electrode of the board; and a coil spring arranged between the end portion and the second contact unit, and biasing the end portion and the second contact unit.

Abstract: The probe unit includes probe groups of two or more contact probes to be in contact with one electrode of a contact target body on a side of one end in a longitudinal direction and the respective contact probes are to be in contact with separate electrodes of a board on a side of another end. The contact probe includes an end portion arranged on the side of one end, having nail portions in a tapered end shape, and brought into contact with the one electrode at the nail portions; a second contact unit arranged on the side of another end, and to be in contact with a corresponding electrode of the board; and a coil spring arranged between the end portion and the second contact unit, and biasing the end portion and the second contact unit.

Abstract: A probe-unit base member having high rigidity and requiring no troublesome operations for its manufacture and a probe unit are provided. To achieve the purpose, the probe-unit base member includes a conductive substrate 41 that has a first opening 41a capable of fitting therein a probe holder 3 and a second opening 41b communicated with the first opening 41a; a coating 42 that is made of an insulating adhesive agent and is coated at least on an edge of the second opening 41b; and an insulating guide member 43 that is bonded to the edge of the second opening 41b through the coating 42 and guides one of two contact bodies to a position in contact with probes 2.

Abstract: Provided are a conductive contact holder and a conductive contact unit that enable a test to be performed in a precise temperature environment. For this objective, a construction includes a holder substrate that individually receives plural conductive contacts, and a floating member attached to the holder substrate such that a distance from a surface of the holder substrate is varied within a predetermined range by an external force. The floating member has plural hole sections into which a front end section of each of the conductive contacts received in the holder substrate is inserted. A gap between the holder substrate and the floating member forms at least a part of a passage of fluid introduced from outside of the conductive contact holder.

Abstract: A probe-unit base member having high rigidity and requiring no troublesome operations for its manufacture and a probe unit are provided. To achieve the purpose, the probe-unit base member includes a conductive substrate 41 that has a first opening 41a capable of fitting therein a probe holder 3 and a second opening 41b communicated with the first opening 41a; a coating 42 that is made of an insulating adhesive agent and is coated at least on an edge of the second opening 41b; and an insulating guide member 43 that is bonded to the edge of the second opening 41b through the coating 42 and guides one of two contact bodies to a position in contact with probes 2.

Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Abstract: Provided are a conductive contact holder and a conductive contact unit that enable a test to be performed in a precise temperature environment. For this objective, a construction includes a holder substrate that individually receives plural conductive contacts, and a floating member attached to the holder substrate such that a distance from a surface of the holder substrate is varied within a predetermined range by an external force. The floating member has plural hole sections into which a front end section of each of the conductive contacts received in the holder substrate is inserted. A gap between the holder substrate the floating member at least a part of a passage of fluid introduced from outside of the conductive contact holder.

Abstract: In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon another. The first conductive layer (11) is constituted as a parts connecting layer and the n-th conductive layer (13) is constituted as an external connecting layer which is connected to external connecting terminals (7). The second to (n?1)-th conductive layers (12) are constituted as current transmitting layers for transmitting internal currents. The surface of the n-th conductive layer (13) is coated with the outermost n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to constitute the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.

Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Abstract: A method of producing a printed wiring board comprising innerlayer conductor circuits among insulating layers and blind via-holes formed by irradiating laser beams from the outermost surface of the insulating layer toward the innerlayer conductor circuit. A central portion of the innerlayer conductor circuit contains a previously formed opening hole located at the bottom of the blind via-hole. Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits and the blind via-holes.

Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Abstract: In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive layer (13) is an external connecting layer which is connected to external connecting terminals (7). The second to (n?1)-th conductive layers (12) are current transmitting layers for transmitting internal currents. The surface of the n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to make the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.

Abstract: In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon another. The first conductive layer (11) is constituted as a parts connecting layer and the n-th conductive layer (13) is constituted as an external connecting layer which is connected to external connecting terminals (7). The second to (n?1)-th conductive layers (12) are constituted as current transmitting layers for transmitting internal currents. The surface of the n-th conductive layer (13) is coated with the outermost n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to constitute the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.

Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.