Patents by Inventor Mitsuhiro KURIHARA

Mitsuhiro KURIHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240131750
    Abstract: Provided are a granulating device die, a granulating device cutter blade holder, a granulating device cutter blade unit, a resin-cutting device, and a granulating device, in all of which an increase in size is suppressed even when the processing amount is increased. The die (10) includes a bottom surface (10B), an upper surface (10A) having a radius smaller than a radius of the bottom surface (10B), a side surface (10C) that connects an outermost peripheral portion of the bottom surface (10B) and an outermost peripheral portion of the upper surface (10A), and a plurality of die holes (11) that discharge a resin raw material, the die holes being defined in the side surface (10C).
    Type: Application
    Filed: September 14, 2021
    Publication date: April 25, 2024
    Inventors: Mitsuhiro SEO, Masao KURIHARA
  • Patent number: 11529581
    Abstract: A negative pressure-side flow path having a negative pressure-side filter and a positive pressure-side flow path having a positive pressure-side filter are connected in parallel between a first port and a second port, and a shuttle valve is installed between the negative pressure-side flow path and the positive pressure-side flow path, and the first port, thus when a negative pressure is supplied to the first port, the first port is caused to communicate with the second port through the negative pressure-side flow path, and when a positive pressure is supplied to the first port, the first port is caused to communicate with the second port through the positive pressure-side flow path.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: December 20, 2022
    Assignee: SMC CORPORATION
    Inventors: Mitsuhiro Kurihara, Kenji Fukushima
  • Publication number: 20210023496
    Abstract: A negative pressure-side flow path having a negative pressure-side filter and a positive pressure-side flow path having a positive pressure-side filter are connected in parallel between a first port and a second port, and a shuttle valve is installed between the negative pressure-side flow path and the positive pressure-side flow path, and the first port, thus when a negative pressure is supplied to the first port, the first port is caused to communicate with the second port through the negative pressure-side flow path, and when a positive pressure is supplied to the first port, the first port is caused to communicate with the second port through the positive pressure-side flow path.
    Type: Application
    Filed: July 20, 2020
    Publication date: January 28, 2021
    Applicant: SMC CORPORATION
    Inventors: Mitsuhiro KURIHARA, Kenji FUKUSHIMA