Abstract: A heating and cooling device including: an airtight processing chamber openable to load a member-to-be-processed in the airtight processing chamber; a transfer apparatus to adjust a distance between the member-to-be-processed and a cooling unit that cools the member-to-be-processed, by moving the member-to-be-processed and/or the cooling unit; an induction heating apparatus to heat the member-to-be-processed, including a induction heating coil; a cooling apparatus to cool the member-to-be-processed by cooling the cooling unit; a temperature sensor to determine a temperature of the member-to-be-processed; and a controller to control the induction heating apparatus and the cooling apparatus based on the temperature determined by the temperature sensor.

Abstract: A heating and cooling device including: an airtight processing chamber openable to load a member-to-be-processed in the airtight processing chamber; a transfer apparatus to adjust a distance between the member-to-be-processed and a cooling unit that cools the member-to-be-processed, by moving the member-to-be-processed and/or the cooling unit; an induction heating apparatus to heat the member-to-be-processed, including a induction heating coil; a cooling apparatus to cool the member-to-be-processed by cooling the cooling unit; a temperature sensor to determine a temperature of the member-to-be-processed; and a controller to control the induction heating apparatus and the cooling apparatus based on the temperature determined by the temperature sensor.

Abstract: An apparatus for manufacturing a thin-film laminated member by laminating a plurality of thin films on the surface of a band-shaped flexible substrate includes a substrate conveying device for conveying the band-shaped flexible substrate in the horizontal direction with the widthwise direction of the band-shaped flexible substrate oriented in the vertical direction. A plurality of film forming chambers are arranged in succession along the direction in which the band-shaped flexible substrate is conveyed for forming films on the surface of the band-shaped flexible substrate. A pair of upper grip rollers are arranged between the plurality of film forming chambers for pinching an upper edge portion of the band-shaped flexible substrate while the band-shaped flexible substrate is being conveyed. A method thereof includes pinching the upper edge portion of the band-shaped flexible substrate with the pairs of upper grip rollers.