Patents by Inventor Mitsuhiro Ookubo

Mitsuhiro Ookubo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9005521
    Abstract: The distribution of Ni—Si compound grains is controlled to thereby improve the properties of Corson alloys. The copper alloy for electronic materials comprises 0.4 to 6.0% mass of Ni and 0.1 to 1.4% by mass of Si, with the balance being Cu and unavoidable impurities. The copper alloy comprising: small particles of Ni—Si compound having a particle size of equal to or greater than 0.01 ?m and smaller than 0.3 ?m; and large particles of Ni—Si compound having a particle size of equal to of greater than 0.3 ?m and smaller than 1.5 ?m. The number density of the small particles is 1 to 2000 pieces/?m2 and the number density of the large particles is 0.05 to 2 pieces/?m2.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: April 14, 2015
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Mitsuhiro Ookubo
  • Publication number: 20130014861
    Abstract: The distribution of Ni—Si compound grains is controlled to thereby improve the properties of Corson alloys. The copper alloy for electronic materials comprises 0.4 to 6.0% mass of Ni and 0.1 to 1.4% by mass of Si, with the balance being Cu and unavoidable impurities. The copper alloy comprising: small particles of Ni—Si compound having a particle size of equal to or greater than 0.01 ?m and smaller than 0.3 ?m; and large particles of Ni—Si compound having a particle size of equal to of greater than 0.3 ?m and smaller than 1.5 ?m. The number density of the small particles is 1 to 2000 pieces/?m2 and the number density of the large particles is 0.05 to 2 pieces/?m2.
    Type: Application
    Filed: April 2, 2010
    Publication date: January 17, 2013
    Applicant: JX Nippon Mining & Metal Corporation
    Inventor: Mitsuhiro Ookubo