Patents by Inventor Mitsuhiro Otagiri

Mitsuhiro Otagiri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device package, method of manufacturing the same, and semiconductor device
    Patent number: 7453141
    Abstract: A semiconductor device package is provided which can achieve speeding-up thereof. The semiconductor device package includes: a board which has at least one of a ground plane and a power plane; at least one connecting conductor portion which is formed on an inner wall surface of an opening portion of the board and electrically connected to the corresponding plane; at least one bonding pattern which is formed on a front surface layer portion of the board in the vicinity of an edge of the opening portion, and connected to the corresponding connecting conductor portion; and a second external connection portion which is formed on the side of the front surface layer of the board, and electrically connected to the corresponding plane, respectively, through a through-hole conductor portion formed in the board.
    Type: Grant
    Filed: February 15, 2006
    Date of Patent: November 18, 2008
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Hiroshi Miyagawa, Mitsuhiro Otagiri
  • Semiconductor device package, method of manufacturing the same, and semiconductor device
    Publication number: 20060189178
    Abstract: A semiconductor device package is provided which can achieve speeding-up thereof. The semiconductor device package includes: a board which has at least one of a ground plane and a power plane; at least one connecting conductor portion which is formed on an inner wall surface of an opening portion of the board and electrically connected to the corresponding plane; at least one bonding pattern which is formed on a front surface layer portion of the board in the vicinity of an edge of the opening portion, and connected to the corresponding connecting conductor portion; and a second external connection portion which is formed on the side of the front surface layer of the board, and electrically connected to the corresponding plane, respectively, through a through-hole conductor portion formed in the board.
    Type: Application
    Filed: February 15, 2006
    Publication date: August 24, 2006
    Applicant: Shinko Electric Industries Co., Ltd.
    Inventors: Hiroshi Miyagawa, Mitsuhiro Otagiri